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Class Information
Number: 257/787
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated
Description: Subject matter wherein an active solid-state electronic device, often part of a semiconductor chip, is surrounded by an electrically insulating material which forms a sealed encasement therefor.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459797 |
Standoffs for centralizing internals in packaging process |
Dec. 2, 2008 |
| 7459345 |
Packaging method for an electronic element |
Dec. 2, 2008 |
| 7449774 |
Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same |
Nov. 11, 2008 |
| 7449726 |
Power semiconductor apparatus |
Nov. 11, 2008 |
| 7446423 |
Semiconductor device and method for assembling the same |
Nov. 4, 2008 |
| 7446396 |
Stacked integrated circuit leadframe package system |
Nov. 4, 2008 |
| 7443043 |
Circuit device and method of manufacture thereof |
Oct. 28, 2008 |
| 7443016 |
Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of |
Oct. 28, 2008 |
| 7436076 |
Micromechanical component having an anodically bonded cap and a manufacturing method |
Oct. 14, 2008 |
| 7436075 |
Ion beam irradiation apparatus and ion beam irradiation method |
Oct. 14, 2008 |
| 7436074 |
Chip package without core and stacked chip package structure thereof |
Oct. 14, 2008 |
| 7435993 |
High temperature, high voltage SiC void-less electronic package |
Oct. 14, 2008 |
| 7435625 |
Semiconductor device with reduced package cross-talk and loss |
Oct. 14, 2008 |
| 7435624 |
Method of reducing mechanical stress on a semiconductor die during fabrication |
Oct. 14, 2008 |
| 7432601 |
Semiconductor package and fabrication process thereof |
Oct. 7, 2008 |
| 7432600 |
System having semiconductor component with multiple stacked dice |
Oct. 7, 2008 |
| 7432586 |
Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages |
Oct. 7, 2008 |
| 7429799 |
Land patterns for a semiconductor stacking structure and method therefor |
Sep. 30, 2008 |
| 7429790 |
Semiconductor structure and method of manufacture |
Sep. 30, 2008 |
| 7429787 |
Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides |
Sep. 30, 2008 |
| 7429786 |
Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides |
Sep. 30, 2008 |
| 7427813 |
Structure, material, and design for assembling a low-K Si die to achieve an industrial grade reliability wire bonding package |
Sep. 23, 2008 |
| 7427811 |
Semiconductor substrate |
Sep. 23, 2008 |
| 7427810 |
Semiconductor device including semiconductor element mounted on another semiconductor element |
Sep. 23, 2008 |
| 7427806 |
Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component |
Sep. 23, 2008 |
| 7425469 |
Method for encapsulating an electronic component using a foil layer |
Sep. 16, 2008 |
| 7423340 |
Semiconductor package free of substrate and fabrication method thereof |
Sep. 9, 2008 |
| 7420266 |
Circuit device and manufacturing method thereof |
Sep. 2, 2008 |
| 7417330 |
Semiconductor device packaged into chip size and manufacturing method thereof |
Aug. 26, 2008 |
| 7417329 |
System-in-package structure |
Aug. 26, 2008 |
| 7417314 |
Semiconductor chip assembly with laterally aligned bumped terminal and filler |
Aug. 26, 2008 |
| 7417309 |
Circuit device and portable device with symmetrical arrangement |
Aug. 26, 2008 |
| 7417305 |
Electronic devices at the wafer level having front side and edge protection material and systems including the devices |
Aug. 26, 2008 |
| 7416923 |
Underfill film having thermally conductive sheet |
Aug. 26, 2008 |
| 7414319 |
Semiconductor chip assembly with metal containment wall and solder terminal |
Aug. 19, 2008 |
| 7414304 |
Semiconductor device |
Aug. 19, 2008 |
| 7408260 |
Microelectronic assemblies having compliant layers |
Aug. 5, 2008 |
| 7405656 |
Device and method for encapsulation and mounting of RFID devices |
Jul. 29, 2008 |
| 7405487 |
Method and apparatus for removing encapsulating material from a packaged microelectronic device |
Jul. 29, 2008 |
| 7405486 |
Circuit device |
Jul. 29, 2008 |
| 7405485 |
Semiconductor device |
Jul. 29, 2008 |
| 7405474 |
Low cost thermally enhanced semiconductor package |
Jul. 29, 2008 |
| 7402503 |
Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus |
Jul. 22, 2008 |
| 7400049 |
Integrated circuit package system with heat sink |
Jul. 15, 2008 |
| 7400048 |
Void-free circuit board and semiconductor package having the same |
Jul. 15, 2008 |
| 7400032 |
Module assembly for stacked BGA packages |
Jul. 15, 2008 |
| 7397139 |
Epoxy resin molding material for sealing use and semiconductor device |
Jul. 8, 2008 |
| 7397132 |
Semiconductor device |
Jul. 8, 2008 |
| 7397113 |
Semiconductor device |
Jul. 8, 2008 |
| 7397023 |
Image sensor module with optical path delimiter and accurate alignment |
Jul. 8, 2008 |
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