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Class Information
Number: 257/788
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated > With specified encapsulant
Description: Subject matter wherein the chemical composition of the material that encapsulates the active solid-state electronic device is specified.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7612458 |
Epoxy resin composition for semiconductor encapsulating use, and semiconductor device |
Nov. 3, 2009 |
| 7579698 |
Photodetector sealing resin is a boride or an oxide of micro particles |
Aug. 25, 2009 |
| 7560821 |
Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same |
Jul. 14, 2009 |
| 7560820 |
Integrated getter for vacuum or inert gas packaged LEDs |
Jul. 14, 2009 |
| 7550859 |
System and method for hermetically sealing a package |
Jun. 23, 2009 |
| 7547978 |
Underfill and encapsulation of semiconductor assemblies with materials having differing properties |
Jun. 16, 2009 |
| 7530164 |
Wafer-level underfill process making use of sacrificial contact pad protective material |
May. 12, 2009 |
| 7528415 |
Semiconductor laser |
May. 5, 2009 |
| 7517726 |
Wire bonded chip scale package fabrication methods |
Apr. 14, 2009 |
| 7514769 |
Micro surface mount die package and method |
Apr. 7, 2009 |
| 7511383 |
Flame retardant and an epoxy resin composition comprising the same for encapsulating semiconductor devices |
Mar. 31, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7495344 |
Semiconductor apparatus |
Feb. 24, 2009 |
| 7473993 |
Semiconductor stack package and memory module with improved heat dissipation |
Jan. 6, 2009 |
| 7474009 |
Optoelectronic molding compound that transmits visible light and blocks infrared light |
Jan. 6, 2009 |
| 7474008 |
Semiconductor device with reduced electromigration |
Jan. 6, 2009 |
| 7436002 |
Surface-mountable radiation-emitting component |
Oct. 14, 2008 |
| 7436075 |
Ion beam irradiation apparatus and ion beam irradiation method |
Oct. 14, 2008 |
| 7436076 |
Micromechanical component having an anodically bonded cap and a manufacturing method |
Oct. 14, 2008 |
| 7425731 |
Light emitting diode package |
Sep. 16, 2008 |
| 7397140 |
Chip module |
Jul. 8, 2008 |
| 7391102 |
Semiconductor apparatus configured with a lead frame having sufficient strenght to protect against external forces |
Jun. 24, 2008 |
| 7382059 |
Semiconductor package structure and method of manufacture |
Jun. 3, 2008 |
| 7382060 |
Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts |
Jun. 3, 2008 |
| 7374969 |
Semiconductor package with conductive molding compound and manufacturing method thereof |
May. 20, 2008 |
| 7371618 |
Method of manufacturing wafer-level chip-size package and molding apparatus used in the method |
May. 13, 2008 |
| 7335982 |
Chip package structure and chip packaging process |
Feb. 26, 2008 |
| 7327019 |
Semiconductor device of a charge storage type |
Feb. 5, 2008 |
| 7317258 |
Thermal interface apparatus, systems, and fabrication methods |
Jan. 8, 2008 |
| 7312536 |
Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same |
Dec. 25, 2007 |
| 7294530 |
Method for encapsulating multiple integrated circuits |
Nov. 13, 2007 |
| 7291905 |
Lead frame, semiconductor device produced by using the same and method of producing the semiconductor device |
Nov. 6, 2007 |
| 7288489 |
Process for thinning a semiconductor workpiece |
Oct. 30, 2007 |
| 7282806 |
Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material |
Oct. 16, 2007 |
| 7268421 |
Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond |
Sep. 11, 2007 |
| 7265453 |
Semiconductor component having dummy segments with trapped corner air |
Sep. 4, 2007 |
| 7262514 |
Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device |
Aug. 28, 2007 |
| 7262510 |
Chip package structure |
Aug. 28, 2007 |
| 7262509 |
Microelectronic assembly having a perimeter around a MEMS device |
Aug. 28, 2007 |
| 7262507 |
Semiconductor-mounted device and method for producing same |
Aug. 28, 2007 |
| 7262498 |
Assembly with a ring and bonding pads formed of a same material on a substrate |
Aug. 28, 2007 |
| 7259455 |
Semiconductor device |
Aug. 21, 2007 |
| 7250328 |
Microelectronic component assemblies with recessed wire bonds and methods of making same |
Jul. 31, 2007 |
| 7247934 |
Multi-chip semiconductor package |
Jul. 24, 2007 |
| 7242582 |
Semiconductor module mounting structure, a cardlike semiconductor module, and heat receiving members bonded to the cardlike semiconductor module |
Jul. 10, 2007 |
| 7238878 |
Photovoltaic module with light reflecting backskin |
Jul. 3, 2007 |
| 7235873 |
Protective device for subassemblies and method for producing a protective device |
Jun. 26, 2007 |
| 7230829 |
Overmolded electronic assembly with insert molded heat sinks |
Jun. 12, 2007 |
| 7227252 |
Semiconductor component having stacked, encapsulated dice and method of fabrication |
Jun. 5, 2007 |
| 7224050 |
Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packaging |
May. 29, 2007 |
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