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Class Information
Number: 257/795
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated > With specified filler material
Description: Subject matter wherein a particular material has been added to an encapsulant material to give it desirable mechanical, thermal, electrical, or other desirable characteristics, and the material is specified.










Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8680669 Electronic component, electronic module, and method for manufacturing the same Mar. 25, 2014
8654537 Printed circuit board with integral radio-frequency shields Feb. 18, 2014
8648479 Epoxy resin composition for semiconductor encapsulant and semiconductor device using the same Feb. 11, 2014
8643200 Resin composition and transparent encapsulant formed using the same, and electronic device including the encapsulant Feb. 4, 2014
8637992 Flip chip package for DRAM with two underfill materials Jan. 28, 2014
8618674 Semiconductor device including a sintered insulation material Dec. 31, 2013
8592504 Amorphous siliceous powder, process for production thereof, resin composition, and semiconductor encapsulation material Nov. 26, 2013
8574966 Semiconductor device having a semiconductor chip, and method for the production thereof Nov. 5, 2013
8575749 Semiconductor device and method for fabricating the same Nov. 5, 2013
8575767 Reflow of thermoplastic sheet for passivation of power integrated circuits Nov. 5, 2013
8563362 Method of producing semiconductor chip laminate comprising an adhesive that comprises a curing compound, curing agent and spacer particles Oct. 22, 2013
8546960 Manufacturing method of semiconductor device, semiconductor device and mobile communication device Oct. 1, 2013
8492909 Insulating member, metal base substrate, and semiconductor module, and manufacturing methods thereof Jul. 23, 2013
8492910 Underfill method and chip package Jul. 23, 2013
8471280 Silicone based reflective underfill and thermal coupler Jun. 25, 2013
8409980 Underfill flow guide structures and method of using same Apr. 2, 2013
8378472 Mounting structure for semiconductor element with underfill resin Feb. 19, 2013
8330264 Packaging configurations for vertical electronic devices using conductive traces disposed on laminated board layers Dec. 11, 2012
8319355 Light emitting device Nov. 27, 2012
8222751 Electroconductive bonding material and electronic apparatus Jul. 17, 2012
8217275 Sealing material and mounting method using the sealing material Jul. 10, 2012
8207619 Semiconductor device and method of manufacturing the same Jun. 26, 2012
8207620 Flip-chip semiconductor package and chip carrier for preventing corner delamination Jun. 26, 2012
8178984 Flip chip with interposer May. 15, 2012
8168477 Packaging configurations for vertical electronic devices using conductive traces disposed on laminated board layers May. 1, 2012
8168472 Semiconductor device having a semiconductor chip, and method for the production thereof May. 1, 2012
8159067 Underfill flow guide structures Apr. 17, 2012
8148829 Self repairing IC package design Apr. 3, 2012
8134227 Stacked integrated circuit package system with conductive spacer Mar. 13, 2012
8124453 Vertically packaged MOSFET and IC power devices as integrated module using 3D interconnected laminates Feb. 28, 2012
8119449 Method of manufacturing an electronic part mounting structure Feb. 21, 2012
8120189 Wiring terminal-connecting adhesive Feb. 21, 2012
8120153 High-temperature, wirebondless, injection-molded, ultra-compact hybrid power module Feb. 21, 2012
8105687 Electroconductive bonding material and electronic apparatus Jan. 31, 2012
8093699 Circuit device with circuit board and semiconductor chip mounted thereon Jan. 10, 2012
8094457 Electronic apparatus Jan. 10, 2012
8062928 Semiconductor device having a semiconductor chip, and method for the production thereof Nov. 22, 2011
8048784 Methods of manufacturing semiconductor devices including a doped silicon layer Nov. 1, 2011
8018077 Electromechanical system having a controlled atmosphere, and method of fabricating same Sep. 13, 2011
7999276 Chip-type LED package and light emitting apparatus having the same Aug. 16, 2011
7993984 Electronic device and manufacturing method Aug. 9, 2011
7986050 Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using the same Jul. 26, 2011
7982322 Liquid resin composition for electronic part sealing, and electronic part apparatus utilizing the same Jul. 19, 2011
7977778 Integrated circuit package system with interference-fit feature Jul. 12, 2011
7969028 Semiconductor device mounting structure, manufacturing method, and removal method of semiconductor device Jun. 28, 2011
7969027 Semiconductor device encapsulated with resin composition Jun. 28, 2011
7955875 Forming light emitting devices including custom wavelength conversion structures Jun. 7, 2011
7956468 Semiconductor device Jun. 7, 2011
7952107 Solid state light sheet and encapsulated bare die semiconductor circuits with electrical insulator May. 31, 2011
7952212 Applications of smart polymer composites to integrated circuit packaging May. 31, 2011

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