| |
 |
|
Class Information
Number: 257/783
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Die bond > With adhesive means
Description: Subject matter wherein adhesive means (e.g., a layer) is provided to secure a die (chip) which contains an active solid-state electronic device to a supporting member.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615871 |
Method and apparatus for attaching microelectronic substrates and support members |
Nov. 10, 2009 |
| 7615872 |
Semiconductor device |
Nov. 10, 2009 |
| 7611926 |
Thermosetting die bonding film |
Nov. 3, 2009 |
| 7605474 |
Structure of polymer-matrix conductive film and method for fabricating the same |
Oct. 20, 2009 |
| 7598622 |
Encapsulation of a chip module |
Oct. 6, 2009 |
| 7592708 |
Package board, semiconductor package, and fabricating method thereof |
Sep. 22, 2009 |
| 7586180 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
Sep. 8, 2009 |
| 7582974 |
Semiconductor device and method of manufacturing same |
Sep. 1, 2009 |
| 7579260 |
Method of dividing an adhesive film bonded to a wafer |
Aug. 25, 2009 |
| 7579676 |
Leadless leadframe implemented in a leadframe-based BGA package |
Aug. 25, 2009 |
| 7573141 |
Semiconductor package with a chip on a support plate |
Aug. 11, 2009 |
| 7566575 |
Mounting circuit and method for producing semiconductor-chip-mounting circuit |
Jul. 28, 2009 |
| 7564140 |
Semiconductor package and substrate structure thereof |
Jul. 21, 2009 |
| 7564139 |
Semiconductor device and method for manufacturing the same |
Jul. 21, 2009 |
| 7563706 |
Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device |
Jul. 21, 2009 |
| 7560819 |
Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
Jul. 14, 2009 |
| 7554197 |
High frequency IC package and method for fabricating the same |
Jun. 30, 2009 |
| 7553701 |
Semiconductor packaging method |
Jun. 30, 2009 |
| 7550318 |
Interconnect for improved die to substrate electrical coupling |
Jun. 23, 2009 |
| 7541667 |
Semiconductor device and method of manufacturing the same |
Jun. 2, 2009 |
| 7535111 |
Semiconductor component with semiconductor chip and adhesive film, and method for its production |
May. 19, 2009 |
| 7535094 |
Substrate structure, a method and an arrangement for producing such substrate structure |
May. 19, 2009 |
| 7521797 |
Method of manufacturing substrate joint body, substrate joint body and electrooptical device |
Apr. 21, 2009 |
| 7518237 |
Microfeature systems including adhered microfeature workpieces and support members |
Apr. 14, 2009 |
| 7514772 |
Method of manufacturing a semiconductor apparatus |
Apr. 7, 2009 |
| 7511382 |
Semiconductor chip arrangement and method |
Mar. 31, 2009 |
| 7507604 |
Breakable interconnects and structures formed thereby |
Mar. 24, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7498679 |
Package substrate and semiconductor package using the same |
Mar. 3, 2009 |
| 7495345 |
Semiconductor device-composing substrate and semiconductor device |
Feb. 24, 2009 |
| 7495326 |
Stacked electronic structures including offset substrates |
Feb. 24, 2009 |
| 7488532 |
Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same |
Feb. 10, 2009 |
| 7485494 |
Dicing die adhesive film for semiconductor |
Feb. 3, 2009 |
| 7485496 |
Semiconductor device package with a heat sink and method for fabricating the same |
Feb. 3, 2009 |
| 7479702 |
Composite conductive film and semiconductor package using such film |
Jan. 20, 2009 |
| 7479705 |
Semiconductor device |
Jan. 20, 2009 |
| 7476982 |
Fabricated adhesive microstructures for making an electrical connection |
Jan. 13, 2009 |
| 7476981 |
Electronic module with layer of adhesive and process for producing it |
Jan. 13, 2009 |
| 7476975 |
Semiconductor device and resin structure therefor |
Jan. 13, 2009 |
| 7476959 |
Encapsulated electronic device |
Jan. 13, 2009 |
| 7476955 |
Die package having an adhesive flow restriction area |
Jan. 13, 2009 |
| 7470986 |
Mounting structure, electro-optical device, and electronic apparatus |
Dec. 30, 2008 |
| 7462931 |
Indented structure for encapsulated devices and method of manufacture |
Dec. 9, 2008 |
| 7462942 |
Die pillar structures and a method of their formation |
Dec. 9, 2008 |
| 7462943 |
Semiconductor assembly for improved device warpage and solder ball coplanarity |
Dec. 9, 2008 |
| 7456504 |
Electronic component assemblies with electrically conductive bonds |
Nov. 25, 2008 |
| 7449367 |
Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device |
Nov. 11, 2008 |
| 7446424 |
Interconnect structure for semiconductor package |
Nov. 4, 2008 |
| 7446423 |
Semiconductor device and method for assembling the same |
Nov. 4, 2008 |
| 7443027 |
Electronic device having coalesced metal nanoparticles |
Oct. 28, 2008 |
|
|
|
