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Class Information
Number: 257/786
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Configuration or pattern of bonds
Description: Subject matter wherein the electrical contact, lead or bond, has a specific configuration or pattern.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6867500 |
Multi-chip module and methods |
Mar. 15, 2005 |
| 6864570 |
Method and apparatus for fabricating self-assembling microstructures |
Mar. 8, 2005 |
| 6861343 |
Buffer metal layer |
Mar. 1, 2005 |
| 6861748 |
Test structure |
Mar. 1, 2005 |
| 6861749 |
Semiconductor device with bump electrodes |
Mar. 1, 2005 |
| 6861753 |
Method and apparatus for performing power routing on a voltage island within an integrated circuit chip |
Mar. 1, 2005 |
| 6861762 |
Flip chip with novel power and ground arrangement |
Mar. 1, 2005 |
| 6861763 |
Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same |
Mar. 1, 2005 |
| 6858928 |
Multi-directional wiring on a single metal layer |
Feb. 22, 2005 |
| 6858943 |
Release resistant electrical interconnections for MEMS devices |
Feb. 22, 2005 |
| 6858944 |
Bonding pad metal layer geometry design |
Feb. 22, 2005 |
| 6858945 |
Multi-concentric pad arrangements for integrated circuit pads |
Feb. 22, 2005 |
| 6858946 |
Semiconductor device |
Feb. 22, 2005 |
| 6853063 |
Semiconductor device and communication terminal using thereof |
Feb. 8, 2005 |
| 6853064 |
Semiconductor component having stacked, encapsulated dice |
Feb. 8, 2005 |
| 6853087 |
Component and antennae assembly in radio frequency identification devices |
Feb. 8, 2005 |
| 6853090 |
TAB tape for semiconductor package |
Feb. 8, 2005 |
| 6853091 |
Printed circuit board and soldering structure for electronic parts thereto |
Feb. 8, 2005 |
| 6853092 |
Circuit board, mounting structure for semiconductor device with bumps, and electro-optic device and electronic device |
Feb. 8, 2005 |
| 6853287 |
Coil for use on a substrate |
Feb. 8, 2005 |
| 6849929 |
IC chip and semiconductor device |
Feb. 1, 2005 |
| 6849956 |
Semiconductor integrated circuit with shortened pad pitch |
Feb. 1, 2005 |
| 6847105 |
Bumping technology in stacked die configurations |
Jan. 25, 2005 |
| 6847117 |
Semiconductor device including a passivation film to cover directly an interface of a bump and an intermediated layer |
Jan. 25, 2005 |
| 6847120 |
Flip chip semiconductor device having signal pads arranged outside of power supply pads |
Jan. 25, 2005 |
| 6847123 |
Vertically staggered bondpad array |
Jan. 25, 2005 |
| 6847124 |
Semiconductor device and fabrication method thereof |
Jan. 25, 2005 |
| 6844631 |
Semiconductor device having a bond pad and method therefor |
Jan. 18, 2005 |
| 6841852 |
Integrated circuit package for semiconductor devices with improved electric resistance and inductance |
Jan. 11, 2005 |
| 6841855 |
Electronic package having a flexible substrate with ends connected to one another |
Jan. 11, 2005 |
| 6841863 |
Ball grid array package with stacked center pad chips and method for manufacturing the same |
Jan. 11, 2005 |
| 6841871 |
Semiconductor device utilizing pads of different sizes connected to an antenna |
Jan. 11, 2005 |
| 6841873 |
CSP Semiconductor device having signal and radiation bump groups |
Jan. 11, 2005 |
| 6841887 |
Semiconductor chip soldering land pattern |
Jan. 11, 2005 |
| 6838767 |
Semiconductor device |
Jan. 4, 2005 |
| 6838769 |
Dual damascene bond pad structure for lowering stress and allowing circuitry under pads |
Jan. 4, 2005 |
| 6838773 |
Semiconductor chip and semiconductor device using the semiconductor chip |
Jan. 4, 2005 |
| 6834427 |
Method for depopulating of a ball grid array to allow via placement |
Dec. 28, 2004 |
| 6836002 |
Semiconductor device |
Dec. 28, 2004 |
| 6836009 |
Packaged microelectronic components |
Dec. 28, 2004 |
| 6836018 |
Wafer level package and method for manufacturing the same |
Dec. 28, 2004 |
| 6836025 |
Semiconductor device configured to be surface mountable |
Dec. 28, 2004 |
| 6836026 |
Integrated circuit design for both input output limited and core limited integrated circuits |
Dec. 28, 2004 |
| 6833611 |
Semiconductor device |
Dec. 21, 2004 |
| 6833615 |
Via-in-pad with off-center geometry |
Dec. 21, 2004 |
| 6833620 |
Apparatus having reduced input output area and method thereof |
Dec. 21, 2004 |
| 6833557 |
Integrated circuit and a method of manufacturing an integrated circuit |
Dec. 21, 2004 |
| 6828220 |
Flip chip-in-leadframe package and process |
Dec. 7, 2004 |
| 6825541 |
Bump pad design for flip chip bumping |
Nov. 30, 2004 |
| 6825563 |
Slotted bonding pad |
Nov. 30, 2004 |
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