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Class Information
Number: 257/788
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated > With specified encapsulant
Description: Subject matter wherein the chemical composition of the material that encapsulates the active solid-state electronic device is specified.










Sub-classes under this class:

Class Number Class Name Patents
257/793 Including epoxide 343
257/794 Including glass 147
257/792 Including polyimide 213
257/791 Including polysiloxane (e.g., silicone resin) 227
257/790 Plural encapsulating layers 470
257/789 With specified filler material 416


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13

Patent Number Title Of Patent Date Issued
8710653 Chip on chip semiconductor device including an underfill layer having a resin containing an amine-based curing agent Apr. 29, 2014
8710681 Isolation rings for blocking the interface between package components and the respective molding compound Apr. 29, 2014
8674502 Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device Mar. 18, 2014
8664779 Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus Mar. 4, 2014
8653675 Package including at least one topological feature on an encapsulant material to resist out-of-plane deformation Feb. 18, 2014
8648479 Epoxy resin composition for semiconductor encapsulant and semiconductor device using the same Feb. 11, 2014
8642387 Method of fabricating stacked packages using laser direct structuring Feb. 4, 2014
8643199 Thermoset polyimides for microelectronic applications Feb. 4, 2014
8637979 Semiconductor device Jan. 28, 2014
8629567 Integrated circuit packaging system with contacts and method of manufacture thereof Jan. 14, 2014
8629003 Epoxy encapsulating and lamination adhesive and method of making same Jan. 14, 2014
8610292 Resin sealing method of semiconductor device Dec. 17, 2013
8604615 Semiconductor device including a stack of semiconductor chips, underfill material and molding material Dec. 10, 2013
8599539 Ceramic chip assembly Dec. 3, 2013
8581402 Molded chip interposer structure and methods Nov. 12, 2013
8581362 Wireless communication devices with in-package integrated passive components Nov. 12, 2013
8575768 Radiation-curable ink jet composition and ink jet recording method Nov. 5, 2013
8564026 Chip, method for producing a chip and device for laser ablation Oct. 22, 2013
8564142 Radiation curable ink jet ink composition and ink jet recording method Oct. 22, 2013
8558400 Semiconductor packages and methods of fabricating the same Oct. 15, 2013
8546959 Resin composition for encapsulating semiconductor, method for producing semiconductor device and semiconductor device Oct. 1, 2013
8541260 Exposed die overmolded flip chip package and fabrication method Sep. 24, 2013
8530929 Melt-processable, injection-moldable thermoplastic polymer composition and semi-conductive devices fabricated therewith Sep. 10, 2013
8531043 Planar encapsulation and mold cavity package in package system Sep. 10, 2013
8531045 Component packaging and assembly Sep. 10, 2013
8519544 Semiconductor device and method of forming WLCSP structure using protruded MLP Aug. 27, 2013
8502398 Wiring board, semiconductor apparatus and method of manufacturing them Aug. 6, 2013
8502399 Resin composition for encapsulating semiconductor and semiconductor device Aug. 6, 2013
8502401 Polymeric compositions comprising per(phenylethynyl) arene derivatives Aug. 6, 2013
8497579 Semiconductor packaging method and structure thereof Jul. 30, 2013
8492908 Atomic layer deposition encapsulation for power amplifiers in RF circuits Jul. 23, 2013
8492910 Underfill method and chip package Jul. 23, 2013
8482117 Semiconductor device with electronic component incorporation substrate Jul. 9, 2013
8476748 Exposed die overmolded flip chip package and fabrication method Jul. 2, 2013
8471280 Silicone based reflective underfill and thermal coupler Jun. 25, 2013
8460969 Method for encapsulating an electronic arrangement Jun. 11, 2013
8461699 Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device Jun. 11, 2013
8436471 Semiconductor package with its surface edge covered by resin May. 7, 2013
8426986 Phase separated curable compositions Apr. 23, 2013
8421203 Integrated circuit packaging system with foldable substrate and method of manufacture thereof Apr. 16, 2013
8421249 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same Apr. 16, 2013
8410619 Granular epoxy resin composition for encapsulating semiconductor, semiconductor device using the same and method for producing semiconductor device Apr. 2, 2013
8410377 Mounted structure Apr. 2, 2013
8405233 Flexible barrier film, method of forming same, and organic electronic device including same Mar. 26, 2013
8390134 Semiconductor device having surface protective films on bond pad Mar. 5, 2013
8378501 Semiconductor package and semiconductor package module Feb. 19, 2013
8373287 Polymeric compositions comprising per(phenylethynyl) arene derivatives Feb. 12, 2013
8373286 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device Feb. 12, 2013
8373284 Semiconductor device Feb. 12, 2013
8368235 Resin sealing method of semiconductor device Feb. 5, 2013

1 2 3 4 5 6 7 8 9 10 11 12 13










 
 
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