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Class Information
Number: 257/784
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Wire contact, lead, or bond
Description: Subject matter wherein the contact, lead or bond is a very flexible, elongated, small diameter filament made of electrically conductive material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6633087 |
Low-capacitance bonding pad for semiconductor device |
Oct. 14, 2003 |
| 6630729 |
Low-profile semiconductor package with strengthening structure |
Oct. 7, 2003 |
| 6630730 |
Semiconductor device assemblies including interposers with dams protruding therefrom |
Oct. 7, 2003 |
| 6630732 |
Lead frames including inner-digitized bond fingers on bus bars and semiconductor device package including same |
Oct. 7, 2003 |
| 6630744 |
Multichip module |
Oct. 7, 2003 |
| 6627982 |
Electric connection structure for electronic power devices, and method of connection |
Sep. 30, 2003 |
| 6624522 |
Chip scale surface mounted device and process of manufacture |
Sep. 23, 2003 |
| 6624523 |
Structure and package of a heat spreader substrate |
Sep. 23, 2003 |
| 6621155 |
Integrated circuit device having stacked dies and impedance balanced transmission lines |
Sep. 16, 2003 |
| 6621156 |
Semiconductor device having stacked multi chip module structure |
Sep. 16, 2003 |
| 6621161 |
Semiconductor device having a package structure |
Sep. 16, 2003 |
| 6621171 |
Semiconductor device having a wire laid between pads |
Sep. 16, 2003 |
| 6617196 |
Semiconductor device |
Sep. 9, 2003 |
| 6617667 |
Optical device carrier |
Sep. 9, 2003 |
| 6617674 |
Semiconductor package and method of preparing same |
Sep. 9, 2003 |
| 6617698 |
Reworkable and thermally conductive adhesive and use thereof |
Sep. 9, 2003 |
| 6614100 |
Lead frame for the installation of an integrated circuit in an injection-molded package |
Sep. 2, 2003 |
| 6611063 |
Resin-encapsulated semiconductor device |
Aug. 26, 2003 |
| 6608385 |
Contact structure and production method thereof and probe contact assembly using same |
Aug. 19, 2003 |
| 6608387 |
Semiconductor device formed by mounting semiconductor chip on support substrate, and the support substrate |
Aug. 19, 2003 |
| 6608388 |
Delamination-preventing substrate and semiconductor package with the same |
Aug. 19, 2003 |
| 6608389 |
Semiconductor device with stress relieving layer comprising circuit board and electronic instrument |
Aug. 19, 2003 |
| 6608390 |
Wirebonded semiconductor package structure and method of manufacture |
Aug. 19, 2003 |
| 6605871 |
RF circuit chip and RF circuit device including the RF circuit chip |
Aug. 12, 2003 |
| 6602778 |
Apparatus and methods for coupling conductive leads of semiconductor assemblies |
Aug. 5, 2003 |
| 6603182 |
Packaging micromechanical devices |
Aug. 5, 2003 |
| 6603183 |
Quick sealing glass-lidded package |
Aug. 5, 2003 |
| 6603209 |
Compliant integrated circuit package |
Aug. 5, 2003 |
| 6599578 |
Method for improving integrated circuits bonding firmness |
Jul. 29, 2003 |
| 6600174 |
Light receiving element and semiconductor laser device |
Jul. 29, 2003 |
| 6600221 |
Semiconductor device with stacked semiconductor chips |
Jul. 29, 2003 |
| 6601125 |
Minimizing signal stub length for high speed busses |
Jul. 29, 2003 |
| 6597065 |
Thermally enhanced semiconductor chip having integrated bonds over active circuits |
Jul. 22, 2003 |
| 6593647 |
Semiconductor device |
Jul. 15, 2003 |
| 6593658 |
Chip package capable of reducing moisture penetration |
Jul. 15, 2003 |
| 6593662 |
Stacked-die package structure |
Jul. 15, 2003 |
| 6593664 |
Chip module with bond-wire connections with small loop height |
Jul. 15, 2003 |
| 6590279 |
Dual-chip integrated circuit package and method of manufacturing the same |
Jul. 8, 2003 |
| 6590281 |
Crack-preventive semiconductor package |
Jul. 8, 2003 |
| 6590291 |
Semiconductor device and manufacturing method therefor |
Jul. 8, 2003 |
| 6590296 |
Semiconductor device with staggered hexagonal electrodes and increased wiring width |
Jul. 8, 2003 |
| 6590297 |
Semiconductor chip having pads with plural junctions for different assembly methods |
Jul. 8, 2003 |
| 6586824 |
Reduced thickness packaged electronic device |
Jul. 1, 2003 |
| 6586825 |
Dual chip in package with a wire bonded die mounted to a substrate |
Jul. 1, 2003 |
| 6586834 |
Die-up tape ball grid array package |
Jul. 1, 2003 |
| 6586845 |
Semiconductor device module and a part thereof |
Jul. 1, 2003 |
| 6586846 |
Low cost decal material used for packaging |
Jul. 1, 2003 |
| 6587008 |
Piezoelectric oscillator and a method for manufacturing the same |
Jul. 1, 2003 |
| 6583444 |
Semiconductor packages having light-sensitive chips |
Jun. 24, 2003 |
| 6580159 |
Integrated circuit device packages and substrates for making the packages |
Jun. 17, 2003 |
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