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Class Information
Number: 257/796
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated > With heat sink embedded in encapsulant
Description: Subject matter wherein a heat sink is embedded in the encapsulant.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7446408 |
Semiconductor package with heat sink |
Nov. 4, 2008 |
| 7405107 |
Semiconductor device, method and apparatus for fabricating the same |
Jul. 29, 2008 |
| 7399657 |
Ball grid array packages with thermally conductive containers |
Jul. 15, 2008 |
| 7400049 |
Integrated circuit package system with heat sink |
Jul. 15, 2008 |
| 7388286 |
Semiconductor package having enhanced heat dissipation and method of fabricating the same |
Jun. 17, 2008 |
| 7378731 |
Heat spreader and package structure utilizing the same |
May. 27, 2008 |
| 7371617 |
Method for fabricating semiconductor package with heat sink |
May. 13, 2008 |
| 7372146 |
Semiconductor module |
May. 13, 2008 |
| 7368810 |
Invertible microfeature device packages |
May. 6, 2008 |
| 7365422 |
Package of leadframe with heatsinks |
Apr. 29, 2008 |
| 7359201 |
Heat-generating electronic part cover and cover mounting method |
Apr. 15, 2008 |
| 7355289 |
Packaged integrated circuit with enhanced thermal dissipation |
Apr. 8, 2008 |
| 7335982 |
Chip package structure and chip packaging process |
Feb. 26, 2008 |
| 7323769 |
High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package |
Jan. 29, 2008 |
| RE39957 |
Method of making semiconductor package with heat spreader |
Dec. 25, 2007 |
| 7304372 |
Semiconductor package |
Dec. 4, 2007 |
| 7285855 |
Packaged device and method of forming same |
Oct. 23, 2007 |
| 7273769 |
Method and apparatus for removing encapsulating material from a packaged microelectronic device |
Sep. 25, 2007 |
| 7265444 |
Resin molded semiconductor device |
Sep. 4, 2007 |
| 7259451 |
Invertible microfeature device packages |
Aug. 21, 2007 |
| 7253505 |
IC substrate with over voltage protection function |
Aug. 7, 2007 |
| 7250672 |
Dual semiconductor die package with reverse lead form |
Jul. 31, 2007 |
| 7247929 |
Molded semiconductor device with heat conducting members |
Jul. 24, 2007 |
| 7247944 |
Connector assembly |
Jul. 24, 2007 |
| 7245004 |
Semiconductor device |
Jul. 17, 2007 |
| 7235889 |
Integrated heatspreader for use in wire bonded ball grid array semiconductor packages |
Jun. 26, 2007 |
| 7235876 |
Semiconductor device having metallic plate with groove |
Jun. 26, 2007 |
| 7230829 |
Overmolded electronic assembly with insert molded heat sinks |
Jun. 12, 2007 |
| 7227249 |
Three-dimensional stacked semiconductor package with chips on opposite sides of lead |
Jun. 5, 2007 |
| 7224057 |
Thermal enhance package with universal heat spreader |
May. 29, 2007 |
| 7217598 |
Method for manufacturing plastic ball grid array package with integral heatsink |
May. 15, 2007 |
| 7205651 |
Thermally enhanced stacked die package and fabrication method |
Apr. 17, 2007 |
| 7199718 |
RFID tag with thermal conductive cover |
Apr. 3, 2007 |
| 7196904 |
IC package with an implanted heat-dissipation fin |
Mar. 27, 2007 |
| 7193320 |
Semiconductor device having a heat spreader exposed from a seal resin |
Mar. 20, 2007 |
| 7193303 |
Supporting frame for surface-mount diode package |
Mar. 20, 2007 |
| 7190066 |
Heat spreader and package structure utilizing the same |
Mar. 13, 2007 |
| 7187075 |
Stress relieving film for semiconductor packages |
Mar. 6, 2007 |
| 7164210 |
Semiconductor package with heat sink and method for fabricating same |
Jan. 16, 2007 |
| 7153725 |
Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor |
Dec. 26, 2006 |
| 7148554 |
Discrete electronic component arrangement including anchoring, thermally conductive pad |
Dec. 12, 2006 |
| 7145254 |
Transfer-molded power device and method for manufacturing transfer-molded power device |
Dec. 5, 2006 |
| 7141886 |
Air pocket resistant semiconductor package |
Nov. 28, 2006 |
| 7138707 |
Semiconductor package including leads and conductive posts for providing increased functionality |
Nov. 21, 2006 |
| 7135754 |
Chip type solid electrolytic capacitor having a small size and a simple structure |
Nov. 14, 2006 |
| 7135782 |
Semiconductor module and production method therefor and module for IC cards and the like |
Nov. 14, 2006 |
| 7126218 |
Embedded heat spreader ball grid array |
Oct. 24, 2006 |
| 7122388 |
Method of detecting misalignment of ion implantation area |
Oct. 17, 2006 |
| 7122911 |
Heat spreader and semiconductor device package having the same |
Oct. 17, 2006 |
| 7115989 |
Adhesive sheet for producing a semiconductor device |
Oct. 3, 2006 |
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