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Browse by Category: Main > Physics
Class Information
Number: 257/784
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Wire contact, lead, or bond
Description: Subject matter wherein the contact, lead or bond is a very flexible, elongated, small diameter filament made of electrically conductive material.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710681 Isolation rings for blocking the interface between package components and the respective molding compound Apr. 29, 2014
8710680 Electronic device package and fabrication method thereof Apr. 29, 2014
8710679 Electrode structure and its manufacturing method, and semiconductor module Apr. 29, 2014
8710677 Multi-chip package with a supporting member and method of manufacturing the same Apr. 29, 2014
8710674 Internal wiring structure of semiconductor device Apr. 29, 2014
8710669 Semiconductor device manufacture in which minimum wiring pitch of connecting portion wiring layer is less than minimum wiring pitch of any other wiring layer Apr. 29, 2014
8710653 Chip on chip semiconductor device including an underfill layer having a resin containing an amine-based curing agent Apr. 29, 2014
8710647 Semiconductor device having a first conductive member connecting a chip to a wiring board pad and a second conductive member connecting the wiring board pad to a land on an insulator covering Apr. 29, 2014
8710644 Semiconductor unit having a power semiconductor and semiconductor apparatus using the same Apr. 29, 2014
8709868 Sensor packages and method of packaging dies of differing sizes Apr. 29, 2014
8704385 Semiconductor device having pad region for wire-bonding and method of manufacturing the semiconductor device Apr. 22, 2014
8704383 Silicon-based thin substrate and packaging schemes Apr. 22, 2014
8704356 High temperature interconnect assemblies for high temperature electronics utilizing transition pads Apr. 22, 2014
8704351 Stacked microelectronic assemblies Apr. 22, 2014
8704265 Light emitting device package and lighting apparatus using the same Apr. 22, 2014
8693203 Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices Apr. 8, 2014
8692383 Semiconductor device and method of manufacturing the same Apr. 8, 2014
8692370 Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer Apr. 8, 2014
8691631 Device including two mounting surfaces Apr. 8, 2014
8687378 High-frequency module Apr. 1, 2014
8686573 Semiconductor device Apr. 1, 2014
8680690 Bond wire arrangement for efficient signal transmission Mar. 25, 2014
8680661 Direct contact package for power transistors Mar. 25, 2014
8680660 Brace for bond wire Mar. 25, 2014
8679963 Fan-out chip scale package Mar. 25, 2014
8669555 Semiconductor device Mar. 11, 2014
8664775 Semiconductor device Mar. 4, 2014
8664774 Bondwire configuration for reduced crosstalk Mar. 4, 2014
8664754 High power semiconductor package with multiple conductive clips Mar. 4, 2014
8659175 Integrated circuit package system with offset stack Feb. 25, 2014
8659173 Isolated wire structures with reduced stress, methods of manufacturing and design structures Feb. 25, 2014
8659149 Semiconductor structure with galvanic isolation Feb. 25, 2014
8656333 Integrated circuit package auto-routing Feb. 18, 2014
8653668 Copper bonding wire for semiconductor device and bonding structure thereof Feb. 18, 2014
8653667 Power MOSFET having selectively silvered pads for clip and bond wire attach Feb. 18, 2014
8653660 Semiconductor device and package Feb. 18, 2014
8653626 Package structures including a capacitor and methods of forming the same Feb. 18, 2014
8648474 Lead frame land grid array Feb. 11, 2014
8648340 Semiconductor device for driving electric motor Feb. 11, 2014
8643189 Packaged semiconductor die with power rail pads Feb. 4, 2014
8643188 Connecting system for electrically connecting electronic devices and method for connecting an electrically conductive first connector and electrically conductive second connector Feb. 4, 2014
8643179 Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package Feb. 4, 2014
8643016 Display device having a pad in electrical contact with a circuit board Feb. 4, 2014
8642393 Package on package devices and methods of forming same Feb. 4, 2014
8637983 Face-to-face (F2F) hybrid structure for an integrated circuit Jan. 28, 2014
8637979 Semiconductor device Jan. 28, 2014
8637975 Semiconductor device having lead wires connecting bonding pads formed on opposite sides of a core region forming a shield area Jan. 28, 2014
8637394 Integrated circuit package system with flex bump Jan. 28, 2014
8633592 Hybrid interconnect technology Jan. 21, 2014
8633407 Semiconductor device capable of switching operation modes Jan. 21, 2014











 
 
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