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Class Information
Number: 257/791
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated > With specified encapsulant > Including polysiloxane (e.g., silicone resin)
Description: Subject matter wherein the encapsulant includes polysiloxane (i.e., any of various polymeric compounds which contain alternate silicon and oxygen atoms in either a linear or cyclic arrangement), often with one or two organic groups attached to each silicon atom.

Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8710158 Epoxy composition for encapsulating an optical semiconductor element Apr. 29, 2014
8710681 Isolation rings for blocking the interface between package components and the respective molding compound Apr. 29, 2014
8692394 Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device Apr. 8, 2014
8643200 Resin composition and transparent encapsulant formed using the same, and electronic device including the encapsulant Feb. 4, 2014
8643161 Semiconductor device having double side electrode structure Feb. 4, 2014
8618674 Semiconductor device including a sintered insulation material Dec. 31, 2013
8609472 Process for fabricating electronic components using liquid injection molding Dec. 17, 2013
8610293 Resin composition for encapsulating optical semiconductor element and optical semiconductor device Dec. 17, 2013
8502399 Resin composition for encapsulating semiconductor and semiconductor device Aug. 6, 2013
8482121 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus Jul. 9, 2013
8482117 Semiconductor device with electronic component incorporation substrate Jul. 9, 2013
8481656 Silicone resin composition and optical semiconductor device using the composition Jul. 9, 2013
8471280 Silicone based reflective underfill and thermal coupler Jun. 25, 2013
8461699 Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device Jun. 11, 2013
8455909 Semiconductor light emitting devices including flexible unitary film on aluminum nitride substrate Jun. 4, 2013
8427855 Semiconductor nanocrystal composite Apr. 23, 2013
8421249 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same Apr. 16, 2013
8373286 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device Feb. 12, 2013
8358018 Resin sealing structure for electronic component and resin sealing method for electronic component Jan. 22, 2013
8319242 Light-emitting semiconductor device, mounted substrate, and fabrication method thereof Nov. 27, 2012
8304924 Composition for sealing semiconductor, semiconductor device, and process for producing semiconductor device Nov. 6, 2012
8290015 Two-beam semiconductor laser apparatus Oct. 16, 2012
8257988 Method of making light emitting diodes Sep. 4, 2012
8237296 Selective UV-Ozone dry etching of anti-stiction coatings for MEMS device fabrication Aug. 7, 2012
8232355 Liquid resin composition for electronic components and electronic component device Jul. 31, 2012
8222752 Organopolysiloxane composition and semiconductor apparatus Jul. 17, 2012
8218296 Housing for an electronic device and sealing ring for a housing Jul. 10, 2012
8217409 Surface-textured encapsulations for use with light emitting diodes Jul. 10, 2012
8202933 Silicone resin composition for encapsulating luminescent element and process for producing optical-semiconductor electronic part with the same through potting Jun. 19, 2012
8203222 Semiconductor device and method of manufacturing the same Jun. 19, 2012
8193549 Surface-textured encapsulations for use with light emitting diodes Jun. 5, 2012
8164202 Optical semiconductor device encapsulated with silicone resin Apr. 24, 2012
8126026 Two-beam semiconductor laser device Feb. 28, 2012
8120189 Wiring terminal-connecting adhesive Feb. 21, 2012
8084130 Epoxy resin molding material for sealing and electronic component device Dec. 27, 2011
8076683 Surface-textured encapsulations for use with light emitting diodes Dec. 13, 2011
8053878 Substrate, semiconductor device using the same, method for inspecting semiconductor device, and method for manufacturing semiconductor device Nov. 8, 2011
8053275 Semiconductor device having double side electrode structure and method of producing the same Nov. 8, 2011
8035236 Semiconductor device comprising high performance encapsulation resins Oct. 11, 2011
8030756 Plastic ball grid array package with integral heatsink Oct. 4, 2011
8017245 Composition for preparing organic insulator Sep. 13, 2011
8013435 Semiconductor module Sep. 6, 2011
8004078 Adhesive composition for semiconductor device Aug. 23, 2011
8004096 Semiconductor device and a manufacturing method thereof Aug. 23, 2011
7982310 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus Jul. 19, 2011
7981977 Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler Jul. 19, 2011
7977412 Epoxy resin composition and semiconductor device Jul. 12, 2011
7968187 Surface coating Jun. 28, 2011
7968977 Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same Jun. 28, 2011
7964954 Integrated circuit having a semiconductor sensor device with embedded column-like spacers Jun. 21, 2011

1 2 3 4 5

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