| |
 |
|
Class Information
Number: 257/785
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > By pressure alone
Description: Subject matter wherein the electrical contact, lead or bond is held in place by pressure alone (e.g., by a spring clip).
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7592710 |
Bond pad structure for wire bonding |
Sep. 22, 2009 |
| 7592698 |
Power semiconductor modules having a cooling component and method for producing them |
Sep. 22, 2009 |
| 7589418 |
Pressure contact power semiconductor module |
Sep. 15, 2009 |
| 7582975 |
Nanowire device and method of making the same |
Sep. 1, 2009 |
| 7518251 |
Stacked electronics for sensors |
Apr. 14, 2009 |
| 7459795 |
Method to build a wirebond probe card in a many at a time fashion |
Dec. 2, 2008 |
| 7459376 |
Dissociated fabrication of packages and chips of integrated circuits |
Dec. 2, 2008 |
| 7453157 |
Microelectronic packages and methods therefor |
Nov. 18, 2008 |
| 7408119 |
Electrical interconnection for high-frequency devices |
Aug. 5, 2008 |
| 7405419 |
Unidirectionally conductive materials for interconnection |
Jul. 29, 2008 |
| 7400041 |
Compliant multi-composition interconnects |
Jul. 15, 2008 |
| 7394163 |
Method of mounting semiconductor chip |
Jul. 1, 2008 |
| 7358118 |
Mounting method of flexible printed circuit and manufacturing method of electric optical device |
Apr. 15, 2008 |
| 7335979 |
Device and method for tilted land grid array interconnects on a coreless substrate package |
Feb. 26, 2008 |
| 7327030 |
Apparatus and method incorporating discrete passive components in an electronic package |
Feb. 5, 2008 |
| 7323363 |
Contact load profile modification for a compression socketed CPU |
Jan. 29, 2008 |
| 7298031 |
Multiple substrate microelectronic devices and methods of manufacture |
Nov. 20, 2007 |
| 7294919 |
Device having a complaint element pressed between substrates |
Nov. 13, 2007 |
| 7279358 |
Mounting method and mounting device |
Oct. 9, 2007 |
| 7239027 |
Bonding structure of device packaging |
Jul. 3, 2007 |
| 7223637 |
Method of manufacturing a sensor device with binding material having a foaming agent |
May. 29, 2007 |
| 7221047 |
Pressure-contact type semiconductor device |
May. 22, 2007 |
| 7215019 |
Semiconductor chip assembly with pillar press-fit into ground plane |
May. 8, 2007 |
| 7183660 |
Tape circuit substrate and semicondutor chip package using the same |
Feb. 27, 2007 |
| 7180196 |
Semiconductor device mounting method, semiconductor device mounting structure, electro-optical device, electro-optical device manufacturing method and electronic device |
Feb. 20, 2007 |
| 7157791 |
Semiconductor chip assembly with press-fit ground plane |
Jan. 2, 2007 |
| 7148082 |
Method of making a semiconductor chip assembly with a press-fit ground plane |
Dec. 12, 2006 |
| 7132755 |
Adhesive film for manufacturing semiconductor device |
Nov. 7, 2006 |
| 7084516 |
Surface protection film |
Aug. 1, 2006 |
| 7067413 |
Wire bonding method, semiconductor chip, and semiconductor package |
Jun. 27, 2006 |
| 7005739 |
High power semiconductor module |
Feb. 28, 2006 |
| 6995464 |
Pressure-contact type semiconductor device |
Feb. 7, 2006 |
| 6969917 |
Electronic chip component with an integrated circuit and fabrication method |
Nov. 29, 2005 |
| 6967357 |
Voltage-driven power semiconductor device |
Nov. 22, 2005 |
| 6946744 |
System and method of reducing die attach stress and strain |
Sep. 20, 2005 |
| 6946725 |
Electronic device having microscopically small contact areas and methods for producing the electronic device |
Sep. 20, 2005 |
| 6906425 |
Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive |
Jun. 14, 2005 |
| 6885104 |
Semiconductor copper bond pad surface protection |
Apr. 26, 2005 |
| 6875931 |
Retainer for circuit board assembly and method for using the same |
Apr. 5, 2005 |
| 6870262 |
Wafer-bonding using solder and method of making the same |
Mar. 22, 2005 |
| 6862189 |
Electronic component, circuit device, method for manufacturing the circuit device, and semiconductor device |
Mar. 1, 2005 |
| 6853090 |
TAB tape for semiconductor package |
Feb. 8, 2005 |
| 6844631 |
Semiconductor device having a bond pad and method therefor |
Jan. 18, 2005 |
| 6836006 |
Semiconductor module |
Dec. 28, 2004 |
| 6833618 |
Memory system with a socket having socket pins for mounting memory modules |
Dec. 21, 2004 |
| 6815834 |
Electronic part |
Nov. 9, 2004 |
| 6815326 |
Method of manufacturing semiconductor electrode and semiconductor device provided with electrodes manufactured by the method |
Nov. 9, 2004 |
| 6800949 |
Embedded chip enclosure with solder-free interconnect |
Oct. 5, 2004 |
| 6791170 |
Onboard semiconductor device |
Sep. 14, 2004 |
| 6784535 |
Composite lid for land grid array (LGA) flip-chip package assembly |
Aug. 31, 2004 |
|
|
|
