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Class Information
Number: 257/783
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Die bond > With adhesive means
Description: Subject matter wherein adhesive means (e.g., a layer) is provided to secure a die (chip) which contains an active solid-state electronic device to a supporting member.










Patents under this class:

Patent Number Title Of Patent Date Issued
8704382 Film for flip chip type semiconductor back surface Apr. 22, 2014
8693210 Product packaging Apr. 8, 2014
8692390 Pyramid bump structure Apr. 8, 2014
8692389 Dicing tape-integrated film for semiconductor back surface Apr. 8, 2014
8692383 Semiconductor device and method of manufacturing the same Apr. 8, 2014
8691630 Semiconductor package structure and manufacturing method thereof Apr. 8, 2014
8686556 Wafer level applied thermal heat sink Apr. 1, 2014
8674521 Semiconductor device package including a paste member Mar. 18, 2014
8674520 Semiconductor device, method for manufacturing the same, and power supply unit Mar. 18, 2014
8674495 Package systems having a eutectic bonding material and manufacturing methods thereof Mar. 18, 2014
8659175 Integrated circuit package system with offset stack Feb. 25, 2014
8653668 Copper bonding wire for semiconductor device and bonding structure thereof Feb. 18, 2014
8648476 Dicing tape-integrated wafer back surface protective film Feb. 11, 2014
8643188 Connecting system for electrically connecting electronic devices and method for connecting an electrically conductive first connector and electrically conductive second connector Feb. 4, 2014
8643161 Semiconductor device having double side electrode structure Feb. 4, 2014
8642391 Self-assembly of chips on a substrate Feb. 4, 2014
8638001 Adhesive sheet for producing semiconductor device Jan. 28, 2014
8637945 Component having a micromechanical microphone structure, and method for its production Jan. 28, 2014
8633600 Device and method for manufacturing a device Jan. 21, 2014
8633592 Hybrid interconnect technology Jan. 21, 2014
8618653 Integrated circuit package system with wafer scale heat slug Dec. 31, 2013
8610290 Fabricated adhesive microstructures for making an electrical connection Dec. 17, 2013
8604623 Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive Dec. 10, 2013
8604595 Multi-chip electronic package with reduced stress Dec. 10, 2013
8598719 Semiconductor element mounting board Dec. 3, 2013
8592996 Semiconductor device and method of manufacturing the same Nov. 26, 2013
8558400 Semiconductor packages and methods of fabricating the same Oct. 15, 2013
8558397 Dicing tape-integrated wafer back surface protective film Oct. 15, 2013
8552551 Adhesive/spacer island structure for stacking over wire bonded die Oct. 8, 2013
8552546 Semiconductor package, semiconductor package structure including the semiconductor package, and mobile phone including the semiconductor package structure Oct. 8, 2013
8546958 Pressure-sensitive adhesive sheet for protecting semiconductor wafer Oct. 1, 2013
8525351 Semiconductor device, substrate for producing semiconductor device and method of producing them Sep. 3, 2013
8519549 Anisotropic conductive film and display device having the same Aug. 27, 2013
8513816 Film for flip chip type semiconductor back surface containing thermoconductive filler Aug. 20, 2013
8513061 Method of fabricating a TSV for 3D packaging of semiconductor device Aug. 20, 2013
8508043 Metal pad structure for thickness enhancement of polymer used in electrical interconnection of semiconductor die to semiconductor chip package substrate with solder bump Aug. 13, 2013
8508039 Wafer scale chip scale packaging of vertically integrated MEMS sensors with electronics Aug. 13, 2013
8507803 Structure of connecting printed wiring boards, method of connecting printed wiring boards, and adhesive having anisotropic conductivity Aug. 13, 2013
8507080 Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting material Aug. 13, 2013
8502400 Methods and apparatuses to stiffen integrated circuit package Aug. 6, 2013
8501583 Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates Aug. 6, 2013
8492898 Printed circuit boards Jul. 23, 2013
8492856 Sealed electric element package Jul. 23, 2013
8482122 Conductive pad structure, chip package structure and device substrate Jul. 9, 2013
8472196 Power module Jun. 25, 2013
8471392 Semiconductor apparatus and endoscope apparatus Jun. 25, 2013
8467192 Method for producing a rollable web and a rollable web Jun. 18, 2013
8461696 Substrate for semiconductor package, semiconductor package including the same, and stack package using the semiconductor package Jun. 11, 2013
8450739 Electrooptical device substrate and method for manufacturing the same, electrooptical device, and electronic apparatus May. 28, 2013
8441126 Semiconductor device May. 14, 2013











 
 
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