| |
 |
|
Class Information
Number: 257/784
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Wire contact, lead, or bond
Description: Subject matter wherein the contact, lead or bond is a very flexible, elongated, small diameter filament made of electrically conductive material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7224060 |
Integrated circuit with protective moat |
May. 29, 2007 |
| 7224058 |
Integrated circuit package employing a heat-spreader member |
May. 29, 2007 |
| 7224053 |
Semiconductor device responsive to different levels of input and output signals and signal processing system using the same |
May. 29, 2007 |
| 7224052 |
IC card with controller and memory chips |
May. 29, 2007 |
| 7224047 |
Semiconductor device package with reduced leakage |
May. 29, 2007 |
| 7224044 |
Semiconductor chip mounting substrate and flat display |
May. 29, 2007 |
| 7223637 |
Method of manufacturing a sensor device with binding material having a foaming agent |
May. 29, 2007 |
| 7218006 |
Multi-chip stack package |
May. 15, 2007 |
| 7217995 |
Apparatus for stacking electrical components using insulated and interconnecting via |
May. 15, 2007 |
| 7215031 |
Multi chip package |
May. 8, 2007 |
| 7215016 |
Multi-chips stacked package |
May. 8, 2007 |
| 7215012 |
Space-efficient package for laterally conducting device |
May. 8, 2007 |
| 7214606 |
Method of fabricating a wire bond with multiple stitch bonds |
May. 8, 2007 |
| 7211903 |
Semiconductor device and manufacturing method of them |
May. 1, 2007 |
| 7211902 |
Method of forming a bonding pad structure |
May. 1, 2007 |
| 7211900 |
Thin semiconductor package including stacked dies |
May. 1, 2007 |
| 7211884 |
Implantable medical device construction using a flexible substrate |
May. 1, 2007 |
| 7208843 |
Routing design to minimize electromigration damage to solder bumps |
Apr. 24, 2007 |
| 7208841 |
Semiconductor device with strain relieving bump design |
Apr. 24, 2007 |
| 7208840 |
Semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module |
Apr. 24, 2007 |
| 7208839 |
Semiconductor component assemblies having interconnects |
Apr. 24, 2007 |
| 7208837 |
Semiconductor chip capable of implementing wire bonding over active circuits |
Apr. 24, 2007 |
| 7208833 |
Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate |
Apr. 24, 2007 |
| 7205673 |
Reduce or eliminate IMC cracking in post wire bonded dies by doping aluminum used in bond pads during Cu/Low-k BEOL processing |
Apr. 17, 2007 |
| 7205646 |
Electronic device and chip package |
Apr. 17, 2007 |
| 7205178 |
Land grid array packaged device and method of forming same |
Apr. 17, 2007 |
| 7202566 |
Crossed power strapped layout for full CMOS circuit design |
Apr. 10, 2007 |
| 7202559 |
Method of assembling a ball grid array package with patterned stiffener layer |
Apr. 10, 2007 |
| 7202558 |
Packages base which allows mounting of a semiconductor element and electrode-wiring terminals on a mounting surface |
Apr. 10, 2007 |
| 7199477 |
Multi-tiered lead package for an integrated circuit |
Apr. 3, 2007 |
| 7199469 |
Semiconductor device having stacked semiconductor chips sealed with a resin seal member |
Apr. 3, 2007 |
| 7199460 |
Semiconductor device and method of manufacturing the same |
Apr. 3, 2007 |
| 7199458 |
Stacked offset semiconductor package and method for fabricating |
Apr. 3, 2007 |
| 7199453 |
Semiconductor package and fabrication method thereof |
Apr. 3, 2007 |
| 7198979 |
Method for manufacturing a stack arrangement of a memory module |
Apr. 3, 2007 |
| 7196409 |
Semiconductor device, semiconductor body and method of manufacturing thereof |
Mar. 27, 2007 |
| 7193315 |
Test vehicle grid array package |
Mar. 20, 2007 |
| 7193298 |
Lead frame |
Mar. 20, 2007 |
| 7192861 |
Wire bonding for thin semiconductor package |
Mar. 20, 2007 |
| 7190080 |
Semiconductor chip assembly with embedded metal pillar |
Mar. 13, 2007 |
| 7190065 |
Circuit substrate, semiconductor module and method of manufacturing circuit substrate |
Mar. 13, 2007 |
| 7190060 |
Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same |
Mar. 13, 2007 |
| 7187072 |
Fabrication process of semiconductor package and semiconductor package |
Mar. 6, 2007 |
| 7183659 |
Semiconductor integrated circuit device having diagonal direction wiring and layout method therefor |
Feb. 27, 2007 |
| 7183658 |
Low cost microelectronic circuit package |
Feb. 27, 2007 |
| 7183656 |
Bilayer aluminum last metal for interconnects and wirebond pads |
Feb. 27, 2007 |
| 7183588 |
Light emission device |
Feb. 27, 2007 |
| 7180170 |
Lead-free integrated circuit package structure |
Feb. 20, 2007 |
| 7180162 |
Arrangement for reducing stress in substrate-based chip packages |
Feb. 20, 2007 |
| 7180161 |
Lead frame for improving molding reliability and semiconductor package with the lead frame |
Feb. 20, 2007 |
|
|
|
