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Class Information
Number: 257/786
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Configuration or pattern of bonds
Description: Subject matter wherein the electrical contact, lead or bond, has a specific configuration or pattern.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615874 |
Electronic component module |
Nov. 10, 2009 |
| 7615873 |
Solder flow stops for semiconductor die substrates |
Nov. 10, 2009 |
| 7615853 |
Chip-stacked package structure having leadframe with multi-piece bus bar |
Nov. 10, 2009 |
| 7614147 |
Method of creating contour structures to highlight inspection region |
Nov. 10, 2009 |
| 7612444 |
Semiconductor package with flow controller |
Nov. 3, 2009 |
| 7608932 |
Deterministic generation of an integrated circuit identification number |
Oct. 27, 2009 |
| 7608931 |
Interconnect array formed at least in part with repeated application of an interconnect pattern |
Oct. 27, 2009 |
| 7605459 |
Coreless substrate and manufacturing thereof |
Oct. 20, 2009 |
| 7602039 |
Programmable capacitor associated with an input/output pad |
Oct. 13, 2009 |
| 7598621 |
Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths |
Oct. 6, 2009 |
| 7598620 |
Copper bonding compatible bond pad structure and method |
Oct. 6, 2009 |
| 7598613 |
Flip chip bonding structure |
Oct. 6, 2009 |
| 7595562 |
Device package structure, device packaging method, droplet ejection head, connector, and semiconductor device |
Sep. 29, 2009 |
| 7595561 |
Semiconductor device including multiple rows of peripheral circuit units |
Sep. 29, 2009 |
| 7592710 |
Bond pad structure for wire bonding |
Sep. 22, 2009 |
| 7592701 |
Electrode structure, part mounting structure and liquid crystal display unit equipped with the part mounting structure |
Sep. 22, 2009 |
| 7592689 |
Semiconductor module comprising semiconductor chips and method for producing the same |
Sep. 22, 2009 |
| 7592244 |
Semiconductor device and method of manufacturing the same |
Sep. 22, 2009 |
| 7589421 |
Heat-radiating semiconductor chip, tape wiring substrate and tape package using the same |
Sep. 15, 2009 |
| 7589419 |
Side connectors for RFID chip |
Sep. 15, 2009 |
| 7589411 |
Device for electrical connection of an integrated circuit chip |
Sep. 15, 2009 |
| 7589410 |
Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package |
Sep. 15, 2009 |
| 7589409 |
Stacked packages and microelectronic assemblies incorporating the same |
Sep. 15, 2009 |
| 7586201 |
Wiring modeling technique |
Sep. 8, 2009 |
| 7586199 |
Structures, architectures, systems, methods, algorithms and software for configuring and integrated circuit for multiple packaging types |
Sep. 8, 2009 |
| 7582976 |
Semiconductor device tape carrier, manufacturing method for semiconductor device, semiconductor device, and semiconductor module device |
Sep. 1, 2009 |
| 7582974 |
Semiconductor device and method of manufacturing same |
Sep. 1, 2009 |
| 7582972 |
Semiconductor device and fabrication method thereof |
Sep. 1, 2009 |
| 7582968 |
Wiring board with a protective film greater in heights than bumps |
Sep. 1, 2009 |
| 7579676 |
Leadless leadframe implemented in a leadframe-based BGA package |
Aug. 25, 2009 |
| 7576440 |
Semiconductor chip having bond pads and multi-chip package |
Aug. 18, 2009 |
| 7576439 |
Electrically connecting substrate with electrical device |
Aug. 18, 2009 |
| 7576437 |
Printed circuit board of semiconductor package and method for mounting semiconductor package using the same |
Aug. 18, 2009 |
| 7576436 |
Structure of wafer level package with area bump |
Aug. 18, 2009 |
| 7576424 |
Semiconductor device |
Aug. 18, 2009 |
| 7576390 |
System for vertical DMOS with slots |
Aug. 18, 2009 |
| 7573138 |
Stress decoupling structures for flip-chip assembly |
Aug. 11, 2009 |
| 7569938 |
Interconnections for integrated circuits |
Aug. 4, 2009 |
| 7569936 |
Semiconductor device and method of manufacturing the same |
Aug. 4, 2009 |
| 7569922 |
Semiconductor device having a bonding wire and method for manufacturing the same |
Aug. 4, 2009 |
| 7569920 |
Electronic component having at least one vertical semiconductor power transistor |
Aug. 4, 2009 |
| 7566958 |
Multi-chip package for reducing parasitic load of pin |
Jul. 28, 2009 |
| 7564141 |
Apparatus and method for preventing configurable system-on-a-chip integrated circuits from becoming I/O limited |
Jul. 21, 2009 |
| 7560810 |
Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument |
Jul. 14, 2009 |
| RE40819 |
Semiconductor device with improved bond pads |
Jul. 7, 2009 |
| 7557455 |
System and apparatus that reduce corrosion of an integrated circuit through its bond pads |
Jul. 7, 2009 |
| 7557453 |
Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device |
Jul. 7, 2009 |
| 7554209 |
Semiconductor device having a metal plate conductor |
Jun. 30, 2009 |
| 7554169 |
Semiconductor device and method of manufacturing the same |
Jun. 30, 2009 |
| 7547977 |
Semiconductor chip having bond pads |
Jun. 16, 2009 |
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