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Browse by Category: Main > Physics
Class Information
Number: 257/786
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Configuration or pattern of bonds
Description: Subject matter wherein the electrical contact, lead or bond, has a specific configuration or pattern.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710681 Isolation rings for blocking the interface between package components and the respective molding compound Apr. 29, 2014
8710680 Electronic device package and fabrication method thereof Apr. 29, 2014
8710677 Multi-chip package with a supporting member and method of manufacturing the same Apr. 29, 2014
8710674 Internal wiring structure of semiconductor device Apr. 29, 2014
8710653 Chip on chip semiconductor device including an underfill layer having a resin containing an amine-based curing agent Apr. 29, 2014
8710645 Area reduction for surface mount package chips Apr. 29, 2014
8704383 Silicon-based thin substrate and packaging schemes Apr. 22, 2014
8704374 Semiconductor device and method for manufacturing the same Apr. 22, 2014
8704372 Integrated circuits and methods for processing integrated circuits with embedded features Apr. 22, 2014
8704360 Top port surface mount silicon condenser microphone package Apr. 22, 2014
8704351 Stacked microelectronic assemblies Apr. 22, 2014
8703541 Electronic system with expansion feature Apr. 22, 2014
8694945 Automatic place and route method for electromigration tolerant power distribution Apr. 8, 2014
8692391 Embedded ball grid array substrate and manufacturing method thereof Apr. 8, 2014
8692380 Integrated circuit system with sub-geometry removal and method of manufacture thereof Apr. 8, 2014
8686574 Semiconductor device Apr. 1, 2014
8686563 Methods of forming fine patterns in the fabrication of semiconductor devices Apr. 1, 2014
8680691 Semiconductor device having semiconductor member and mounting member Mar. 25, 2014
8679963 Fan-out chip scale package Mar. 25, 2014
8674522 Castle-like chop mask for forming staggered datalines for improved contact isolation and pattern thereof Mar. 18, 2014
8669666 Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element Mar. 11, 2014
8669665 Flip-chip mounting substrate and flip-chip mounting method Mar. 11, 2014
8669555 Semiconductor device Mar. 11, 2014
8664777 Routing layer for mitigating stress in a semiconductor die Mar. 4, 2014
8664776 Interconnection tape providing a serial electrode pad connection in a semiconductor device Mar. 4, 2014
8664041 Method for designing a package and substrate layout Mar. 4, 2014
8659149 Semiconductor structure with galvanic isolation Feb. 25, 2014
8653674 Electronic component package fabrication method and structure Feb. 18, 2014
8653669 Semiconductor package Feb. 18, 2014
8653668 Copper bonding wire for semiconductor device and bonding structure thereof Feb. 18, 2014
8653636 Contactless communication medium Feb. 18, 2014
8652883 Methods of manufacture of bottom port surface mount silicon condenser microphone packages Feb. 18, 2014
8652877 Method of manufacturing layered chip package Feb. 18, 2014
8648478 Flexible heat sink having ventilation ports and semiconductor package including the same Feb. 11, 2014
8648477 Semiconductor chip, film substrate, and related semiconductor chip package Feb. 11, 2014
8643193 Semiconductor packages and electronic systems including the same Feb. 4, 2014
8643189 Packaged semiconductor die with power rail pads Feb. 4, 2014
8643179 Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package Feb. 4, 2014
8643175 Multi-channel package and electronic system including the same Feb. 4, 2014
8642384 Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability Feb. 4, 2014
8637983 Face-to-face (F2F) hybrid structure for an integrated circuit Jan. 28, 2014
8637972 Two-sided substrate lead connection for minimizing kerf width on a semiconductor substrate panel Jan. 28, 2014
8633596 Semiconductor package with bonding wires of reduced loop inductance Jan. 21, 2014
8633593 Semiconductor device Jan. 21, 2014
8633592 Hybrid interconnect technology Jan. 21, 2014
8633064 Methods of manufacture of top port multipart surface mount silicon condenser microphone package Jan. 21, 2014
8629557 Structures and methods for detecting solder wetting of pedestal sidewalls Jan. 14, 2014
8629552 Top port multi-part surface mount silicon condenser microphone package Jan. 14, 2014
8629550 Printed wiring board with crossing wiring pattern Jan. 14, 2014
8629005 Methods of manufacture of bottom port surface mount silicon condenser microphone packages Jan. 14, 2014











 
 
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