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Class Information
Number: 257/792
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated > With specified encapsulant > Including polyimide
Description: Subject matter wherein the encapsulant includes polyimide i.e., a polymeric compound resulting from replacement of both atoms of hydrogen in an organic amine by organic univalent acid radicals or by an organic divalent acid radical.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7435993 |
High temperature, high voltage SiC void-less electronic package |
Oct. 14, 2008 |
| 7432604 |
Semiconductor component and system having thinned, encapsulated dice |
Oct. 7, 2008 |
| 7417325 |
Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts |
Aug. 26, 2008 |
| 7399657 |
Ball grid array packages with thermally conductive containers |
Jul. 15, 2008 |
| 7397139 |
Epoxy resin molding material for sealing use and semiconductor device |
Jul. 8, 2008 |
| 7382060 |
Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts |
Jun. 3, 2008 |
| 7345368 |
Semiconductor device and the manufacturing method for the same |
Mar. 18, 2008 |
| 7335970 |
Semiconductor device having a chip-size package |
Feb. 26, 2008 |
| 7327022 |
Assembly, contact and coupling interconnection for optoelectronics |
Feb. 5, 2008 |
| RE39957 |
Method of making semiconductor package with heat spreader |
Dec. 25, 2007 |
| 7288489 |
Process for thinning a semiconductor workpiece |
Oct. 30, 2007 |
| 7285446 |
Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device |
Oct. 23, 2007 |
| 7285867 |
Wiring structure on semiconductor substrate and method of fabricating the same |
Oct. 23, 2007 |
| 7239022 |
Sensor device |
Jul. 3, 2007 |
| 7239030 |
Flexible wiring board for tape carrier package having improved flame resistance |
Jul. 3, 2007 |
| 7233059 |
Semiconductor arrangement |
Jun. 19, 2007 |
| 7224050 |
Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packaging |
May. 29, 2007 |
| 7211888 |
Encapsulation of pin solder for maintaining accuracy in pin position |
May. 1, 2007 |
| 7173322 |
COF flexible printed wiring board and method of producing the wiring board |
Feb. 6, 2007 |
| 7122910 |
Packaged semiconductor device |
Oct. 17, 2006 |
| 7115989 |
Adhesive sheet for producing a semiconductor device |
Oct. 3, 2006 |
| 7109055 |
Methods and apparatus having wafer level chip scale package for sensing elements |
Sep. 19, 2006 |
| 7109591 |
Integrated circuit device |
Sep. 19, 2006 |
| 7098545 |
Semiconductor device and method of enveloping an integrated circuit |
Aug. 29, 2006 |
| 7095124 |
Semiconductor device |
Aug. 22, 2006 |
| 7091605 |
Highly moisture-sensitive electronic device element and method for fabrication |
Aug. 15, 2006 |
| 7088010 |
Chip packaging compositions, packages and systems made therewith, and methods of making same |
Aug. 8, 2006 |
| 7075187 |
Coating material over electrodes to support organic synthesis |
Jul. 11, 2006 |
| 7067930 |
Liquid epoxy resin composition and semiconductor device |
Jun. 27, 2006 |
| 7015501 |
Substrate and organic electroluminescence device using the substrate |
Mar. 21, 2006 |
| 6998720 |
Semiconductor package device and method for fabricating the same |
Feb. 14, 2006 |
| 6998713 |
Wiring board and method for producing same |
Feb. 14, 2006 |
| 6992398 |
Underfill and encapsulation of carrier substrate-mounted flip-chip components |
Jan. 31, 2006 |
| 6977686 |
Solid-state image pickup apparatus limiting adhesive intrusion |
Dec. 20, 2005 |
| 6963133 |
Semiconductor device and method for manufacturing semiconductor device |
Nov. 8, 2005 |
| 6953982 |
Flexible skin incorporating MEMS technology |
Oct. 11, 2005 |
| 6946734 |
Integrated passive components and package with posts |
Sep. 20, 2005 |
| 6946730 |
Semiconductor device having heat conducting plate |
Sep. 20, 2005 |
| 6911726 |
Microelectronic packaging and methods for thermally protecting package interconnects and components |
Jun. 28, 2005 |
| 6903451 |
Chip scale packages manufactured at wafer level |
Jun. 7, 2005 |
| 6882050 |
Semiconductor device and method of manufacturing same |
Apr. 19, 2005 |
| 6873060 |
Electronic component with a semiconductor chip, method of producing an electronic component and a panel with a plurality of electronic components |
Mar. 29, 2005 |
| 6867506 |
Plastic ball grid array assembly |
Mar. 15, 2005 |
| 6861683 |
Optoelectronic component using two encapsulating materials and the method of making the same |
Mar. 1, 2005 |
| 6847125 |
Resin-encapsulated semiconductor apparatus and process for its fabrication |
Jan. 25, 2005 |
| 6833627 |
Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography |
Dec. 21, 2004 |
| 6831306 |
Extended length light emitting diode |
Dec. 14, 2004 |
| 6819003 |
Recessed encapsulated microelectronic devices and methods for formation |
Nov. 16, 2004 |
| 6812573 |
Semiconductor device and method for manufacturing the same |
Nov. 2, 2004 |
| 6803667 |
Semiconductor device having a protective film |
Oct. 12, 2004 |
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