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Class Information
Number: 257/796
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated > With heat sink embedded in encapsulant
Description: Subject matter wherein a heat sink is embedded in the encapsulant.

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13

Patent Number Title Of Patent Date Issued
8703539 Multiple die packaging interposer structure and method Apr. 22, 2014
8686545 Semiconductor device and method for manufacturing the same Apr. 1, 2014
8669140 Method of forming stacked die package using redistributed chip packaging Mar. 11, 2014
8659146 Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing Feb. 25, 2014
8653673 Method for packaging semiconductors at a wafer level Feb. 18, 2014
8633060 Semiconductor device production method and semiconductor device Jan. 21, 2014
8624366 Semiconductor package structure and method of fabricating the same Jan. 7, 2014
8618674 Semiconductor device including a sintered insulation material Dec. 31, 2013
8598616 Light emitting device and light unit using the same Dec. 3, 2013
8592851 Optical semiconductor device and circuit Nov. 26, 2013
8581374 Placing heat sink into packaging by strip formation assembly Nov. 12, 2013
8581387 Through wire interconnect (TWI) having bonded connection and encapsulating polymer layer Nov. 12, 2013
8575769 Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation Nov. 5, 2013
8546923 Rigid power module suited for high-voltage applications Oct. 1, 2013
8536687 Semiconductor device having separated heatsink and chip mounting portion Sep. 17, 2013
8513696 Lateral thermal dissipation LED and fabrication method thereof Aug. 20, 2013
8508056 Heat releasing semiconductor package, method for manufacturing the same, and display apparatus including the same Aug. 13, 2013
8497587 Thermally enhanced expanded wafer level package ball grid array structure and method of making the same Jul. 30, 2013
8497586 Package module structure for high power device with metal substrate and method of manufacturing the same Jul. 30, 2013
8492911 Stacked interconnect heat sink Jul. 23, 2013
8476656 Light-emitting diode Jul. 2, 2013
8466486 Thermal management system for multiple heat source devices Jun. 18, 2013
8446003 Semiconductor device including double-sided multi-electrode chip embedded in multilayer wiring substrate May. 21, 2013
8441115 Semiconductor device with exposed thermal conductivity part May. 14, 2013
8421221 Integrated circuit heat spreader stacking system Apr. 16, 2013
8406004 Integrated circuit packaging system and method of manufacture thereof Mar. 26, 2013
8405194 Semiconductor device including two heat sinks and method of manufacturing the same Mar. 26, 2013
8404523 Method for fabricating stacked semiconductor system with encapsulated through wire interconnects (TWI) Mar. 26, 2013
8399967 Package structure Mar. 19, 2013
8367481 Four MOSFET full bridge module Feb. 5, 2013
8334586 Stacked semiconductor chips with separate encapsulations Dec. 18, 2012
8330270 Integrated circuit package having a plurality of spaced apart pad portions Dec. 11, 2012
8324653 Semiconductor chip assembly with ceramic/metal substrate Dec. 4, 2012
8319332 Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts Nov. 27, 2012
RE43818 Fabrication of an integrated circuit package Nov. 20, 2012
8304891 Semiconductor package device, semiconductor package structure, and fabrication methods thereof Nov. 6, 2012
8284556 Electronic substrate device Oct. 9, 2012
8278742 Thermal enhanced upper and dual heat sink exposed molded leadless package and method Oct. 2, 2012
8274164 Less expensive high power plastic surface mount package Sep. 25, 2012
8269248 Light emitting assemblies and portions thereof Sep. 18, 2012
8269326 Semiconductor device assemblies Sep. 18, 2012
8269342 Semiconductor packages including heat slugs Sep. 18, 2012
8247891 Chip package structure including heat dissipation device and an insulation sheet Aug. 21, 2012
8242529 Light emitting chip and method for manufacturing the same Aug. 14, 2012
8217510 Semiconductor module system having stacked components with encapsulated through wire interconnects (TWI) Jul. 10, 2012
8193547 Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices Jun. 5, 2012
8188594 Input/output package architectures May. 29, 2012
8174112 Integrated circuit device with low capacitance and high thermal conductivity interface May. 8, 2012
8138585 Four mosfet full bridge module Mar. 20, 2012
8134232 Heat dissipation for integrated circuit Mar. 13, 2012

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