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Class Information
Number: 257/794
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated > With specified encapsulant > Including glass
Description: Subject matter wherein the encapsulant contains glass (i.e., an amorphous inorganic, usually transparent or translucent substance consisting of a mixture of silicates or borates or phosphates formed by fusion of silica or of oxides of boron or phosphorous with a flux and stabilizer that cools to a rigid condition without crystallization).
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7436076 |
Micromechanical component having an anodically bonded cap and a manufacturing method |
Oct. 14, 2008 |
| 7399657 |
Ball grid array packages with thermally conductive containers |
Jul. 15, 2008 |
| 7397139 |
Epoxy resin molding material for sealing use and semiconductor device |
Jul. 8, 2008 |
| 7307286 |
Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same |
Dec. 11, 2007 |
| 7186629 |
Protecting thin semiconductor wafers during back-grinding in high-volume production |
Mar. 6, 2007 |
| 7179680 |
Method for producing an optoelectronic component |
Feb. 20, 2007 |
| 7115989 |
Adhesive sheet for producing a semiconductor device |
Oct. 3, 2006 |
| 7109591 |
Integrated circuit device |
Sep. 19, 2006 |
| 7102242 |
Lead-free glass tubing, especially for encapsulating diodes and diodes encapsulated with same |
Sep. 5, 2006 |
| 7098545 |
Semiconductor device and method of enveloping an integrated circuit |
Aug. 29, 2006 |
| 7095124 |
Semiconductor device |
Aug. 22, 2006 |
| 7075187 |
Coating material over electrodes to support organic synthesis |
Jul. 11, 2006 |
| 7002241 |
Packaging of semiconductor device with a non-opaque cover |
Feb. 21, 2006 |
| 6995691 |
Bonded structure using reacted borosilicate mixture |
Feb. 7, 2006 |
| 6930398 |
Package structure for optical image sensing integrated circuits |
Aug. 16, 2005 |
| 6909175 |
EL device sealing plate, multiple sealing plate-producing mother glass substrate, and EL device |
Jun. 21, 2005 |
| 6906405 |
Electronic part and its manufacturing method |
Jun. 14, 2005 |
| 6906403 |
Sealed electronic device packages with transparent coverings |
Jun. 14, 2005 |
| 6873060 |
Electronic component with a semiconductor chip, method of producing an electronic component and a panel with a plurality of electronic components |
Mar. 29, 2005 |
| 6864197 |
Lead-free glass tubing, especially for encapsulating diodes and diodes encapsulated with same |
Mar. 8, 2005 |
| 6861683 |
Optoelectronic component using two encapsulating materials and the method of making the same |
Mar. 1, 2005 |
| 6841888 |
Encapsulant for opto-electronic devices and method for making it |
Jan. 11, 2005 |
| 6828674 |
Hermetically sealed microstructure package |
Dec. 7, 2004 |
| 6800949 |
Embedded chip enclosure with solder-free interconnect |
Oct. 5, 2004 |
| 6791164 |
Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages |
Sep. 14, 2004 |
| 6774481 |
Solid-state image pickup device |
Aug. 10, 2004 |
| 6770914 |
III nitride semiconductor substrate for ELO |
Aug. 3, 2004 |
| 6724094 |
Glass and glass tube for encapsulating semiconductors |
Apr. 20, 2004 |
| 6724093 |
Semiconductor devices and their manufacture |
Apr. 20, 2004 |
| 6663943 |
Surface acoustic wave device and method for making the same |
Dec. 16, 2003 |
| 6645643 |
Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom |
Nov. 11, 2003 |
| 6642618 |
Light-emitting device and production thereof |
Nov. 4, 2003 |
| 6630727 |
Modularly expandable multi-layered semiconductor component |
Oct. 7, 2003 |
| 6521989 |
Methods and apparatus for hermetically sealing electronic packages |
Feb. 18, 2003 |
| 6507122 |
Pre-bond encapsulation of area array terminated chip and wafer scale packages |
Jan. 14, 2003 |
| 6504240 |
Semiconductor device having reliable coupling between wiring substrate and semiconductor pellet |
Jan. 7, 2003 |
| 6441481 |
Hermetically sealed microstructure package |
Aug. 27, 2002 |
| 6383660 |
Epoxy resin composition for encapsulating semiconductor and semiconductor device using the same |
May. 7, 2002 |
| 6365979 |
Semiconductor device and manufacturing method thereof |
Apr. 2, 2002 |
| 6326697 |
Hermetically sealed chip scale packages formed by wafer level fabrication and assembly |
Dec. 4, 2001 |
| 6323263 |
Semiconductor sealing liquid epoxy resin compositions |
Nov. 27, 2001 |
| 6316829 |
Reinforced semiconductor package |
Nov. 13, 2001 |
| 6278177 |
Substrateless chip scale package and method of making same |
Aug. 21, 2001 |
| 6255739 |
Semiconductor device |
Jul. 3, 2001 |
| 6246123 |
Transparent compound and applications for its use |
Jun. 12, 2001 |
| 6218727 |
Wafer frame |
Apr. 17, 2001 |
| 6166433 |
Resin molded semiconductor device and method of manufacturing semiconductor package |
Dec. 26, 2000 |
| 6111316 |
Electronic component encapsulated in a glass tube |
Aug. 29, 2000 |
| 6008070 |
Wafer level fabrication and assembly of chip scale packages |
Dec. 28, 1999 |
| 5986316 |
Semiconductor type physical quantity sensor |
Nov. 16, 1999 |
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