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Browse by Category: Main > Physics
Class Information
Number: 257/790
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated > With specified encapsulant > Plural encapsulating layers
Description: Subject matter wherein the encapsulant is made up of more than one layer.


Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
7619314 Integrated circuit package system including die stacking Nov. 17, 2009
7614142 Method for fabricating an interposer Nov. 10, 2009
7592690 Semiconductor device including semiconductor elements mounted on base plate Sep. 22, 2009
7588965 Stencil and method for depositing material onto a substrate Sep. 15, 2009
7582960 Multiple chip package module including die stacked over encapsulated package Sep. 1, 2009
7569925 Module with built-in component Aug. 4, 2009
7566978 Semiconductor device and programming method Jul. 28, 2009
7552532 Method for hermetically encapsulating a component Jun. 30, 2009
7547975 Module with embedded semiconductor IC and method of fabricating the module Jun. 16, 2009
7541222 Wire sweep resistant semiconductor package and manufacturing method therefor Jun. 2, 2009
7528477 Castellation wafer level packaging of integrated circuit chips May. 5, 2009
7514793 Metal interconnection lines of semiconductor devices and methods of forming the same Apr. 7, 2009
7504670 Sealing structure for mounting a semiconductor device to a substrate Mar. 17, 2009
7492048 CMOS sensors having charge pushing regions Feb. 17, 2009
7485489 Electronics circuit manufacture Feb. 3, 2009
7482702 Semiconductor component sealed on five sides by polymer sealing layer Jan. 27, 2009
7476975 Semiconductor device and resin structure therefor Jan. 13, 2009
7435625 Semiconductor device with reduced package cross-talk and loss Oct. 14, 2008
7432604 Semiconductor component and system having thinned, encapsulated dice Oct. 7, 2008
7427813 Structure, material, and design for assembling a low-K Si die to achieve an industrial grade reliability wire bonding package Sep. 23, 2008
7417330 Semiconductor device packaged into chip size and manufacturing method thereof Aug. 26, 2008
7408242 Carrier with reinforced leads that are to be connected to a chip Aug. 5, 2008
7405656 Device and method for encapsulation and mounting of RFID devices Jul. 29, 2008
7399657 Ball grid array packages with thermally conductive containers Jul. 15, 2008
7391101 Semiconductor pressure sensor Jun. 24, 2008
7388297 Semiconductor device with reduced thickness of the semiconductor substrate Jun. 17, 2008
7382060 Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts Jun. 3, 2008
7378745 Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns May. 27, 2008
7375435 Chip package structure May. 20, 2008
7365442 Encapsulation of thin-film electronic devices Apr. 29, 2008
7358618 Semiconductor device and manufacturing method thereof Apr. 15, 2008
7355290 Interposer and method for fabricating the same Apr. 8, 2008
7339280 Semiconductor package with lead frame as chip carrier and method for fabricating the same Mar. 4, 2008
RE39957 Method of making semiconductor package with heat spreader Dec. 25, 2007
7298038 Integrated circuit package system including die stacking Nov. 20, 2007
7294530 Method for encapsulating multiple integrated circuits Nov. 13, 2007
7294933 Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment Nov. 13, 2007
7291905 Lead frame, semiconductor device produced by using the same and method of producing the semiconductor device Nov. 6, 2007
7291926 Multi-chip package structure Nov. 6, 2007
7287321 Multi-layer board manufacturing method Oct. 30, 2007
7288489 Process for thinning a semiconductor workpiece Oct. 30, 2007
7279781 Two-stage transfer molding device to encapsulate MMC module Oct. 9, 2007
7274110 Semiconductor component having a CSP housing Sep. 25, 2007
7271496 Integrated circuit package-in-package system Sep. 18, 2007
7265454 Semiconductor device and method of producing high contrast identification mark Sep. 4, 2007
7262074 Methods of fabricating underfilled, encapsulated semiconductor die assemblies Aug. 28, 2007
7262510 Chip package structure Aug. 28, 2007
7253532 Electrical or electronic component and method of producing same Aug. 7, 2007
7247934 Multi-chip semiconductor package Jul. 24, 2007
7238878 Photovoltaic module with light reflecting backskin Jul. 3, 2007

1 2 3 4 5 6 7


 
 
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