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Class Information
Number: 257/793
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated > With specified encapsulant > Including epoxide
Description: Subject matter wherein the encapsulant includes an epoxy compound (i.e., a compound containing three membered ring consisting or one oxygen and two carbon atoms).










Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8710158 Epoxy composition for encapsulating an optical semiconductor element Apr. 29, 2014
8710683 Method of forming wafer level mold using glass fiber and wafer structure formed by the same Apr. 29, 2014
8653205 Resin composition for encapsulating semiconductor and semiconductor device Feb. 18, 2014
8624346 Exclusion zone for stress-sensitive circuit design Jan. 7, 2014
8618674 Semiconductor device including a sintered insulation material Dec. 31, 2013
8604615 Semiconductor device including a stack of semiconductor chips, underfill material and molding material Dec. 10, 2013
8592504 Amorphous siliceous powder, process for production thereof, resin composition, and semiconductor encapsulation material Nov. 26, 2013
8592999 Semiconductor chip and method for fabricating the same Nov. 26, 2013
8587133 Semiconductor device Nov. 19, 2013
8552572 Resin composition for encapsulating semiconductor and semiconductor device using the same Oct. 8, 2013
8546959 Resin composition for encapsulating semiconductor, method for producing semiconductor device and semiconductor device Oct. 1, 2013
8531028 Method for manufacturing electronic component, and electronic component Sep. 10, 2013
8531044 Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with an encapsulant prepared from the composition Sep. 10, 2013
8519067 Epoxy resin composition and semiconductor device Aug. 27, 2013
8502399 Resin composition for encapsulating semiconductor and semiconductor device Aug. 6, 2013
8492909 Insulating member, metal base substrate, and semiconductor module, and manufacturing methods thereof Jul. 23, 2013
8470936 Liquid epoxy resin composition for semiconductor encapsulation Jun. 25, 2013
8461699 Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device Jun. 11, 2013
8455899 Resin composition, reflector for light-emitting semiconductor device, and light-emitting semiconductor unit Jun. 4, 2013
8440478 Light emitting device, package, light emitting device manufacturing method, package manufacturing method and package manufacturing die May. 14, 2013
8431223 Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications Apr. 30, 2013
8427855 Semiconductor nanocrystal composite Apr. 23, 2013
8410619 Granular epoxy resin composition for encapsulating semiconductor, semiconductor device using the same and method for producing semiconductor device Apr. 2, 2013
8399577 Curable epoxy resin composition Mar. 19, 2013
8362594 Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material Jan. 29, 2013
8324326 Epoxy resin composition and semiconductor device Dec. 4, 2012
8310069 Semiconductor package having marking layer Nov. 13, 2012
8304924 Composition for sealing semiconductor, semiconductor device, and process for producing semiconductor device Nov. 6, 2012
8288003 Method for producing phosphorus-containing phenolic compound, novel phosphorus-containing phenol, curable resin composition, cured product of the same, printed wiring board, and semiconductor Oct. 16, 2012
8278401 Radiation or thermally curable barrier sealants Oct. 2, 2012
8268673 Stacked electronic component and manufacturing method thereof Sep. 18, 2012
8269213 Epoxy resin composition for semiconductor encapsulation and semiconductor device produced by using the same Sep. 18, 2012
8232355 Liquid resin composition for electronic components and electronic component device Jul. 31, 2012
8222751 Electroconductive bonding material and electronic apparatus Jul. 17, 2012
8198382 Epoxy resin composition for photosemiconductor element encapsulation and cured product thereof, and photosemiconductor device using the same Jun. 12, 2012
8169090 Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same May. 1, 2012
8148831 Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device Apr. 3, 2012
8120189 Wiring terminal-connecting adhesive Feb. 21, 2012
8115323 Semiconductor package and method of manufacturing the semiconductor package Feb. 14, 2012
8106523 Liquid resin composition, semi-conductor device, and process of fabricating the same Jan. 31, 2012
8084130 Epoxy resin molding material for sealing and electronic component device Dec. 27, 2011
8084553 Curable adhesive compositions, process, and applications Dec. 27, 2011
8075721 Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability Dec. 13, 2011
8063156 Composition containing cycloaliphatic epoxide, polyol oligomer, and curing catalyst Nov. 22, 2011
8063318 Electronic component with wire bonds in low modulus fill encapsulant Nov. 22, 2011
8034447 Electronic components mounting adhesive and electronic components mounting structure Oct. 11, 2011
8017245 Composition for preparing organic insulator Sep. 13, 2011
8013435 Semiconductor module Sep. 6, 2011
8013456 Molded beam for optoelectronic sensor chip substrate Sep. 6, 2011
8008410 Epoxy resin composition for encapsulating semiconductor and semiconductor device Aug. 30, 2011

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