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Class Information
Number: 257/783
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Die bond > With adhesive means
Description: Subject matter wherein adhesive means (e.g., a layer) is provided to secure a die (chip) which contains an active solid-state electronic device to a supporting member.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6630738 |
Deflectable interconnect |
Oct. 7, 2003 |
| 6630686 |
Liquid crystal display having pad parts and method for manufacturing same |
Oct. 7, 2003 |
| 6627982 |
Electric connection structure for electronic power devices, and method of connection |
Sep. 30, 2003 |
| 6624512 |
Semiconductor integrated circuit device and printed wired board for mounting the same |
Sep. 23, 2003 |
| 6624046 |
Three dimensional processor using transferred thin film circuits |
Sep. 23, 2003 |
| 6624523 |
Structure and package of a heat spreader substrate |
Sep. 23, 2003 |
| 6621166 |
Five layer adhesive/insulator/metal/insulator/adhesive tape for semiconductor die packaging |
Sep. 16, 2003 |
| 6621173 |
Semiconductor device having an adhesive and a sealant |
Sep. 16, 2003 |
| 6621170 |
Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film |
Sep. 16, 2003 |
| 6621154 |
Semiconductor apparatus having stress cushioning layer |
Sep. 16, 2003 |
| 6620652 |
Semiconductor device and method of making the same |
Sep. 16, 2003 |
| 6621168 |
Interconnected circuit board assembly and system |
Sep. 16, 2003 |
| 6617683 |
Thermal performance in flip chip/integral heat spreader packages using low modulus thermal interface material |
Sep. 9, 2003 |
| 6617698 |
Reworkable and thermally conductive adhesive and use thereof |
Sep. 9, 2003 |
| 6614123 |
Plastic ball grid array package with integral heatsink |
Sep. 2, 2003 |
| 6614122 |
Controlling underfill flow locations on high density packages using physical trenches and dams |
Sep. 2, 2003 |
| 6611064 |
Semiconductor device and method for manufacturing the same |
Aug. 26, 2003 |
| 6608387 |
Semiconductor device formed by mounting semiconductor chip on support substrate, and the support substrate |
Aug. 19, 2003 |
| 6608372 |
Surface mountable chip type semiconductor device and manufacturing method |
Aug. 19, 2003 |
| 6608382 |
Metal bump |
Aug. 19, 2003 |
| 6608388 |
Delamination-preventing substrate and semiconductor package with the same |
Aug. 19, 2003 |
| 6605779 |
Electronic control unit |
Aug. 12, 2003 |
| 6603183 |
Quick sealing glass-lidded package |
Aug. 5, 2003 |
| 6603209 |
Compliant integrated circuit package |
Aug. 5, 2003 |
| 6602736 |
Method and apparatus for separating semiconductor chips |
Aug. 5, 2003 |
| 6600222 |
Stacked microelectronic packages |
Jul. 29, 2003 |
| 6600216 |
Structure of a pin platform for integrated circuit |
Jul. 29, 2003 |
| 6593647 |
Semiconductor device |
Jul. 15, 2003 |
| 6593663 |
Electronic device including stacked microchips |
Jul. 15, 2003 |
| 6589802 |
Packaging structure and method of packaging electronic parts |
Jul. 8, 2003 |
| 6590269 |
Package structure for a photosensitive chip |
Jul. 8, 2003 |
| 6590285 |
Method and composition for mounting an electronic component and device formed therewith |
Jul. 8, 2003 |
| 6590286 |
Land grid array semiconductor device |
Jul. 8, 2003 |
| 6590287 |
Packaging method and packaging structures of semiconductor devices |
Jul. 8, 2003 |
| 6590292 |
Thermal and mechanical attachment of a heatspreader to a flip-chip integrated circuit structure using underfill |
Jul. 8, 2003 |
| 6590297 |
Semiconductor chip having pads with plural junctions for different assembly methods |
Jul. 8, 2003 |
| 6586825 |
Dual chip in package with a wire bonded die mounted to a substrate |
Jul. 1, 2003 |
| 6580160 |
Coupling spaced bond pads to a contact |
Jun. 17, 2003 |
| 6580173 |
Semiconductor device and manufacturing method of semiconductor device |
Jun. 17, 2003 |
| 6576990 |
Stress-free silicon wafer and a die or chip made therefrom and method |
Jun. 10, 2003 |
| 6576972 |
High temperature circuit structures with expansion matched SiC, AlN and/or AlxGa1-xN(x>0.69) circuit device |
Jun. 10, 2003 |
| 6576987 |
Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die |
Jun. 10, 2003 |
| 6566763 |
Interconnect substrate, apparatus of applying adhesive material, semiconductor device, circuit board and electronic instrument |
May. 20, 2003 |
| 6563225 |
Product using Zn-Al alloy solder |
May. 13, 2003 |
| 6563198 |
Adhesive pad having EMC shielding characteristics |
May. 13, 2003 |
| 6563217 |
Module assembly for stacked BGA packages |
May. 13, 2003 |
| 6555921 |
Semiconductor package |
Apr. 29, 2003 |
| 6555923 |
Semiconductor chip having pads with plural junctions for different assembly methods |
Apr. 29, 2003 |
| 6552421 |
Semiconductor device and a method of manufacturing the same |
Apr. 22, 2003 |
| 6552418 |
Resin-encapsulated semiconductor device |
Apr. 22, 2003 |
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