| |
 |
|
Class Information
Number: 257/793
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated > With specified encapsulant > Including epoxide
Description: Subject matter wherein the encapsulant includes an epoxy compound (i.e., a compound containing three membered ring consisting or one oxygen and two carbon atoms).
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7442729 |
Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt |
Oct. 28, 2008 |
| 7431990 |
Resin composition for encapsulating semiconductor chip and semiconductor device therewith |
Oct. 7, 2008 |
| 7432603 |
Semiconductor encapsulating epoxy resin composition and semiconductor device |
Oct. 7, 2008 |
| 7429800 |
Molding composition and method, and molded article |
Sep. 30, 2008 |
| 7408259 |
Sheet to form a protective film for chips |
Aug. 5, 2008 |
| 7408264 |
SMT passive device noflow underfill methodology and structure |
Aug. 5, 2008 |
| 7399657 |
Ball grid array packages with thermally conductive containers |
Jul. 15, 2008 |
| 7397139 |
Epoxy resin molding material for sealing use and semiconductor device |
Jul. 8, 2008 |
| 7381359 |
Method for making filled epoxy resin compositions |
Jun. 3, 2008 |
| 7378721 |
Chip on lead frame for small package speed sensor |
May. 27, 2008 |
| 7345102 |
Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same |
Mar. 18, 2008 |
| 7345368 |
Semiconductor device and the manufacturing method for the same |
Mar. 18, 2008 |
| 7332822 |
Flip chip system with organic/inorganic hybrid underfill composition |
Feb. 19, 2008 |
| 7321005 |
Encapsulant composition and electronic package utilizing same |
Jan. 22, 2008 |
| 7317258 |
Thermal interface apparatus, systems, and fabrication methods |
Jan. 8, 2008 |
| 7315083 |
Circuit device and manufacturing method thereof |
Jan. 1, 2008 |
| 7312536 |
Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same |
Dec. 25, 2007 |
| 7307128 |
Epoxy compound, preparation method thereof, and use thereof |
Dec. 11, 2007 |
| 7304120 |
Epoxy compound, preparation method thereof, and use thereof |
Dec. 4, 2007 |
| 7304391 |
Modified chip attach process and apparatus |
Dec. 4, 2007 |
| 7291684 |
Resin composition for encapsulating semiconductor chip and semiconductor device therewith |
Nov. 6, 2007 |
| 7288838 |
Circuit board for mounting a semiconductor chip and manufacturing method thereof |
Oct. 30, 2007 |
| 7279781 |
Two-stage transfer molding device to encapsulate MMC module |
Oct. 9, 2007 |
| 7268191 |
Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby |
Sep. 11, 2007 |
| 7265167 |
Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same |
Sep. 4, 2007 |
| 7262514 |
Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device |
Aug. 28, 2007 |
| 7262507 |
Semiconductor-mounted device and method for producing same |
Aug. 28, 2007 |
| 7211888 |
Encapsulation of pin solder for maintaining accuracy in pin position |
May. 1, 2007 |
| 7205669 |
Semiconductor device |
Apr. 17, 2007 |
| 7193331 |
Semiconductor device and manufacturing process thereof |
Mar. 20, 2007 |
| 7192997 |
Encapsulant composition and electronic package utilizing same |
Mar. 20, 2007 |
| 7183588 |
Light emission device |
Feb. 27, 2007 |
| 7183657 |
Semiconductor device having resin anti-bleed feature |
Feb. 27, 2007 |
| 7183661 |
Epoxy-resin systems, which are resistant to aging, moulding materials, components produced therefrom and the use thereof |
Feb. 27, 2007 |
| 7178235 |
Method of manufacturing an optoelectronic package |
Feb. 20, 2007 |
| 7163973 |
Composition of bulk filler and epoxy-clay nanocomposite |
Jan. 16, 2007 |
| 7138723 |
Deformable semiconductor device |
Nov. 21, 2006 |
| 7122910 |
Packaged semiconductor device |
Oct. 17, 2006 |
| 7122896 |
Mounting structure of electronic component, electro-optic device, electronic equipment, and method for mounting electronic component |
Oct. 17, 2006 |
| 7122587 |
Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device |
Oct. 17, 2006 |
| 7115989 |
Adhesive sheet for producing a semiconductor device |
Oct. 3, 2006 |
| 7115982 |
Semiconductor component having stiffener, stacked dice and circuit decals |
Oct. 3, 2006 |
| 7109592 |
SMT passive device noflow underfill methodology and structure |
Sep. 19, 2006 |
| 7109591 |
Integrated circuit device |
Sep. 19, 2006 |
| 7105919 |
Semiconductor package having ultra-thin thickness and method of manufacturing the same |
Sep. 12, 2006 |
| 7098545 |
Semiconductor device and method of enveloping an integrated circuit |
Aug. 29, 2006 |
| 7095125 |
Semiconductor encapsulating epoxy resin composition and semiconductor device |
Aug. 22, 2006 |
| 7095124 |
Semiconductor device |
Aug. 22, 2006 |
| 7090895 |
Flame retardant epoxy resin composition, semiconductor encapsulating material using same, and resin encapsulated semiconductor device |
Aug. 15, 2006 |
| 7078794 |
Chip package and process for forming the same |
Jul. 18, 2006 |
|
|
|
