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Class Information
Number: 257/787
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated
Description: Subject matter wherein an active solid-state electronic device, often part of a semiconductor chip, is surrounded by an electrically insulating material which forms a sealed encasement therefor.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7327019 |
Semiconductor device of a charge storage type |
Feb. 5, 2008 |
| 7323779 |
Semiconductor device |
Jan. 29, 2008 |
| 7319042 |
Method and apparatus for manufacture and inspection of semiconductor device |
Jan. 15, 2008 |
| 7318962 |
Magnetically directed self-assembly of molecular electronic junctions comprising conductively coated ferromagnetic microparticles |
Jan. 15, 2008 |
| 7317165 |
Intermediate substrate, intermediate substrate with semiconductor element, substrate with intermediate substrate, and structure having semiconductor element, intermediate substrate and substra |
Jan. 8, 2008 |
| 7315077 |
Molded leadless package having a partially exposed lead frame pad |
Jan. 1, 2008 |
| 7314820 |
Carrier-free semiconductor package and fabrication method thereof |
Jan. 1, 2008 |
| 7312536 |
Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same |
Dec. 25, 2007 |
| 7312106 |
Method for encapsulating a chip having a sensitive surface |
Dec. 25, 2007 |
| 7309913 |
Stacked semiconductor packages |
Dec. 18, 2007 |
| 7304362 |
Molded integrated circuit package with exposed active area |
Dec. 4, 2007 |
| 7301179 |
Semiconductor device having a high breakdown voltage transistor formed thereon |
Nov. 27, 2007 |
| 7300824 |
Method of packaging and interconnection of integrated circuits |
Nov. 27, 2007 |
| 7298052 |
Micro chip-scale-package system |
Nov. 20, 2007 |
| 7298026 |
Large die package and method for the fabrication thereof |
Nov. 20, 2007 |
| 7294918 |
Memory card with connecting portions for connection to an adapter |
Nov. 13, 2007 |
| 7294533 |
Mold compound cap in a flip chip multi-matrix array package and process of making same |
Nov. 13, 2007 |
| 7291927 |
Dual chips stacked packaging structure |
Nov. 6, 2007 |
| 7291926 |
Multi-chip package structure |
Nov. 6, 2007 |
| 7288843 |
Integrated circuit chip support substrate for placing in a mold, and associated method |
Oct. 30, 2007 |
| 7288489 |
Process for thinning a semiconductor workpiece |
Oct. 30, 2007 |
| 7285867 |
Wiring structure on semiconductor substrate and method of fabricating the same |
Oct. 23, 2007 |
| 7282806 |
Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material |
Oct. 16, 2007 |
| 7279794 |
Semiconductor device and electronic device, and methods for manufacturing thereof |
Oct. 9, 2007 |
| 7279781 |
Two-stage transfer molding device to encapsulate MMC module |
Oct. 9, 2007 |
| 7276802 |
Semiconductor integrated circuit package having electrically disconnected solder balls for mounting |
Oct. 2, 2007 |
| 7274107 |
Semiconductor device |
Sep. 25, 2007 |
| 7271475 |
Memory card with connecting portions for connection to an adapter |
Sep. 18, 2007 |
| 7268439 |
Semiconductor device having resin-sealed area on circuit board thereof |
Sep. 11, 2007 |
| 7268414 |
Semiconductor package having solder joint of improved reliability |
Sep. 11, 2007 |
| 7268012 |
Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby |
Sep. 11, 2007 |
| 7265453 |
Semiconductor component having dummy segments with trapped corner air |
Sep. 4, 2007 |
| 7262514 |
Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device |
Aug. 28, 2007 |
| 7262510 |
Chip package structure |
Aug. 28, 2007 |
| 7262498 |
Assembly with a ring and bonding pads formed of a same material on a substrate |
Aug. 28, 2007 |
| 7262491 |
Die pad for semiconductor packages and methods of making and using same |
Aug. 28, 2007 |
| 7259455 |
Semiconductor device |
Aug. 21, 2007 |
| 7256502 |
Metal interconnections for semiconductor devices including a buffer layer on a trench sidewall |
Aug. 14, 2007 |
| 7256482 |
Integrated circuit chip packaging assembly |
Aug. 14, 2007 |
| 7256066 |
Flip chip packaging process |
Aug. 14, 2007 |
| 7253529 |
Multi-chip package structure |
Aug. 7, 2007 |
| 7253506 |
Micro lead frame package |
Aug. 7, 2007 |
| 7250687 |
Systems for degating packaged semiconductor devices with tape substrates |
Jul. 31, 2007 |
| 7250328 |
Microelectronic component assemblies with recessed wire bonds and methods of making same |
Jul. 31, 2007 |
| 7247949 |
Semiconductor device with stacked chips |
Jul. 24, 2007 |
| 7247940 |
Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body |
Jul. 24, 2007 |
| 7247934 |
Multi-chip semiconductor package |
Jul. 24, 2007 |
| 7245014 |
Semiconductor light emitting apparatus and method for producing the same |
Jul. 17, 2007 |
| 7245009 |
Hermetic cavity package |
Jul. 17, 2007 |
| 7245008 |
Ball grid array package, stacked semiconductor package and method for manufacturing the same |
Jul. 17, 2007 |
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