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Class Information
Number: 257/797
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Alignment marks
Description: Subject matter wherein the active solid-state device is provided with one or more indicia or marks used during fabrication of the device to facilitate accurate alignment of regions in the device.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7622813 |
Oriented self-location of microstructures with alignment structures |
Nov. 24, 2009 |
| 7618832 |
Semiconductor substrate having reference semiconductor chip and method of assembling semiconductor chip using the same |
Nov. 17, 2009 |
| 7619312 |
Method and apparatus for precisely aligning integrated circuit chips |
Nov. 17, 2009 |
| 7615404 |
High-contrast laser mark on substrate surfaces |
Nov. 10, 2009 |
| 7611980 |
Single spacer process for multiplying pitch by a factor greater than two and related intermediate IC structures |
Nov. 3, 2009 |
| 7612459 |
Multi-chip module and single-chip module for chips and proximity connectors |
Nov. 3, 2009 |
| 7608932 |
Deterministic generation of an integrated circuit identification number |
Oct. 27, 2009 |
| 7602072 |
Substrate having alignment marks and method of obtaining alignment information using the same |
Oct. 13, 2009 |
| 7601605 |
Method for manufacturing semiconductor device, method for forming alignment mark, and semiconductor device |
Oct. 13, 2009 |
| 7598536 |
Semiconductor device having load resistor and method of fabricating the same |
Oct. 6, 2009 |
| 7598024 |
Method and system for enhanced lithographic alignment |
Oct. 6, 2009 |
| 7586202 |
Alignment sensing method for semiconductor device |
Sep. 8, 2009 |
| 7582395 |
Overlay mark |
Sep. 1, 2009 |
| 7579616 |
Four-terminal programmable via-containing structure and method of fabricating same |
Aug. 25, 2009 |
| 7576441 |
Boron-doped amorphous carbon film for use as a hard etch mask during the formation of a semiconductor device |
Aug. 18, 2009 |
| 7575980 |
Semiconductor device and method for manufacturing the same |
Aug. 18, 2009 |
| 7573142 |
Alignment key structure in a semiconductor device and method of forming the same |
Aug. 11, 2009 |
| 7569939 |
Self alignment features for an electronic assembly |
Aug. 4, 2009 |
| 7557449 |
Flexible via design to improve reliability |
Jul. 7, 2009 |
| 7554211 |
Semiconductor wafer and manufacturing process for semiconductor device |
Jun. 30, 2009 |
| 7547979 |
Semiconductor device and method of locating a predetermined point on the semiconductor device |
Jun. 16, 2009 |
| 7547608 |
Polysilicon hard mask for enhanced alignment signal |
Jun. 16, 2009 |
| 7545024 |
Laser beam processing apparatus for processing semiconductor wafer in production of semiconductor devices, laser beam processing method executed therein, and such semiconductor wafer processed |
Jun. 9, 2009 |
| 7542195 |
Triple alignment substrate method and structure for packaging devices |
Jun. 2, 2009 |
| 7541256 |
Method of fabricating back-illuminated imaging sensors using a bump bonding technique |
Jun. 2, 2009 |
| 7541255 |
Method for manufacturing semiconductor device |
Jun. 2, 2009 |
| 7541294 |
Semiconductor package and semiconductor package mounting method |
Jun. 2, 2009 |
| 7538443 |
Offset dependent resistor for measuring misalignment of stitched masks |
May. 26, 2009 |
| 7538444 |
Wafer with optical control modules in exposure fields |
May. 26, 2009 |
| 7534695 |
Method of manufacturing a semiconductor device |
May. 19, 2009 |
| 7531907 |
System and method for forming serial numbers on HDD wafers |
May. 12, 2009 |
| 7525201 |
Semiconductor chip having solder bumps and dummy bumps |
Apr. 28, 2009 |
| 7518252 |
Thin-film semiconductor substrate, method of manufacturing thin-film semiconductor substrate, method of crystallization, apparatus for crystallization, thin-film semiconductor device, and meth |
Apr. 14, 2009 |
| 7514802 |
Wiring board |
Apr. 7, 2009 |
| 7514278 |
Test-key for checking interconnect and corresponding checking method |
Apr. 7, 2009 |
| 7510124 |
Wafer identification mark |
Mar. 31, 2009 |
| 7507633 |
Method and structure for improved alignment in MRAM integration |
Mar. 24, 2009 |
| 7508051 |
Wafer with optical control modules in dicing paths |
Mar. 24, 2009 |
| 7508084 |
CMOS image sensor |
Mar. 24, 2009 |
| 7494830 |
Method and device for wafer backside alignment overlay accuracy |
Feb. 24, 2009 |
| 7495323 |
Semiconductor package structure having multiple heat dissipation paths and method of manufacture |
Feb. 24, 2009 |
| 7494825 |
Top contact alignment in semiconductor devices |
Feb. 24, 2009 |
| 7495347 |
Ion implantation with multiple concentration levels |
Feb. 24, 2009 |
| 7492049 |
Multi-layer registration and dimensional test mark for scatterometrical measurement |
Feb. 17, 2009 |
| 7485975 |
Alignment error measuring mark and method for manufacturing semiconductor device using the same |
Feb. 3, 2009 |
| 7482703 |
Semiconductor device having align mark layer and method of fabricating the same |
Jan. 27, 2009 |
| 7474104 |
Wafer-to-wafer alignments |
Jan. 6, 2009 |
| 7470614 |
Methods for fabricating semiconductor devices and contacts to semiconductor devices |
Dec. 30, 2008 |
| 7466412 |
Method of detecting displacement of exposure position marks |
Dec. 16, 2008 |
| 7462548 |
Substrate provided with an alignment mark in a substantially transmissive process layer, mask for exposing said mark, device manufacturing method, and device manufactured thereby |
Dec. 9, 2008 |
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