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Browse by Category: Main > Physics
Class Information
Number: 257/783
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Die bond > With adhesive means
Description: Subject matter wherein adhesive means (e.g., a layer) is provided to secure a die (chip) which contains an active solid-state electronic device to a supporting member.


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

Patent Number Title Of Patent Date Issued
7456504 Electronic component assemblies with electrically conductive bonds Nov. 25, 2008
7449367 Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device Nov. 11, 2008
7446423 Semiconductor device and method for assembling the same Nov. 4, 2008
7446424 Interconnect structure for semiconductor package Nov. 4, 2008
7443027 Electronic device having coalesced metal nanoparticles Oct. 28, 2008
7443041 Packaging of a microchip device Oct. 28, 2008
7439475 Thermally conductive body and method of manufacturing the same Oct. 21, 2008
7436074 Chip package without core and stacked chip package structure thereof Oct. 14, 2008
7436058 Reactive solder material Oct. 14, 2008
7432580 Semiconductor device with a substrate having a spiral shaped coil Oct. 7, 2008
7432590 Ceramic package, assembled substrate, and manufacturing method therefor Oct. 7, 2008
7432602 Semiconductor device Oct. 7, 2008
7429799 Land patterns for a semiconductor stacking structure and method therefor Sep. 30, 2008
7427811 Semiconductor substrate Sep. 23, 2008
7423349 Semiconductor device Sep. 9, 2008
7423348 Chip structure and chip package structure Sep. 9, 2008
7423334 Image sensor module with a protection layer and a method for manufacturing the same Sep. 9, 2008
7419855 Apparatus and method for miniature semiconductor packages Sep. 2, 2008
7420265 Integrated circuit package system with integrated circuit support Sep. 2, 2008
7416921 Method for flip-chip mounting utilizing a delay curing-type adhesive with two-part hardening resin Aug. 26, 2008
7416923 Underfill film having thermally conductive sheet Aug. 26, 2008
7417327 IC chip package with cover Aug. 26, 2008
7414301 Printed circuit board with soldering lands Aug. 19, 2008
7408264 SMT passive device noflow underfill methodology and structure Aug. 5, 2008
7408263 Anisotropic conductive coatings and electronic devices Aug. 5, 2008
7405470 Adaptable electronic storage apparatus Jul. 29, 2008
7400032 Module assembly for stacked BGA packages Jul. 15, 2008
7397140 Chip module Jul. 8, 2008
7394163 Method of mounting semiconductor chip Jul. 1, 2008
7394153 Encapsulation of electronic devices Jul. 1, 2008
7391120 Increasing the adhesion of an adhesive connection in housings Jun. 24, 2008
7387841 Silicone-based cyanate-ester cross-linkable die attach adhesive Jun. 17, 2008
7381590 Method and device including reworkable alpha particle barrier and corrosion barrier Jun. 3, 2008
7378748 Solid-state imaging device and method for manufacturing the same May. 27, 2008
7375435 Chip package structure May. 20, 2008
7371608 Method of fabricating a stacked die having a recess in a die BGA package May. 13, 2008
7365421 IC chip package with isolated vias Apr. 29, 2008
7365441 Semiconductor device fabricating apparatus and semiconductor device fabricating method Apr. 29, 2008
7361987 Circuit device with at least partial packaging and method for forming Apr. 22, 2008
7358619 Tape carrier for TAB Apr. 15, 2008
7358617 Bond pad for ball grid array package Apr. 15, 2008
7358616 Semiconductor stacked die/wafer configuration and packaging and method thereof Apr. 15, 2008
7355278 Mold die for a semiconductor device Apr. 8, 2008
7335533 Methods for assembling semiconductor devices in superimposed relation with adhesive material defining the distance adjacent semiconductor devices are spaced apart from one another Feb. 26, 2008
7331106 Underfill method Feb. 19, 2008
7332372 Methods for forming assemblies and packages that include stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween Feb. 19, 2008
RE40061 Multi-chip stacked devices Feb. 12, 2008
7327041 Semiconductor package and a method for producing the same Feb. 5, 2008
7320902 Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument Jan. 22, 2008
7319266 Encapsulated electronic device structure Jan. 15, 2008

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