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Class Information
Number: 257/796
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated > With heat sink embedded in encapsulant
Description: Subject matter wherein a heat sink is embedded in the encapsulant.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618845 |
Fabrication of an integrated circuit package |
Nov. 17, 2009 |
| 7619304 |
Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof |
Nov. 17, 2009 |
| 7608915 |
Heat dissipation semiconductor package |
Oct. 27, 2009 |
| 7598123 |
Semiconductor component and method of manufacture |
Oct. 6, 2009 |
| 7586180 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
Sep. 8, 2009 |
| 7569920 |
Electronic component having at least one vertical semiconductor power transistor |
Aug. 4, 2009 |
| 7554179 |
Multi-leadframe semiconductor package and method of manufacture |
Jun. 30, 2009 |
| 7554210 |
Semiconductor device with semiconductor chip mounted in package |
Jun. 30, 2009 |
| 7550843 |
Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member |
Jun. 23, 2009 |
| 7547964 |
Device packages having a III-nitride based power semiconductor device |
Jun. 16, 2009 |
| 7545017 |
Wafer level package for surface acoustic wave device and fabrication method thereof |
Jun. 9, 2009 |
| 7535085 |
Semiconductor package having improved adhesiveness and ground bonding |
May. 19, 2009 |
| 7535087 |
Semiconductor device with lead frames |
May. 19, 2009 |
| 7528467 |
IC substrate with over voltage protection function |
May. 5, 2009 |
| 7528415 |
Semiconductor laser |
May. 5, 2009 |
| 7521794 |
Intrinsic thermal enhancement for FBGA package |
Apr. 21, 2009 |
| 7518233 |
Sealing structure for multi-chip module |
Apr. 14, 2009 |
| 7504736 |
Semiconductor packaging mold and method of manufacturing semiconductor package using the same |
Mar. 17, 2009 |
| 7501585 |
Semiconductor device support element with fluid-tight boundary |
Mar. 10, 2009 |
| 7495346 |
Semiconductor package |
Feb. 24, 2009 |
| 7491583 |
Power module fabrication method and structure thereof |
Feb. 17, 2009 |
| 7479693 |
Arrangement of conductive connectors in a power semiconductor device |
Jan. 20, 2009 |
| 7476967 |
Composite carbon nanotube thermal interface device |
Jan. 13, 2009 |
| 7473995 |
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly |
Jan. 6, 2009 |
| 7466015 |
Supporting frame for surface-mount diode package |
Dec. 16, 2008 |
| 7446408 |
Semiconductor package with heat sink |
Nov. 4, 2008 |
| 7405107 |
Semiconductor device, method and apparatus for fabricating the same |
Jul. 29, 2008 |
| 7400049 |
Integrated circuit package system with heat sink |
Jul. 15, 2008 |
| 7399657 |
Ball grid array packages with thermally conductive containers |
Jul. 15, 2008 |
| 7388286 |
Semiconductor package having enhanced heat dissipation and method of fabricating the same |
Jun. 17, 2008 |
| 7378731 |
Heat spreader and package structure utilizing the same |
May. 27, 2008 |
| 7371617 |
Method for fabricating semiconductor package with heat sink |
May. 13, 2008 |
| 7372146 |
Semiconductor module |
May. 13, 2008 |
| 7368810 |
Invertible microfeature device packages |
May. 6, 2008 |
| 7365422 |
Package of leadframe with heatsinks |
Apr. 29, 2008 |
| 7359201 |
Heat-generating electronic part cover and cover mounting method |
Apr. 15, 2008 |
| 7355289 |
Packaged integrated circuit with enhanced thermal dissipation |
Apr. 8, 2008 |
| 7335982 |
Chip package structure and chip packaging process |
Feb. 26, 2008 |
| 7323769 |
High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package |
Jan. 29, 2008 |
| RE39957 |
Method of making semiconductor package with heat spreader |
Dec. 25, 2007 |
| 7304372 |
Semiconductor package |
Dec. 4, 2007 |
| 7285855 |
Packaged device and method of forming same |
Oct. 23, 2007 |
| 7273769 |
Method and apparatus for removing encapsulating material from a packaged microelectronic device |
Sep. 25, 2007 |
| 7265444 |
Resin molded semiconductor device |
Sep. 4, 2007 |
| 7259451 |
Invertible microfeature device packages |
Aug. 21, 2007 |
| 7253505 |
IC substrate with over voltage protection function |
Aug. 7, 2007 |
| 7250672 |
Dual semiconductor die package with reverse lead form |
Jul. 31, 2007 |
| 7247944 |
Connector assembly |
Jul. 24, 2007 |
| 7247929 |
Molded semiconductor device with heat conducting members |
Jul. 24, 2007 |
| 7245004 |
Semiconductor device |
Jul. 17, 2007 |
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