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Class Information
Number: 257/794
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated > With specified encapsulant > Including glass
Description: Subject matter wherein the encapsulant contains glass (i.e., an amorphous inorganic, usually transparent or translucent substance consisting of a mixture of silicates or borates or phosphates formed by fusion of silica or of oxides of boron or phosphorous with a flux and stabilizer that cools to a rigid condition without crystallization).

Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8704361 Sealing glass for semiconductor device, sealing material, sealing material paste, and semiconductor device and its production process Apr. 22, 2014
8637980 Adhesive applications using alkali silicate glass for electronics Jan. 28, 2014
8629568 Semiconductor device cover mark Jan. 14, 2014
8618674 Semiconductor device including a sintered insulation material Dec. 31, 2013
8546960 Manufacturing method of semiconductor device, semiconductor device and mobile communication device Oct. 1, 2013
8531045 Component packaging and assembly Sep. 10, 2013
8440733 Semiconductor component and production method May. 14, 2013
8378498 Chip assembly with a coreless substrate employing a patterned adhesive layer Feb. 19, 2013
8368064 Glass for scattering layer of organic LED device and organic LED device Feb. 5, 2013
8258637 Bonding structure and method for manufacturing same Sep. 4, 2012
8178390 Semiconductor component and production method May. 15, 2012
8120189 Wiring terminal-connecting adhesive Feb. 21, 2012
8035300 Flat panel display device and method of making the same Oct. 11, 2011
7999398 Solid state device Aug. 16, 2011
7994646 Semiconductor device Aug. 9, 2011
7897234 Potting material for electronic components Mar. 1, 2011
7795585 Vacuum package and manufacturing process thereof Sep. 14, 2010
7794127 Light emitting diode having grooves to modulate light emission thereof Sep. 14, 2010
7709940 Micro device encapsulation May. 4, 2010
7652384 Fabricating tall micro structures Jan. 26, 2010
7638887 Package structure and fabrication method thereof Dec. 29, 2009
7615506 Durable tungsten-doped tin-fluorophosphate glasses Nov. 10, 2009
7553683 Method of forming pre-fabricated wavelength converting elements for semiconductor light emitting devices Jun. 30, 2009
7504670 Sealing structure for mounting a semiconductor device to a substrate Mar. 17, 2009
7485489 Electronics circuit manufacture Feb. 3, 2009
7470999 Glass for semiconductor encapsulation and outer tube for semiconductor encapsulation, and semiconductor electronic parts Dec. 30, 2008
7436076 Micromechanical component having an anodically bonded cap and a manufacturing method Oct. 14, 2008
7399657 Ball grid array packages with thermally conductive containers Jul. 15, 2008
7397139 Epoxy resin molding material for sealing use and semiconductor device Jul. 8, 2008
7307286 Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same Dec. 11, 2007
7186629 Protecting thin semiconductor wafers during back-grinding in high-volume production Mar. 6, 2007
7179680 Method for producing an optoelectronic component Feb. 20, 2007
7115989 Adhesive sheet for producing a semiconductor device Oct. 3, 2006
7109591 Integrated circuit device Sep. 19, 2006
7102242 Lead-free glass tubing, especially for encapsulating diodes and diodes encapsulated with same Sep. 5, 2006
7098545 Semiconductor device and method of enveloping an integrated circuit Aug. 29, 2006
7095124 Semiconductor device Aug. 22, 2006
7075187 Coating material over electrodes to support organic synthesis Jul. 11, 2006
7002241 Packaging of semiconductor device with a non-opaque cover Feb. 21, 2006
6995691 Bonded structure using reacted borosilicate mixture Feb. 7, 2006
6930398 Package structure for optical image sensing integrated circuits Aug. 16, 2005
6909175 EL device sealing plate, multiple sealing plate-producing mother glass substrate, and EL device Jun. 21, 2005
6906405 Electronic part and its manufacturing method Jun. 14, 2005
6906403 Sealed electronic device packages with transparent coverings Jun. 14, 2005
6873060 Electronic component with a semiconductor chip, method of producing an electronic component and a panel with a plurality of electronic components Mar. 29, 2005
6864197 Lead-free glass tubing, especially for encapsulating diodes and diodes encapsulated with same Mar. 8, 2005
6861683 Optoelectronic component using two encapsulating materials and the method of making the same Mar. 1, 2005
6841888 Encapsulant for opto-electronic devices and method for making it Jan. 11, 2005
6828674 Hermetically sealed microstructure package Dec. 7, 2004
6800949 Embedded chip enclosure with solder-free interconnect Oct. 5, 2004

1 2 3

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