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Class Information
Number: 257/784
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Wire contact, lead, or bond
Description: Subject matter wherein the contact, lead or bond is a very flexible, elongated, small diameter filament made of electrically conductive material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618842 |
Method of applying encapsulant to wire bonds |
Nov. 17, 2009 |
| 7617966 |
Semiconductor device |
Nov. 17, 2009 |
| 7615874 |
Electronic component module |
Nov. 10, 2009 |
| 7615871 |
Method and apparatus for attaching microelectronic substrates and support members |
Nov. 10, 2009 |
| 7615866 |
Contact surrounded by passivation and polymide and method therefor |
Nov. 10, 2009 |
| 7615853 |
Chip-stacked package structure having leadframe with multi-piece bus bar |
Nov. 10, 2009 |
| 7612459 |
Multi-chip module and single-chip module for chips and proximity connectors |
Nov. 3, 2009 |
| 7612444 |
Semiconductor package with flow controller |
Nov. 3, 2009 |
| 7612437 |
Thermally enhanced single inline package (SIP) |
Nov. 3, 2009 |
| 7612436 |
Packaged microelectronic devices with a lead frame |
Nov. 3, 2009 |
| 7608930 |
Semiconductor device and method of manufacturing semiconductor device |
Oct. 27, 2009 |
| 7608925 |
Relay board with bonding pads connected by wirings |
Oct. 27, 2009 |
| 7608921 |
Multi-layer semiconductor package |
Oct. 27, 2009 |
| 7605478 |
Semiconductor package and method of manufacturing the same |
Oct. 20, 2009 |
| 7605459 |
Coreless substrate and manufacturing thereof |
Oct. 20, 2009 |
| 7605452 |
Semiconductor light-emitting device, semiconductor light-emitting module, and method of manufacturing the semiconductor light-emitting module |
Oct. 20, 2009 |
| 7602070 |
Room temperature metal direct bonding |
Oct. 13, 2009 |
| 7598622 |
Encapsulation of a chip module |
Oct. 6, 2009 |
| 7598620 |
Copper bonding compatible bond pad structure and method |
Oct. 6, 2009 |
| 7598604 |
Low profile semiconductor package |
Oct. 6, 2009 |
| 7598603 |
Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink |
Oct. 6, 2009 |
| 7595561 |
Semiconductor device including multiple rows of peripheral circuit units |
Sep. 29, 2009 |
| 7595560 |
Semiconductor device |
Sep. 29, 2009 |
| 7592710 |
Bond pad structure for wire bonding |
Sep. 22, 2009 |
| 7592709 |
Board on chip package and method of manufacturing the same |
Sep. 22, 2009 |
| 7592700 |
Semiconductor chip and method of manufacturing semiconductor chip |
Sep. 22, 2009 |
| 7592681 |
Solid-state imaging apparatus |
Sep. 22, 2009 |
| 7584881 |
Low loop height ball bonding method and apparatus |
Sep. 8, 2009 |
| 7582971 |
Semiconductor device and manufacturing method of the same |
Sep. 1, 2009 |
| 7582909 |
Mounting and adhesive layer for semiconductor components |
Sep. 1, 2009 |
| 7582553 |
Method of bonding flying leads |
Sep. 1, 2009 |
| 7579697 |
Arrangement for high frequency application |
Aug. 25, 2009 |
| 7579696 |
Semiconductor device |
Aug. 25, 2009 |
| 7579695 |
Integration type semiconductor device and method for manufacturing the same |
Aug. 25, 2009 |
| 7579676 |
Leadless leadframe implemented in a leadframe-based BGA package |
Aug. 25, 2009 |
| 7576439 |
Electrically connecting substrate with electrical device |
Aug. 18, 2009 |
| 7576431 |
Semiconductor chip package and multichip package |
Aug. 18, 2009 |
| 7575953 |
Stacked die with a recess in a die BGA package |
Aug. 18, 2009 |
| 7569940 |
Method and device for connecting chips |
Aug. 4, 2009 |
| 7569922 |
Semiconductor device having a bonding wire and method for manufacturing the same |
Aug. 4, 2009 |
| 7569921 |
Semiconductor device and manufacturing method thereof |
Aug. 4, 2009 |
| 7569920 |
Electronic component having at least one vertical semiconductor power transistor |
Aug. 4, 2009 |
| 7566969 |
Semiconductor device with improved arrangement of a through-hole in a wiring substrate |
Jul. 28, 2009 |
| 7566968 |
Biosensor with smart card configuration |
Jul. 28, 2009 |
| 7566962 |
Semiconductor package structure and method for manufacturing the same |
Jul. 28, 2009 |
| 7564141 |
Apparatus and method for preventing configurable system-on-a-chip integrated circuits from becoming I/O limited |
Jul. 21, 2009 |
| 7563650 |
Circuit board and the manufacturing method |
Jul. 21, 2009 |
| 7561434 |
Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon |
Jul. 14, 2009 |
| 7560814 |
Semiconductor device that improves electrical connection reliability |
Jul. 14, 2009 |
| 7560809 |
Semiconductor device |
Jul. 14, 2009 |
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