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Browse by Category: Main > Physics
Class Information
Number: 257/785
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > By pressure alone
Description: Subject matter wherein the electrical contact, lead or bond is held in place by pressure alone (e.g., by a spring clip).










Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8674520 Semiconductor device, method for manufacturing the same, and power supply unit Mar. 18, 2014
8643188 Connecting system for electrically connecting electronic devices and method for connecting an electrically conductive first connector and electrically conductive second connector Feb. 4, 2014
8633592 Hybrid interconnect technology Jan. 21, 2014
8633593 Semiconductor device Jan. 21, 2014
8633601 Interconnect assemblies and methods of making and using same Jan. 21, 2014
8581422 Semiconductor module Nov. 12, 2013
8546956 Three-dimensional (3D) integrated circuit with enhanced copper-to-copper bonding Oct. 1, 2013
8531027 Press-pack module with power overlay interconnection Sep. 10, 2013
8531042 Technique for fabricating microsprings on non-planar surfaces Sep. 10, 2013
8471377 Semiconductor device and semiconductor circuit substrate Jun. 25, 2013
8466544 Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of Fo-WLCSP Jun. 18, 2013
8415791 Semiconductor device and fabrication method therefor Apr. 9, 2013
8350345 Three-dimensional input control device Jan. 8, 2013
8338946 Semiconductor module, method of manufacturing semiconductor module, and mobile device Dec. 25, 2012
8314444 Piezoresistive pressure sensor Nov. 20, 2012
8294263 Light-emitting diode packaging structure and module and assembling method thereof Oct. 23, 2012
8278753 Semiconductor device and production method thereof Oct. 2, 2012
8143719 Vented die and package Mar. 27, 2012
8125085 Semiconductor device having wiring with oxide layer of impurity from the wiring Feb. 28, 2012
8030782 Metal-metal bonding of compliant interconnect Oct. 4, 2011
8026603 Interconnect structure of an integrated circuit and manufacturing method thereof Sep. 27, 2011
7982308 Light-emitting diode packaging structure and light-emitting diode module Jul. 19, 2011
7948007 Power semiconductor module with flush terminal elements May. 24, 2011
7884489 Press-fit integrated circuit package involving compressed spring contact beams Feb. 8, 2011
7855452 Semiconductor module, method of manufacturing semiconductor module, and mobile device Dec. 21, 2010
7755206 Pad structure to provide improved stress relief Jul. 13, 2010
7750487 Metal-metal bonding of compliant interconnect Jul. 6, 2010
7745943 Microelectonic packages and methods therefor Jun. 29, 2010
7692293 Semiconductor switching module Apr. 6, 2010
7692280 Portable object connectable package Apr. 6, 2010
7687900 Semiconductor integrated circuit device and fabrication method for the same Mar. 30, 2010
7683494 Press-fit integrated circuit package involving compressed spring contact beams Mar. 23, 2010
7656017 Integrated circuit package system with thermo-mechanical interlocking substrates Feb. 2, 2010
7592698 Power semiconductor modules having a cooling component and method for producing them Sep. 22, 2009
7592710 Bond pad structure for wire bonding Sep. 22, 2009
7589418 Pressure contact power semiconductor module Sep. 15, 2009
7582975 Nanowire device and method of making the same Sep. 1, 2009
7518251 Stacked electronics for sensors Apr. 14, 2009
7459376 Dissociated fabrication of packages and chips of integrated circuits Dec. 2, 2008
7459795 Method to build a wirebond probe card in a many at a time fashion Dec. 2, 2008
7453157 Microelectronic packages and methods therefor Nov. 18, 2008
7408119 Electrical interconnection for high-frequency devices Aug. 5, 2008
7405419 Unidirectionally conductive materials for interconnection Jul. 29, 2008
7400041 Compliant multi-composition interconnects Jul. 15, 2008
7394163 Method of mounting semiconductor chip Jul. 1, 2008
7358118 Mounting method of flexible printed circuit and manufacturing method of electric optical device Apr. 15, 2008
7335979 Device and method for tilted land grid array interconnects on a coreless substrate package Feb. 26, 2008
7327030 Apparatus and method incorporating discrete passive components in an electronic package Feb. 5, 2008
7323363 Contact load profile modification for a compression socketed CPU Jan. 29, 2008
7298031 Multiple substrate microelectronic devices and methods of manufacture Nov. 20, 2007

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