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Class Information
Number: 257/790
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated > With specified encapsulant > Plural encapsulating layers
Description: Subject matter wherein the encapsulant is made up of more than one layer.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619314 |
Integrated circuit package system including die stacking |
Nov. 17, 2009 |
| 7614142 |
Method for fabricating an interposer |
Nov. 10, 2009 |
| 7592690 |
Semiconductor device including semiconductor elements mounted on base plate |
Sep. 22, 2009 |
| 7588965 |
Stencil and method for depositing material onto a substrate |
Sep. 15, 2009 |
| 7582960 |
Multiple chip package module including die stacked over encapsulated package |
Sep. 1, 2009 |
| 7569925 |
Module with built-in component |
Aug. 4, 2009 |
| 7566978 |
Semiconductor device and programming method |
Jul. 28, 2009 |
| 7552532 |
Method for hermetically encapsulating a component |
Jun. 30, 2009 |
| 7547975 |
Module with embedded semiconductor IC and method of fabricating the module |
Jun. 16, 2009 |
| 7541222 |
Wire sweep resistant semiconductor package and manufacturing method therefor |
Jun. 2, 2009 |
| 7528477 |
Castellation wafer level packaging of integrated circuit chips |
May. 5, 2009 |
| 7514793 |
Metal interconnection lines of semiconductor devices and methods of forming the same |
Apr. 7, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7492048 |
CMOS sensors having charge pushing regions |
Feb. 17, 2009 |
| 7485489 |
Electronics circuit manufacture |
Feb. 3, 2009 |
| 7482702 |
Semiconductor component sealed on five sides by polymer sealing layer |
Jan. 27, 2009 |
| 7476975 |
Semiconductor device and resin structure therefor |
Jan. 13, 2009 |
| 7435625 |
Semiconductor device with reduced package cross-talk and loss |
Oct. 14, 2008 |
| 7432604 |
Semiconductor component and system having thinned, encapsulated dice |
Oct. 7, 2008 |
| 7427813 |
Structure, material, and design for assembling a low-K Si die to achieve an industrial grade reliability wire bonding package |
Sep. 23, 2008 |
| 7417330 |
Semiconductor device packaged into chip size and manufacturing method thereof |
Aug. 26, 2008 |
| 7408242 |
Carrier with reinforced leads that are to be connected to a chip |
Aug. 5, 2008 |
| 7405656 |
Device and method for encapsulation and mounting of RFID devices |
Jul. 29, 2008 |
| 7399657 |
Ball grid array packages with thermally conductive containers |
Jul. 15, 2008 |
| 7391101 |
Semiconductor pressure sensor |
Jun. 24, 2008 |
| 7388297 |
Semiconductor device with reduced thickness of the semiconductor substrate |
Jun. 17, 2008 |
| 7382060 |
Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts |
Jun. 3, 2008 |
| 7378745 |
Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns |
May. 27, 2008 |
| 7375435 |
Chip package structure |
May. 20, 2008 |
| 7365442 |
Encapsulation of thin-film electronic devices |
Apr. 29, 2008 |
| 7358618 |
Semiconductor device and manufacturing method thereof |
Apr. 15, 2008 |
| 7355290 |
Interposer and method for fabricating the same |
Apr. 8, 2008 |
| 7339280 |
Semiconductor package with lead frame as chip carrier and method for fabricating the same |
Mar. 4, 2008 |
| RE39957 |
Method of making semiconductor package with heat spreader |
Dec. 25, 2007 |
| 7298038 |
Integrated circuit package system including die stacking |
Nov. 20, 2007 |
| 7294530 |
Method for encapsulating multiple integrated circuits |
Nov. 13, 2007 |
| 7294933 |
Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment |
Nov. 13, 2007 |
| 7291905 |
Lead frame, semiconductor device produced by using the same and method of producing the semiconductor device |
Nov. 6, 2007 |
| 7291926 |
Multi-chip package structure |
Nov. 6, 2007 |
| 7287321 |
Multi-layer board manufacturing method |
Oct. 30, 2007 |
| 7288489 |
Process for thinning a semiconductor workpiece |
Oct. 30, 2007 |
| 7279781 |
Two-stage transfer molding device to encapsulate MMC module |
Oct. 9, 2007 |
| 7274110 |
Semiconductor component having a CSP housing |
Sep. 25, 2007 |
| 7271496 |
Integrated circuit package-in-package system |
Sep. 18, 2007 |
| 7265454 |
Semiconductor device and method of producing high contrast identification mark |
Sep. 4, 2007 |
| 7262074 |
Methods of fabricating underfilled, encapsulated semiconductor die assemblies |
Aug. 28, 2007 |
| 7262510 |
Chip package structure |
Aug. 28, 2007 |
| 7253532 |
Electrical or electronic component and method of producing same |
Aug. 7, 2007 |
| 7247934 |
Multi-chip semiconductor package |
Jul. 24, 2007 |
| 7238878 |
Photovoltaic module with light reflecting backskin |
Jul. 3, 2007 |
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