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Class Information
Number: 257/795
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated > With specified filler material
Description: Subject matter wherein a particular material has been added to an encapsulant material to give it desirable mechanical, thermal, electrical, or other desirable characteristics, and the material is specified.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7439598 |
Microelectronic imaging units |
Oct. 21, 2008 |
| 7432603 |
Semiconductor encapsulating epoxy resin composition and semiconductor device |
Oct. 7, 2008 |
| 7420220 |
Semiconductor light emitting device |
Sep. 2, 2008 |
| 7417294 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
Aug. 26, 2008 |
| 7417309 |
Circuit device and portable device with symmetrical arrangement |
Aug. 26, 2008 |
| 7399657 |
Ball grid array packages with thermally conductive containers |
Jul. 15, 2008 |
| 7397140 |
Chip module |
Jul. 8, 2008 |
| 7397139 |
Epoxy resin molding material for sealing use and semiconductor device |
Jul. 8, 2008 |
| 7382059 |
Semiconductor package structure and method of manufacture |
Jun. 3, 2008 |
| 7352071 |
Method of fabricating anti-warp package |
Apr. 1, 2008 |
| 7339281 |
Circuit device and manufacturing method thereof |
Mar. 4, 2008 |
| 7327039 |
Nanoparticle filled underfill |
Feb. 5, 2008 |
| 7327042 |
Interconnection structure of electric conductive wirings |
Feb. 5, 2008 |
| 7315083 |
Circuit device and manufacturing method thereof |
Jan. 1, 2008 |
| 7312536 |
Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same |
Dec. 25, 2007 |
| 7247940 |
Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body |
Jul. 24, 2007 |
| 7233076 |
Semiconductor device with read out prevention and method of producing same |
Jun. 19, 2007 |
| 7224047 |
Semiconductor device package with reduced leakage |
May. 29, 2007 |
| 7205669 |
Semiconductor device |
Apr. 17, 2007 |
| 7190082 |
Low stress flip-chip package for low-K silicon technology |
Mar. 13, 2007 |
| 7179399 |
Material for forming protective film |
Feb. 20, 2007 |
| 7138723 |
Deformable semiconductor device |
Nov. 21, 2006 |
| 7126211 |
Circuit carrier |
Oct. 24, 2006 |
| 7122907 |
Interposer substrate and wafer scale interposer substrate member for use with flip-chip configured semiconductor dice |
Oct. 17, 2006 |
| 7115989 |
Adhesive sheet for producing a semiconductor device |
Oct. 3, 2006 |
| 7116002 |
Overhang support for a stacked semiconductor device, and method of forming thereof |
Oct. 3, 2006 |
| 7112882 |
Structures and methods for heat dissipation of semiconductor integrated circuits |
Sep. 26, 2006 |
| 7109062 |
Semiconductor integrated device including support substrate fastened using resin, and manufacturing method thereof |
Sep. 19, 2006 |
| 7109591 |
Integrated circuit device |
Sep. 19, 2006 |
| 7075187 |
Coating material over electrodes to support organic synthesis |
Jul. 11, 2006 |
| 7071576 |
Semiconductor device and method of manufacturing the same |
Jul. 4, 2006 |
| 7067930 |
Liquid epoxy resin composition and semiconductor device |
Jun. 27, 2006 |
| 7005747 |
Semiconductor device having additional functional element and method of manufacturing thereof |
Feb. 28, 2006 |
| 6998687 |
Surface acoustic wave (SAW) device |
Feb. 14, 2006 |
| 6986454 |
Electronic package having controlled height stand-off solder joint |
Jan. 17, 2006 |
| 6982491 |
Sensor semiconductor package and method of manufacturing the same |
Jan. 3, 2006 |
| 6975024 |
Hybrid integrated circuit device and manufacturing method thereof |
Dec. 13, 2005 |
| 6972495 |
Compliant package with conductive elastomeric posts |
Dec. 6, 2005 |
| 6972488 |
Semiconductor device in which a semiconductor chip mounted on a printed circuit is sealed with a molded resin |
Dec. 6, 2005 |
| 6967412 |
Wafer level underfill and interconnect process |
Nov. 22, 2005 |
| 6963133 |
Semiconductor device and method for manufacturing semiconductor device |
Nov. 8, 2005 |
| 6946730 |
Semiconductor device having heat conducting plate |
Sep. 20, 2005 |
| 6943058 |
No-flow underfill process and material therefor |
Sep. 13, 2005 |
| 6940180 |
Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit |
Sep. 6, 2005 |
| 6940177 |
Semiconductor package and method of preparing same |
Sep. 6, 2005 |
| 6936852 |
Semiconductor light emitting device and method for manufacturing same |
Aug. 30, 2005 |
| 6924166 |
Process for sealing devices incorporating microstructures |
Aug. 2, 2005 |
| 6919627 |
Multichip module |
Jul. 19, 2005 |
| 6905913 |
Semiconductor device and method of manufacturing same |
Jun. 14, 2005 |
| 6894400 |
Robust electronic device packages |
May. 17, 2005 |
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