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Class Information
Number: 257/788
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated > With specified encapsulant
Description: Subject matter wherein the chemical composition of the material that encapsulates the active solid-state electronic device is specified.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7436076 |
Micromechanical component having an anodically bonded cap and a manufacturing method |
Oct. 14, 2008 |
| 7436075 |
Ion beam irradiation apparatus and ion beam irradiation method |
Oct. 14, 2008 |
| 7436002 |
Surface-mountable radiation-emitting component |
Oct. 14, 2008 |
| 7425731 |
Light emitting diode package |
Sep. 16, 2008 |
| 7397140 |
Chip module |
Jul. 8, 2008 |
| 7391102 |
Semiconductor apparatus configured with a lead frame having sufficient strenght to protect against external forces |
Jun. 24, 2008 |
| 7382059 |
Semiconductor package structure and method of manufacture |
Jun. 3, 2008 |
| 7382060 |
Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts |
Jun. 3, 2008 |
| 7374969 |
Semiconductor package with conductive molding compound and manufacturing method thereof |
May. 20, 2008 |
| 7371618 |
Method of manufacturing wafer-level chip-size package and molding apparatus used in the method |
May. 13, 2008 |
| 7335982 |
Chip package structure and chip packaging process |
Feb. 26, 2008 |
| 7327019 |
Semiconductor device of a charge storage type |
Feb. 5, 2008 |
| 7317258 |
Thermal interface apparatus, systems, and fabrication methods |
Jan. 8, 2008 |
| 7312536 |
Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same |
Dec. 25, 2007 |
| 7294530 |
Method for encapsulating multiple integrated circuits |
Nov. 13, 2007 |
| 7291905 |
Lead frame, semiconductor device produced by using the same and method of producing the semiconductor device |
Nov. 6, 2007 |
| 7288489 |
Process for thinning a semiconductor workpiece |
Oct. 30, 2007 |
| 7282806 |
Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material |
Oct. 16, 2007 |
| 7268421 |
Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond |
Sep. 11, 2007 |
| 7265453 |
Semiconductor component having dummy segments with trapped corner air |
Sep. 4, 2007 |
| 7262498 |
Assembly with a ring and bonding pads formed of a same material on a substrate |
Aug. 28, 2007 |
| 7262507 |
Semiconductor-mounted device and method for producing same |
Aug. 28, 2007 |
| 7262509 |
Microelectronic assembly having a perimeter around a MEMS device |
Aug. 28, 2007 |
| 7262514 |
Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device |
Aug. 28, 2007 |
| 7262510 |
Chip package structure |
Aug. 28, 2007 |
| 7259455 |
Semiconductor device |
Aug. 21, 2007 |
| 7250328 |
Microelectronic component assemblies with recessed wire bonds and methods of making same |
Jul. 31, 2007 |
| 7247934 |
Multi-chip semiconductor package |
Jul. 24, 2007 |
| 7242582 |
Semiconductor module mounting structure, a cardlike semiconductor module, and heat receiving members bonded to the cardlike semiconductor module |
Jul. 10, 2007 |
| 7238878 |
Photovoltaic module with light reflecting backskin |
Jul. 3, 2007 |
| 7235873 |
Protective device for subassemblies and method for producing a protective device |
Jun. 26, 2007 |
| 7230829 |
Overmolded electronic assembly with insert molded heat sinks |
Jun. 12, 2007 |
| 7227252 |
Semiconductor component having stacked, encapsulated dice and method of fabrication |
Jun. 5, 2007 |
| 7224050 |
Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packaging |
May. 29, 2007 |
| 7211888 |
Encapsulation of pin solder for maintaining accuracy in pin position |
May. 1, 2007 |
| 7196426 |
Multilayered substrate for semiconductor device |
Mar. 27, 2007 |
| 7193331 |
Semiconductor device and manufacturing process thereof |
Mar. 20, 2007 |
| 7183588 |
Light emission device |
Feb. 27, 2007 |
| 7183657 |
Semiconductor device having resin anti-bleed feature |
Feb. 27, 2007 |
| 7183661 |
Epoxy-resin systems, which are resistant to aging, moulding materials, components produced therefrom and the use thereof |
Feb. 27, 2007 |
| 7180194 |
Semiconductor device with multi-staged cut side surfaces |
Feb. 20, 2007 |
| 7176044 |
B-stageable die attach adhesives |
Feb. 13, 2007 |
| 7161252 |
Module component |
Jan. 9, 2007 |
| 7157131 |
Prevention of counterfeit markings on semiconductor devices |
Jan. 2, 2007 |
| 7157796 |
Semiconductor device and the method of producing the same |
Jan. 2, 2007 |
| 7122910 |
Packaged semiconductor device |
Oct. 17, 2006 |
| 7122908 |
Electronic device package |
Oct. 17, 2006 |
| 7115989 |
Adhesive sheet for producing a semiconductor device |
Oct. 3, 2006 |
| 7109576 |
Semiconductor component having encapsulated die stack |
Sep. 19, 2006 |
| 7109591 |
Integrated circuit device |
Sep. 19, 2006 |
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