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Class Information
Number: 257/784
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Wire contact, lead, or bond
Description: Subject matter wherein the contact, lead or bond is a very flexible, elongated, small diameter filament made of electrically conductive material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459776 |
Stacked die assembly having semiconductor die projecting beyond support |
Dec. 2, 2008 |
| 7456506 |
Radio frequency identification (RFID) tag lamination process using liner |
Nov. 25, 2008 |
| 7456505 |
Integrated circuit chip and integrated device |
Nov. 25, 2008 |
| 7454300 |
Extracting high frequency impedance in a circuit design using broadband representations |
Nov. 18, 2008 |
| 7453159 |
Semiconductor chip having bond pads |
Nov. 18, 2008 |
| 7453156 |
Wire bond interconnection |
Nov. 18, 2008 |
| 7449786 |
Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors |
Nov. 11, 2008 |
| 7449370 |
Production process for manufacturing such semiconductor package |
Nov. 11, 2008 |
| 7446399 |
Pad structures to improve board-level reliability of solder-on-pad BGA structures |
Nov. 4, 2008 |
| 7446396 |
Stacked integrated circuit leadframe package system |
Nov. 4, 2008 |
| 7443043 |
Circuit device and method of manufacture thereof |
Oct. 28, 2008 |
| 7443042 |
Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit |
Oct. 28, 2008 |
| 7443041 |
Packaging of a microchip device |
Oct. 28, 2008 |
| 7443039 |
System for different bond pads in an integrated circuit package |
Oct. 28, 2008 |
| 7443018 |
Integrated circuit package system including ribbon bond interconnect |
Oct. 28, 2008 |
| 7443010 |
Matrix form semiconductor package substrate having an electrode of serpentine shape |
Oct. 28, 2008 |
| 7439612 |
Integrated circuit package structure with gap through lead bar between a die edge and an attachment point corresponding to a conductive connector |
Oct. 21, 2008 |
| 7436074 |
Chip package without core and stacked chip package structure thereof |
Oct. 14, 2008 |
| 7432585 |
Semiconductor device electronic component, circuit board, and electronic device |
Oct. 7, 2008 |
| 7432536 |
LED with self aligned bond pad |
Oct. 7, 2008 |
| 7429797 |
Electronic device and carrier substrate |
Sep. 30, 2008 |
| 7429787 |
Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides |
Sep. 30, 2008 |
| 7429786 |
Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides |
Sep. 30, 2008 |
| 7429703 |
Methods and apparatus for integrated circuit device power distribution via internal wire bonds |
Sep. 30, 2008 |
| 7425767 |
Chip structure with redistribution traces |
Sep. 16, 2008 |
| 7425758 |
Metal core foldover package structures |
Sep. 16, 2008 |
| 7425756 |
Semiconductor device and electronic device |
Sep. 16, 2008 |
| 7423334 |
Image sensor module with a protection layer and a method for manufacturing the same |
Sep. 9, 2008 |
| 7420286 |
Reduced inductance in ball grid array packages |
Sep. 2, 2008 |
| 7420283 |
Integration type semiconductor device and method for manufacturing the same |
Sep. 2, 2008 |
| 7420281 |
Stacked chip semiconductor device |
Sep. 2, 2008 |
| 7420280 |
Reduced stress under bump metallization structure |
Sep. 2, 2008 |
| 7420266 |
Circuit device and manufacturing method thereof |
Sep. 2, 2008 |
| 7417327 |
IC chip package with cover |
Aug. 26, 2008 |
| 7417324 |
Semiconductor device and method for manufacturing the same |
Aug. 26, 2008 |
| 7417314 |
Semiconductor chip assembly with laterally aligned bumped terminal and filler |
Aug. 26, 2008 |
| 7417295 |
Insulated gate semiconductor device and manufacturing method thereof |
Aug. 26, 2008 |
| 7414321 |
Wiring configuration for semiconductor component |
Aug. 19, 2008 |
| 7414320 |
Semiconductor device and method of manufacturing same |
Aug. 19, 2008 |
| 7414313 |
Polymeric conductor donor and transfer method |
Aug. 19, 2008 |
| 7411294 |
Display device having misalignment detection pattern for detecting misalignment between conductive layer and insulating layer |
Aug. 12, 2008 |
| 7408260 |
Microelectronic assemblies having compliant layers |
Aug. 5, 2008 |
| 7408256 |
Integrated circuit chip module |
Aug. 5, 2008 |
| 7405486 |
Circuit device |
Jul. 29, 2008 |
| 7405467 |
Power module package structure |
Jul. 29, 2008 |
| 7405109 |
Method of fabricating the routing of electrical signals |
Jul. 29, 2008 |
| 7402904 |
Semiconductor device having wires that vary in wiring pitch |
Jul. 22, 2008 |
| 7400036 |
Semiconductor chip package with a package substrate and a lid cover |
Jul. 15, 2008 |
| 7400032 |
Module assembly for stacked BGA packages |
Jul. 15, 2008 |
| 7397137 |
Direct FET device for high frequency application |
Jul. 8, 2008 |
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