| |
 |
|
Class Information
Number: 257/791
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated > With specified encapsulant > Including polysiloxane (e.g., silicone resin)
Description: Subject matter wherein the encapsulant includes polysiloxane (i.e., any of various polymeric compounds which contain alternate silicon and oxygen atoms in either a linear or cyclic arrangement), often with one or two organic groups attached to each silicon atom.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7449789 |
Light-emitting device, planar light source and direct type backlight module |
Nov. 11, 2008 |
| 7442653 |
Inter-metal dielectric of semiconductor device and manufacturing method thereof including plasma treating a plasma enhanced fluorosilicate glass |
Oct. 28, 2008 |
| 7399657 |
Ball grid array packages with thermally conductive containers |
Jul. 15, 2008 |
| 7378616 |
Heating apparatus and method for semiconductor devices |
May. 27, 2008 |
| 7358618 |
Semiconductor device and manufacturing method thereof |
Apr. 15, 2008 |
| 7332822 |
Flip chip system with organic/inorganic hybrid underfill composition |
Feb. 19, 2008 |
| 7317258 |
Thermal interface apparatus, systems, and fabrication methods |
Jan. 8, 2008 |
| 7294933 |
Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment |
Nov. 13, 2007 |
| 7288847 |
Assembly including a circuit and an encapsulation frame, and method of making the same |
Oct. 30, 2007 |
| 7288489 |
Process for thinning a semiconductor workpiece |
Oct. 30, 2007 |
| 7262510 |
Chip package structure |
Aug. 28, 2007 |
| 7186591 |
Method of encapsulating an assembly with a low temperature silicone rubber compound |
Mar. 6, 2007 |
| 7176572 |
Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment |
Feb. 13, 2007 |
| 7173322 |
COF flexible printed wiring board and method of producing the wiring board |
Feb. 6, 2007 |
| 7144763 |
Epoxy resin compositions, solid state devices encapsulated therewith and method |
Dec. 5, 2006 |
| 7115989 |
Adhesive sheet for producing a semiconductor device |
Oct. 3, 2006 |
| 7109591 |
Integrated circuit device |
Sep. 19, 2006 |
| 7098545 |
Semiconductor device and method of enveloping an integrated circuit |
Aug. 29, 2006 |
| 7095124 |
Semiconductor device |
Aug. 22, 2006 |
| 7075187 |
Coating material over electrodes to support organic synthesis |
Jul. 11, 2006 |
| 7038328 |
Anti-reflective compositions comprising triazine compounds |
May. 2, 2006 |
| 7015501 |
Substrate and organic electroluminescence device using the substrate |
Mar. 21, 2006 |
| 6989595 |
Molds configured to pattern masses associated with semiconductor constructions |
Jan. 24, 2006 |
| 6974762 |
Adhesion of carbon doped oxides by silanization |
Dec. 13, 2005 |
| 6972495 |
Compliant package with conductive elastomeric posts |
Dec. 6, 2005 |
| 6962957 |
Epoxy resin composition for semiconductor encapsulation, process for producing the same, and semiconductor device |
Nov. 8, 2005 |
| 6946730 |
Semiconductor device having heat conducting plate |
Sep. 20, 2005 |
| 6940177 |
Semiconductor package and method of preparing same |
Sep. 6, 2005 |
| 6916889 |
Epoxy resin compositions, solid state devices encapsulated therewith and method |
Jul. 12, 2005 |
| 6913947 |
Multi-layer circuit board and method of manufacturing the same |
Jul. 5, 2005 |
| 6867506 |
Plastic ball grid array assembly |
Mar. 15, 2005 |
| 6861683 |
Optoelectronic component using two encapsulating materials and the method of making the same |
Mar. 1, 2005 |
| 6844568 |
Photoelectric conversion device and manufacturing process thereof |
Jan. 18, 2005 |
| 6831306 |
Extended length light emitting diode |
Dec. 14, 2004 |
| 6783692 |
Heat softening thermally conductive compositions and methods for their preparation |
Aug. 31, 2004 |
| 6784512 |
Photodiode and method of producing same |
Aug. 31, 2004 |
| 6784555 |
Die attach adhesives for semiconductor applications utilizing a polymeric base material with inorganic insulator particles of various sizes |
Aug. 31, 2004 |
| 6774405 |
Light-emitting device |
Aug. 10, 2004 |
| 6762511 |
Thermosetting resin composition |
Jul. 13, 2004 |
| 6762510 |
Flexible integrated monolithic circuit |
Jul. 13, 2004 |
| 6733902 |
Liquid epoxy resin composition and semiconductor device |
May. 11, 2004 |
| 6724093 |
Semiconductor devices and their manufacture |
Apr. 20, 2004 |
| 6724079 |
Wire bond-less electronic component for use with an external circuit and method of manufacture |
Apr. 20, 2004 |
| 6710377 |
Light emitting device having a silicone resin |
Mar. 23, 2004 |
| 6664648 |
Apparatus for applying a semiconductor chip to a carrier element with a compensating layer |
Dec. 16, 2003 |
| 6663943 |
Surface acoustic wave device and method for making the same |
Dec. 16, 2003 |
| 6661076 |
Semiconductor device |
Dec. 9, 2003 |
| 6655022 |
Implementing micro BGA assembly techniques for small die |
Dec. 2, 2003 |
| 6653731 |
Semiconductor device and method for fabricating same |
Nov. 25, 2003 |
| 6649258 |
Heat conductive silicone composition and semiconductor device |
Nov. 18, 2003 |
|
|
|
