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Class Information
Number: 257/798
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Miscellaneous
Description: Subject matter wherein the subject matter is not otherwise provided for.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7453162 |
Systems and methods for performing quantum computations |
Nov. 18, 2008 |
| 7453159 |
Semiconductor chip having bond pads |
Nov. 18, 2008 |
| 7436076 |
Micromechanical component having an anodically bonded cap and a manufacturing method |
Oct. 14, 2008 |
| 7436075 |
Ion beam irradiation apparatus and ion beam irradiation method |
Oct. 14, 2008 |
| 7432526 |
Surface-passivated zinc-oxide based sensor |
Oct. 7, 2008 |
| 7429497 |
Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication therefor |
Sep. 30, 2008 |
| 7414324 |
Wafer structure with mirror shot |
Aug. 19, 2008 |
| 7414437 |
Nanomechanical computer |
Aug. 19, 2008 |
| 7402770 |
Nano structure electrode design |
Jul. 22, 2008 |
| 7390427 |
Hydrofluoroether as a heat-transfer fluid |
Jun. 24, 2008 |
| 7368385 |
Method for producing a structure on the surface of a substrate |
May. 6, 2008 |
| 7368788 |
SRAM cells having inverters and access transistors therein with vertical fin-shaped active regions |
May. 6, 2008 |
| 7358619 |
Tape carrier for TAB |
Apr. 15, 2008 |
| 7342318 |
Semiconductor package free of substrate and fabrication method thereof |
Mar. 11, 2008 |
| 7291931 |
Semiconductor device, semiconductor substrate and fabrication process of a semiconductor device |
Nov. 6, 2007 |
| 7250644 |
Electronic device and method for designing the same |
Jul. 31, 2007 |
| 7224884 |
Design method for a video signal processing integrated circuit and integrated circuit and video signal processing apparatus thereby |
May. 29, 2007 |
| 7220975 |
Mask-making member and its production method, mask and its making method, exposure process, and fabrication method of semiconductor device |
May. 22, 2007 |
| 7205658 |
Singulation method used in leadless packaging process |
Apr. 17, 2007 |
| 7200924 |
Method of packaging electronic parts |
Apr. 10, 2007 |
| 7199394 |
Polymer memory device with variable period of retention time |
Apr. 3, 2007 |
| 7187059 |
Compressive SiGe <110> growth and structure of MOSFET devices |
Mar. 6, 2007 |
| 7183131 |
Process for producing a nanoelement arrangement, and nanoelement arrangement |
Feb. 27, 2007 |
| 7180109 |
Field effect transistor and method of fabrication |
Feb. 20, 2007 |
| 7175970 |
Mechanically robust interconnect for low-k dielectric material using post treatment |
Feb. 13, 2007 |
| 7170190 |
Apparatus for oscillating a head and methods for implementing the same |
Jan. 30, 2007 |
| 7157782 |
Electrically-programmable transistor antifuses |
Jan. 2, 2007 |
| 7148578 |
Semiconductor multi-chip package |
Dec. 12, 2006 |
| 7141856 |
Multi-structured Si-fin |
Nov. 28, 2006 |
| 7138726 |
Protective interleaf for stacked wafer shipping |
Nov. 21, 2006 |
| 7132736 |
Devices having compliant wafer-level packages with pillars and methods of fabrication |
Nov. 7, 2006 |
| 7128133 |
Hydrofluoroether as a heat-transfer fluid |
Oct. 31, 2006 |
| 7126232 |
Defect repair apparatus for an electronic device |
Oct. 24, 2006 |
| 7126231 |
Mask-making member and its production method, mask and its making method, exposure process, and fabrication method of semiconductor device |
Oct. 24, 2006 |
| 7115989 |
Adhesive sheet for producing a semiconductor device |
Oct. 3, 2006 |
| 7109593 |
Systems and methods for performing quantum computations |
Sep. 19, 2006 |
| 7105377 |
Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process |
Sep. 12, 2006 |
| 7105927 |
Structure of dummy pattern in semiconductor device |
Sep. 12, 2006 |
| 7102201 |
Strained semiconductor device structures |
Sep. 5, 2006 |
| 7091518 |
Semiconductor device |
Aug. 15, 2006 |
| 7067930 |
Liquid epoxy resin composition and semiconductor device |
Jun. 27, 2006 |
| 7057301 |
Semiconductor wafer |
Jun. 6, 2006 |
| 7053496 |
Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication, assembly, and operation therefor |
May. 30, 2006 |
| 7049705 |
Chip structure |
May. 23, 2006 |
| 7045198 |
Prepreg and circuit board and method for manufacturing the same |
May. 16, 2006 |
| 7041606 |
Electroless deposition of doped noble metals and noble metal alloys |
May. 9, 2006 |
| 7002247 |
Thermal interposer for thermal management of semiconductor devices |
Feb. 21, 2006 |
| 6975005 |
Current reference apparatus and systems |
Dec. 13, 2005 |
| 6952055 |
Intermediate structures in porous substrates in which electrical and optical microdevices are fabricated and intermediate structures formed by the same |
Oct. 4, 2005 |
| 6933523 |
Semiconductor alignment aid |
Aug. 23, 2005 |
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