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Class Information
Number: 257/789
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated > With specified encapsulant > With specified filler material
Description: Subject matter wherein a particular material has been added to an encapsulant material to give it desirable mechanical, thermal, electrical, or other desirable characteristics, and the material is specified.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619318 |
No-flow underfill composition and method |
Nov. 17, 2009 |
| 7612458 |
Epoxy resin composition for semiconductor encapsulating use, and semiconductor device |
Nov. 3, 2009 |
| 7598126 |
Use of nanoscale particles for creating scratch-resistant protective layers on semiconductor chips |
Oct. 6, 2009 |
| 7588965 |
Stencil and method for depositing material onto a substrate |
Sep. 15, 2009 |
| 7579698 |
Photodetector sealing resin is a boride or an oxide of micro particles |
Aug. 25, 2009 |
| 7554197 |
High frequency IC package and method for fabricating the same |
Jun. 30, 2009 |
| 7550843 |
Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member |
Jun. 23, 2009 |
| 7547978 |
Underfill and encapsulation of semiconductor assemblies with materials having differing properties |
Jun. 16, 2009 |
| 7521276 |
Compliant terminal mountings with vented spaces and methods |
Apr. 21, 2009 |
| 7517726 |
Wire bonded chip scale package fabrication methods |
Apr. 14, 2009 |
| 7514769 |
Micro surface mount die package and method |
Apr. 7, 2009 |
| 7511383 |
Flame retardant and an epoxy resin composition comprising the same for encapsulating semiconductor devices |
Mar. 31, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7495344 |
Semiconductor apparatus |
Feb. 24, 2009 |
| 7489025 |
Device and method for fabricating double-sided SOI wafer scale package with optical through via connections |
Feb. 10, 2009 |
| 7476702 |
Polymer electronic device package having high thermal conductivity and dielectric strength |
Jan. 13, 2009 |
| 7476981 |
Electronic module with layer of adhesive and process for producing it |
Jan. 13, 2009 |
| 7442653 |
Inter-metal dielectric of semiconductor device and manufacturing method thereof including plasma treating a plasma enhanced fluorosilicate glass |
Oct. 28, 2008 |
| 7435625 |
Semiconductor device with reduced package cross-talk and loss |
Oct. 14, 2008 |
| 7432603 |
Semiconductor encapsulating epoxy resin composition and semiconductor device |
Oct. 7, 2008 |
| 7429800 |
Molding composition and method, and molded article |
Sep. 30, 2008 |
| 7420220 |
Semiconductor light emitting device |
Sep. 2, 2008 |
| 7397139 |
Epoxy resin molding material for sealing use and semiconductor device |
Jul. 8, 2008 |
| 7397140 |
Chip module |
Jul. 8, 2008 |
| 7388297 |
Semiconductor device with reduced thickness of the semiconductor substrate |
Jun. 17, 2008 |
| 7382059 |
Semiconductor package structure and method of manufacture |
Jun. 3, 2008 |
| 7381359 |
Method for making filled epoxy resin compositions |
Jun. 3, 2008 |
| 7358618 |
Semiconductor device and manufacturing method thereof |
Apr. 15, 2008 |
| 7352069 |
Electronic component unit |
Apr. 1, 2008 |
| 7352070 |
Polymer encapsulated electrical devices |
Apr. 1, 2008 |
| 7339276 |
Underfilling process in a molded matrix array package using flow front modifying solder resist |
Mar. 4, 2008 |
| 7339281 |
Circuit device and manufacturing method thereof |
Mar. 4, 2008 |
| 7332822 |
Flip chip system with organic/inorganic hybrid underfill composition |
Feb. 19, 2008 |
| 7327039 |
Nanoparticle filled underfill |
Feb. 5, 2008 |
| 7327019 |
Semiconductor device of a charge storage type |
Feb. 5, 2008 |
| 7312536 |
Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same |
Dec. 25, 2007 |
| 7307286 |
Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same |
Dec. 11, 2007 |
| 7291926 |
Multi-chip package structure |
Nov. 6, 2007 |
| 7288489 |
Process for thinning a semiconductor workpiece |
Oct. 30, 2007 |
| 7274099 |
Method of embedding semiconductor chip in support plate |
Sep. 25, 2007 |
| 7268421 |
Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond |
Sep. 11, 2007 |
| 7265167 |
Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same |
Sep. 4, 2007 |
| 7262510 |
Chip package structure |
Aug. 28, 2007 |
| 7262507 |
Semiconductor-mounted device and method for producing same |
Aug. 28, 2007 |
| 7253528 |
Trace design to minimize electromigration damage to solder bumps |
Aug. 7, 2007 |
| 7250673 |
Signal isolation in a package substrate |
Jul. 31, 2007 |
| 7247928 |
Semiconductor device with electrical connection balls between an integrated circuit chip and a support plate, and process for fabricating it |
Jul. 24, 2007 |
| 7247934 |
Multi-chip semiconductor package |
Jul. 24, 2007 |
| 7229857 |
Method for producing a protection for chip edges and system for the protection of chip edges |
Jun. 12, 2007 |
| 7227252 |
Semiconductor component having stacked, encapsulated dice and method of fabrication |
Jun. 5, 2007 |
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