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Class Information
Number: 257/789
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated > With specified encapsulant > With specified filler material
Description: Subject matter wherein a particular material has been added to an encapsulant material to give it desirable mechanical, thermal, electrical, or other desirable characteristics, and the material is specified.










Patents under this class:
1 2 3 4 5 6 7 8 9

Patent Number Title Of Patent Date Issued
8710653 Chip on chip semiconductor device including an underfill layer having a resin containing an amine-based curing agent Apr. 29, 2014
8704223 Semiconductor device Apr. 22, 2014
8692394 Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device Apr. 8, 2014
8680664 Structure for encapsulating an electronic device Mar. 25, 2014
8648479 Epoxy resin composition for semiconductor encapsulant and semiconductor device using the same Feb. 11, 2014
8643200 Resin composition and transparent encapsulant formed using the same, and electronic device including the encapsulant Feb. 4, 2014
8633602 Semiconductor device, and method and apparatus for manufacturing the same Jan. 21, 2014
8633585 Device comprising an encapsulation unit Jan. 21, 2014
8629566 Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance Jan. 14, 2014
8618674 Semiconductor device including a sintered insulation material Dec. 31, 2013
8610293 Resin composition for encapsulating optical semiconductor element and optical semiconductor device Dec. 17, 2013
8604615 Semiconductor device including a stack of semiconductor chips, underfill material and molding material Dec. 10, 2013
8598692 Semiconductor device and method for manufacturing same Dec. 3, 2013
8592504 Amorphous siliceous powder, process for production thereof, resin composition, and semiconductor encapsulation material Nov. 26, 2013
8593825 Apparatus and method for vertically-structured passive components Nov. 26, 2013
8563362 Method of producing semiconductor chip laminate comprising an adhesive that comprises a curing compound, curing agent and spacer particles Oct. 22, 2013
8552418 Semiconductor device and manufacturing method thereof Oct. 8, 2013
8530890 Aligned nanotube bearing composite material Sep. 10, 2013
8502399 Resin composition for encapsulating semiconductor and semiconductor device Aug. 6, 2013
8497579 Semiconductor packaging method and structure thereof Jul. 30, 2013
8492909 Insulating member, metal base substrate, and semiconductor module, and manufacturing methods thereof Jul. 23, 2013
8471280 Silicone based reflective underfill and thermal coupler Jun. 25, 2013
8421249 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same Apr. 16, 2013
8405233 Flexible barrier film, method of forming same, and organic electronic device including same Mar. 26, 2013
8395249 Sealed cavity Mar. 12, 2013
8378472 Mounting structure for semiconductor element with underfill resin Feb. 19, 2013
8378503 Apparatus for thermal control of semiconductor chip assembly and underfill Feb. 19, 2013
8338935 Thermally enhanced electronic package utilizing carbon nanocapsules and method of manufacturing the same Dec. 25, 2012
8324718 Warp-suppressed semiconductor device Dec. 4, 2012
8319355 Light emitting device Nov. 27, 2012
8318549 Molded semiconductor package having a filler material Nov. 27, 2012
8278401 Radiation or thermally curable barrier sealants Oct. 2, 2012
8222750 Aligned nanotube bearing composite material Jul. 17, 2012
8222751 Electroconductive bonding material and electronic apparatus Jul. 17, 2012
8217518 Enhancing metal/low-K interconnect reliability using a protection layer Jul. 10, 2012
8212369 Semiconductor wafer coated with a filled, spin-coatable material Jul. 3, 2012
8207620 Flip-chip semiconductor package and chip carrier for preventing corner delamination Jun. 26, 2012
8207619 Semiconductor device and method of manufacturing the same Jun. 26, 2012
8159067 Underfill flow guide structures Apr. 17, 2012
8148829 Self repairing IC package design Apr. 3, 2012
8134227 Stacked integrated circuit package system with conductive spacer Mar. 13, 2012
8129827 Integrated circuit package system with package encapsulation having recess Mar. 6, 2012
8125090 Semiconductor power module Feb. 28, 2012
8120189 Wiring terminal-connecting adhesive Feb. 21, 2012
8120153 High-temperature, wirebondless, injection-molded, ultra-compact hybrid power module Feb. 21, 2012
8119449 Method of manufacturing an electronic part mounting structure Feb. 21, 2012
8105687 Electroconductive bonding material and electronic apparatus Jan. 31, 2012
8105881 Method of fabricating chip package structure Jan. 31, 2012
8093699 Circuit device with circuit board and semiconductor chip mounted thereon Jan. 10, 2012
8093704 Package on package using a bump-less build up layer (BBUL) package Jan. 10, 2012

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