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Class Information
Number: 257/786
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Configuration or pattern of bonds
Description: Subject matter wherein the electrical contact, lead or bond, has a specific configuration or pattern.


Patents under this class:

Patent Number Title Of Patent Date Issued
7615874 Electronic component module Nov. 10, 2009
7615873 Solder flow stops for semiconductor die substrates Nov. 10, 2009
7615853 Chip-stacked package structure having leadframe with multi-piece bus bar Nov. 10, 2009
7614147 Method of creating contour structures to highlight inspection region Nov. 10, 2009
7612444 Semiconductor package with flow controller Nov. 3, 2009
7608932 Deterministic generation of an integrated circuit identification number Oct. 27, 2009
7608931 Interconnect array formed at least in part with repeated application of an interconnect pattern Oct. 27, 2009
7605459 Coreless substrate and manufacturing thereof Oct. 20, 2009
7602039 Programmable capacitor associated with an input/output pad Oct. 13, 2009
7598621 Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths Oct. 6, 2009
7598620 Copper bonding compatible bond pad structure and method Oct. 6, 2009
7598613 Flip chip bonding structure Oct. 6, 2009
7595562 Device package structure, device packaging method, droplet ejection head, connector, and semiconductor device Sep. 29, 2009
7595561 Semiconductor device including multiple rows of peripheral circuit units Sep. 29, 2009
7592710 Bond pad structure for wire bonding Sep. 22, 2009
7592701 Electrode structure, part mounting structure and liquid crystal display unit equipped with the part mounting structure Sep. 22, 2009
7592689 Semiconductor module comprising semiconductor chips and method for producing the same Sep. 22, 2009
7592244 Semiconductor device and method of manufacturing the same Sep. 22, 2009
7589421 Heat-radiating semiconductor chip, tape wiring substrate and tape package using the same Sep. 15, 2009
7589419 Side connectors for RFID chip Sep. 15, 2009
7589411 Device for electrical connection of an integrated circuit chip Sep. 15, 2009
7589410 Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package Sep. 15, 2009
7589409 Stacked packages and microelectronic assemblies incorporating the same Sep. 15, 2009
7586201 Wiring modeling technique Sep. 8, 2009
7586199 Structures, architectures, systems, methods, algorithms and software for configuring and integrated circuit for multiple packaging types Sep. 8, 2009
7582976 Semiconductor device tape carrier, manufacturing method for semiconductor device, semiconductor device, and semiconductor module device Sep. 1, 2009
7582974 Semiconductor device and method of manufacturing same Sep. 1, 2009
7582972 Semiconductor device and fabrication method thereof Sep. 1, 2009
7582968 Wiring board with a protective film greater in heights than bumps Sep. 1, 2009
7579676 Leadless leadframe implemented in a leadframe-based BGA package Aug. 25, 2009
7576440 Semiconductor chip having bond pads and multi-chip package Aug. 18, 2009
7576439 Electrically connecting substrate with electrical device Aug. 18, 2009
7576437 Printed circuit board of semiconductor package and method for mounting semiconductor package using the same Aug. 18, 2009
7576436 Structure of wafer level package with area bump Aug. 18, 2009
7576424 Semiconductor device Aug. 18, 2009
7576390 System for vertical DMOS with slots Aug. 18, 2009
7573138 Stress decoupling structures for flip-chip assembly Aug. 11, 2009
7569938 Interconnections for integrated circuits Aug. 4, 2009
7569936 Semiconductor device and method of manufacturing the same Aug. 4, 2009
7569922 Semiconductor device having a bonding wire and method for manufacturing the same Aug. 4, 2009
7569920 Electronic component having at least one vertical semiconductor power transistor Aug. 4, 2009
7566958 Multi-chip package for reducing parasitic load of pin Jul. 28, 2009
7564141 Apparatus and method for preventing configurable system-on-a-chip integrated circuits from becoming I/O limited Jul. 21, 2009
7560810 Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument Jul. 14, 2009
RE40819 Semiconductor device with improved bond pads Jul. 7, 2009
7557455 System and apparatus that reduce corrosion of an integrated circuit through its bond pads Jul. 7, 2009
7557453 Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device Jul. 7, 2009
7554209 Semiconductor device having a metal plate conductor Jun. 30, 2009
7554169 Semiconductor device and method of manufacturing the same Jun. 30, 2009
7547977 Semiconductor chip having bond pads Jun. 16, 2009



 
 
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