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Browse by Category: Main > Physics
Class Information
Number: 257/790
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated > With specified encapsulant > Plural encapsulating layers
Description: Subject matter wherein the encapsulant is made up of more than one layer.










Patents under this class:
1 2 3 4 5 6 7 8 9 10

Patent Number Title Of Patent Date Issued
8680693 OLED having stacked organic light-emitting units Mar. 25, 2014
8680683 Wafer level package with embedded passive components and method of manufacturing Mar. 25, 2014
8674397 Sealing film forming method, sealing film forming device, and light-emitting device Mar. 18, 2014
8664780 Semiconductor package having plural semiconductor chips and method of forming the same Mar. 4, 2014
8659129 Semiconductor device and method of manufacturing same Feb. 25, 2014
8653676 Semiconductor package and method of manufacturing the same Feb. 18, 2014
8653652 Semiconductor device, power semiconductor module and power conversion device equipped with power semiconductor module Feb. 18, 2014
8637992 Flip chip package for DRAM with two underfill materials Jan. 28, 2014
8624408 Circuit device and method of manufacturing the same Jan. 7, 2014
8624368 Quad flat non-leaded semiconductor package Jan. 7, 2014
8618674 Semiconductor device including a sintered insulation material Dec. 31, 2013
8614475 Void free interlayer dielectric Dec. 24, 2013
8614517 Semiconductor device and method of manufacturing the same Dec. 24, 2013
8609473 Method for fabricating a neo-layer using stud bumped bare die Dec. 17, 2013
8610292 Resin sealing method of semiconductor device Dec. 17, 2013
8604615 Semiconductor device including a stack of semiconductor chips, underfill material and molding material Dec. 10, 2013
8598706 Method for forming interlayer dielectric film, interlayer dielectric film, semiconductor device and semiconductor manufacturing apparatus Dec. 3, 2013
8575763 Semiconductor device and method of manufacturing the same Nov. 5, 2013
8558399 Dual molded multi-chip package system Oct. 15, 2013
8530282 Semiconductor device and programming method Sep. 10, 2013
8531043 Planar encapsulation and mold cavity package in package system Sep. 10, 2013
8531045 Component packaging and assembly Sep. 10, 2013
8525355 Semiconductor device, electronic apparatus and semiconductor device fabricating method Sep. 3, 2013
8507080 Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting material Aug. 13, 2013
8502400 Methods and apparatuses to stiffen integrated circuit package Aug. 6, 2013
8482139 Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards Jul. 9, 2013
8476776 Semiconductor module, method for fabricating the semiconductor module, and mobile apparatus Jul. 2, 2013
8466568 Multi-component device integrated into a matrix Jun. 18, 2013
8450861 Integrated circuit device with semiconductor device components embedded in plastic housing composition May. 28, 2013
8446021 Microfluidic component and method for manufacturing same May. 21, 2013
8440478 Light emitting device, package, light emitting device manufacturing method, package manufacturing method and package manufacturing die May. 14, 2013
8441136 Protection layer for adhesive material at wafer edge May. 14, 2013
8435605 Flexible substrates having a thin-film barrier May. 7, 2013
8434158 Systems and methods for detecting and thwarting unauthorized access and hostile attacks on secured systems Apr. 30, 2013
8431223 Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications Apr. 30, 2013
8410620 Primer resin for semiconductor device and semiconductor device Apr. 2, 2013
8405228 Integrated circuit packaging system with package underfill and method of manufacture thereof Mar. 26, 2013
8405233 Flexible barrier film, method of forming same, and organic electronic device including same Mar. 26, 2013
8373285 Chip module Feb. 12, 2013
8368233 Semiconductor device with improved resin configuration Feb. 5, 2013
8358018 Resin sealing structure for electronic component and resin sealing method for electronic component Jan. 22, 2013
8344268 Electronic component packaging structure having two-layer moisture-proof coating and method for manufacturing the same Jan. 1, 2013
8319355 Light emitting device Nov. 27, 2012
8310040 Semiconductor device package having high breakdown voltage and low parasitic inductance and method of manufacturing thereof Nov. 13, 2012
8310069 Semiconductor package having marking layer Nov. 13, 2012
8278749 Integrated antennas in wafer level package Oct. 2, 2012
8274143 Semiconductor device, method of forming the same, and electronic device Sep. 25, 2012
8247809 Organic light emitting diode display Aug. 21, 2012
8232658 Stackable integrated circuit package system with multiple interconnect interface Jul. 31, 2012
8232145 Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards Jul. 31, 2012

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