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Class Information
Number: 257/787
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Encapsulated
Description: Subject matter wherein an active solid-state electronic device, often part of a semiconductor chip, is surrounded by an electrically insulating material which forms a sealed encasement therefor.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619318 |
No-flow underfill composition and method |
Nov. 17, 2009 |
| 7619317 |
Carrier structure for semiconductor chip and method for manufacturing the same |
Nov. 17, 2009 |
| 7619304 |
Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof |
Nov. 17, 2009 |
| 7618845 |
Fabrication of an integrated circuit package |
Nov. 17, 2009 |
| 7615872 |
Semiconductor device |
Nov. 10, 2009 |
| 7615859 |
Thin semiconductor package having stackable lead frame and method of manufacturing the same |
Nov. 10, 2009 |
| 7615855 |
IC card and method of manufacturing the same |
Nov. 10, 2009 |
| 7612458 |
Epoxy resin composition for semiconductor encapsulating use, and semiconductor device |
Nov. 3, 2009 |
| 7612445 |
Circuit apparatus and method of fabricating the apparatus |
Nov. 3, 2009 |
| 7608911 |
Semiconductor device package having a semiconductor element with a roughened surface |
Oct. 27, 2009 |
| 7608486 |
Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier |
Oct. 27, 2009 |
| 7605480 |
Flip chip interconnection pad layout |
Oct. 20, 2009 |
| 7602071 |
Apparatus for dividing an adhesive film mounted on a wafer |
Oct. 13, 2009 |
| 7602055 |
Semiconductor device and method for fabricating the same |
Oct. 13, 2009 |
| 7599064 |
Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method, substrate for use in the methods |
Oct. 6, 2009 |
| 7598622 |
Encapsulation of a chip module |
Oct. 6, 2009 |
| 7598606 |
Integrated circuit package system with die and package combination |
Oct. 6, 2009 |
| 7592708 |
Package board, semiconductor package, and fabricating method thereof |
Sep. 22, 2009 |
| 7589408 |
Stackable semiconductor package |
Sep. 15, 2009 |
| 7588965 |
Stencil and method for depositing material onto a substrate |
Sep. 15, 2009 |
| 7586182 |
Packaged semiconductor die and manufacturing method thereof |
Sep. 8, 2009 |
| 7586180 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
Sep. 8, 2009 |
| 7582974 |
Semiconductor device and method of manufacturing same |
Sep. 1, 2009 |
| 7582968 |
Wiring board with a protective film greater in heights than bumps |
Sep. 1, 2009 |
| 7582958 |
Semiconductor package |
Sep. 1, 2009 |
| 7579680 |
Packaging system for semiconductor devices |
Aug. 25, 2009 |
| 7573141 |
Semiconductor package with a chip on a support plate |
Aug. 11, 2009 |
| 7573071 |
Light emitting diode package |
Aug. 11, 2009 |
| 7566966 |
Integrated circuit package-on-package system with anti-mold flash feature |
Jul. 28, 2009 |
| 7566957 |
Support device with discrete getter material microelectronic devices |
Jul. 28, 2009 |
| 7566836 |
Potting shell |
Jul. 28, 2009 |
| 7564142 |
Electronic device and method of manufacturing the same, circuit board, and electronic instrument |
Jul. 21, 2009 |
| 7564140 |
Semiconductor package and substrate structure thereof |
Jul. 21, 2009 |
| 7564122 |
Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant |
Jul. 21, 2009 |
| 7564080 |
Method for producing a laser diode component, housing for a laser diode component, and laser diode component itself |
Jul. 21, 2009 |
| 7563652 |
Method for encapsulating sensor chips |
Jul. 21, 2009 |
| 7560821 |
Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same |
Jul. 14, 2009 |
| 7560819 |
Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
Jul. 14, 2009 |
| 7560804 |
Integrated circuit package and method of making the same |
Jul. 14, 2009 |
| 7560743 |
Electro-optical device, method of manufacturing the same, and image forming apparatus |
Jul. 14, 2009 |
| 7556986 |
Tape supported memory card leadframe structure |
Jul. 7, 2009 |
| 7554205 |
Flip-chip type semiconductor device |
Jun. 30, 2009 |
| 7554197 |
High frequency IC package and method for fabricating the same |
Jun. 30, 2009 |
| 7554182 |
Semiconductor device and package, and method of manufacturer therefor |
Jun. 30, 2009 |
| 7553701 |
Semiconductor packaging method |
Jun. 30, 2009 |
| 7552532 |
Method for hermetically encapsulating a component |
Jun. 30, 2009 |
| 7550843 |
Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member |
Jun. 23, 2009 |
| 7547978 |
Underfill and encapsulation of semiconductor assemblies with materials having differing properties |
Jun. 16, 2009 |
| 7547962 |
Chip package with a ring having a buffer groove that surrounds the active region of a chip |
Jun. 16, 2009 |
| 7545017 |
Wafer level package for surface acoustic wave device and fabrication method thereof |
Jun. 9, 2009 |
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