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Class Information
Number: 257/787
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated
Description: Subject matter wherein an active solid-state electronic device, often part of a semiconductor chip, is surrounded by an electrically insulating material which forms a sealed encasement therefor.










Sub-classes under this class:

Class Number Class Name Patents
257/796 With heat sink embedded in encapsulant 631
257/788 With specified encapsulant 608
257/795 With specified filler material 332


Patents under this class:

Patent Number Title Of Patent Date Issued
8710681 Isolation rings for blocking the interface between package components and the respective molding compound Apr. 29, 2014
8710675 Integrated circuit package system with bonding lands Apr. 29, 2014
8710634 Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof Apr. 29, 2014
8704380 Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods Apr. 22, 2014
8703537 System and method to manufacture an implantable electrode Apr. 22, 2014
8692394 Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device Apr. 8, 2014
8691631 Device including two mounting surfaces Apr. 8, 2014
8686550 Method and apparatus for high pressure sensor device Apr. 1, 2014
8685797 Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof Apr. 1, 2014
8680692 Carrier, semiconductor package and fabrication method thereof Mar. 25, 2014
8680683 Wafer level package with embedded passive components and method of manufacturing Mar. 25, 2014
8680661 Direct contact package for power transistors Mar. 25, 2014
8669657 Stackable semiconductor assemblies and methods of manufacturing such assemblies Mar. 11, 2014
8669649 Integrated circuit packaging system with interlock and method of manufacture thereof Mar. 11, 2014
8669647 Method for semiconductor leadframes in low volume and rapid turnaround Mar. 11, 2014
8669140 Method of forming stacked die package using redistributed chip packaging Mar. 11, 2014
8665605 Substrate structure and package structure using the same Mar. 4, 2014
8664778 Method of flip-chip hybridization for the forming of tight cavities and systems obtained by such a method Mar. 4, 2014
8664762 Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor package Mar. 4, 2014
8659172 Semiconductor device and method of confining conductive bump material with solder mask patch Feb. 25, 2014
8659162 Semiconductor device having an interconnect structure with TSV using encapsulant for structural support Feb. 25, 2014
8659106 Light emitting device and method of manufacturing the light emitting device Feb. 25, 2014
8659050 Slim LED package Feb. 25, 2014
8658465 System and method to manufacture an implantable electrode Feb. 25, 2014
8658464 Mold chase design for package-on-package applications Feb. 25, 2014
8653676 Semiconductor package and method of manufacturing the same Feb. 18, 2014
8653675 Package including at least one topological feature on an encapsulant material to resist out-of-plane deformation Feb. 18, 2014
8652881 Integrated circuit package system with anti-peel contact pads Feb. 18, 2014
8648479 Epoxy resin composition for semiconductor encapsulant and semiconductor device using the same Feb. 11, 2014
8648470 Semiconductor device and method of forming FO-WLCSP with multiple encapsulants Feb. 11, 2014
8643200 Resin composition and transparent encapsulant formed using the same, and electronic device including the encapsulant Feb. 4, 2014
8643199 Thermoset polyimides for microelectronic applications Feb. 4, 2014
8643198 Electronic device package and method for forming the same Feb. 4, 2014
8643181 Integrated circuit packaging system with encapsulation and method of manufacture thereof Feb. 4, 2014
8637979 Semiconductor device Jan. 28, 2014
8629567 Integrated circuit packaging system with contacts and method of manufacture thereof Jan. 14, 2014
8629546 Stacked redistribution layer (RDL) die assembly package Jan. 14, 2014
8629537 Padless die support integrated circuit package system Jan. 14, 2014
8624380 Vertical mount package for MEMS sensors Jan. 7, 2014
8624372 Semiconductor component comprising an interposer substrate Jan. 7, 2014
8624368 Quad flat non-leaded semiconductor package Jan. 7, 2014
8624364 Integrated circuit packaging system with encapsulation connector and method of manufacture thereof Jan. 7, 2014
8624286 Semiconductor device Jan. 7, 2014
8618674 Semiconductor device including a sintered insulation material Dec. 31, 2013
8618653 Integrated circuit package system with wafer scale heat slug Dec. 31, 2013
8610293 Resin composition for encapsulating optical semiconductor element and optical semiconductor device Dec. 17, 2013
8610292 Resin sealing method of semiconductor device Dec. 17, 2013
8610271 Chip package and manufacturing method thereof Dec. 17, 2013
8610266 Semiconductor device for radio frequency applications and method for making the same Dec. 17, 2013
8598693 Die pad package with a concave portion in the sealing resin Dec. 3, 2013











 
 
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