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Class Information
Number: 257/792
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated > With specified encapsulant > Including polyimide
Description: Subject matter wherein the encapsulant includes polyimide i.e., a polymeric compound resulting from replacement of both atoms of hydrogen in an organic amine by organic univalent acid radicals or by an organic divalent acid radical.

Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8710653 Chip on chip semiconductor device including an underfill layer having a resin containing an amine-based curing agent Apr. 29, 2014
8710682 Materials and methods for stress reduction in semiconductor wafer passivation layers Apr. 29, 2014
8643199 Thermoset polyimides for microelectronic applications Feb. 4, 2014
8618674 Semiconductor device including a sintered insulation material Dec. 31, 2013
8587119 Conductive feature for semiconductor substrate and method of manufacture Nov. 19, 2013
8502401 Polymeric compositions comprising per(phenylethynyl) arene derivatives Aug. 6, 2013
8461699 Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device Jun. 11, 2013
8450840 Ultra ruggedized ball grid array electronic components May. 28, 2013
8450856 Semiconductor device and method of forming the same May. 28, 2013
8415812 Materials and methods for stress reduction in semiconductor wafer passivation layers Apr. 9, 2013
8373287 Polymeric compositions comprising per(phenylethynyl) arene derivatives Feb. 12, 2013
8330264 Packaging configurations for vertical electronic devices using conductive traces disposed on laminated board layers Dec. 11, 2012
8310069 Semiconductor package having marking layer Nov. 13, 2012
8304924 Composition for sealing semiconductor, semiconductor device, and process for producing semiconductor device Nov. 6, 2012
8203221 Semiconductor device and method for manufacturing the same, and semiconductor sealing resin Jun. 19, 2012
8178972 Semiconductor device and manufacturing method therefor May. 15, 2012
8154124 Semiconductor device having a chip-size package Apr. 10, 2012
8120153 High-temperature, wirebondless, injection-molded, ultra-compact hybrid power module Feb. 21, 2012
8017245 Composition for preparing organic insulator Sep. 13, 2011
8018057 Semiconductor device with resin layers and wirings and method for manufacturing the same Sep. 13, 2011
8004078 Adhesive composition for semiconductor device Aug. 23, 2011
7989949 Heat extraction from packaged semiconductor chips, scalable with chip area Aug. 2, 2011
7964954 Integrated circuit having a semiconductor sensor device with embedded column-like spacers Jun. 21, 2011
7952212 Applications of smart polymer composites to integrated circuit packaging May. 31, 2011
7897433 Semiconductor chip with reinforcement layer and method of making the same Mar. 1, 2011
7838977 Packages for electronic devices implemented with laminated board with a top and a bottom patterned metal layers Nov. 23, 2010
7794127 Light emitting diode having grooves to modulate light emission thereof Sep. 14, 2010
7777355 Infrared-blocking encapsulant with organometallic colloids Aug. 17, 2010
7772658 Semiconductor device and method of manufacturing same Aug. 10, 2010
7687320 Manufacturing method for packaged semiconductor device Mar. 30, 2010
7646095 Semiconductor device Jan. 12, 2010
7605474 Structure of polymer-matrix conductive film and method for fabricating the same Oct. 20, 2009
7598609 Structure of polymer-matrix conductive film and method for fabricating the same Oct. 6, 2009
7576015 Methods for manufacturing alignment layer, active device array substrate and color filter substrate Aug. 18, 2009
7504670 Sealing structure for mounting a semiconductor device to a substrate Mar. 17, 2009
7485489 Electronics circuit manufacture Feb. 3, 2009
7435993 High temperature, high voltage SiC void-less electronic package Oct. 14, 2008
7432604 Semiconductor component and system having thinned, encapsulated dice Oct. 7, 2008
7417325 Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts Aug. 26, 2008
7399657 Ball grid array packages with thermally conductive containers Jul. 15, 2008
7397139 Epoxy resin molding material for sealing use and semiconductor device Jul. 8, 2008
7382060 Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts Jun. 3, 2008
7345368 Semiconductor device and the manufacturing method for the same Mar. 18, 2008
7335970 Semiconductor device having a chip-size package Feb. 26, 2008
7327022 Assembly, contact and coupling interconnection for optoelectronics Feb. 5, 2008
RE39957 Method of making semiconductor package with heat spreader Dec. 25, 2007
7288489 Process for thinning a semiconductor workpiece Oct. 30, 2007
7285867 Wiring structure on semiconductor substrate and method of fabricating the same Oct. 23, 2007
7285446 Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device Oct. 23, 2007
7239030 Flexible wiring board for tape carrier package having improved flame resistance Jul. 3, 2007

1 2 3 4 5

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