| |
 |
|
Class Information
Number: 257/783
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Die bond > With adhesive means
Description: Subject matter wherein adhesive means (e.g., a layer) is provided to secure a die (chip) which contains an active solid-state electronic device to a supporting member.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7456504 |
Electronic component assemblies with electrically conductive bonds |
Nov. 25, 2008 |
| 7449367 |
Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device |
Nov. 11, 2008 |
| 7446423 |
Semiconductor device and method for assembling the same |
Nov. 4, 2008 |
| 7446424 |
Interconnect structure for semiconductor package |
Nov. 4, 2008 |
| 7443027 |
Electronic device having coalesced metal nanoparticles |
Oct. 28, 2008 |
| 7443041 |
Packaging of a microchip device |
Oct. 28, 2008 |
| 7439475 |
Thermally conductive body and method of manufacturing the same |
Oct. 21, 2008 |
| 7436074 |
Chip package without core and stacked chip package structure thereof |
Oct. 14, 2008 |
| 7436058 |
Reactive solder material |
Oct. 14, 2008 |
| 7432580 |
Semiconductor device with a substrate having a spiral shaped coil |
Oct. 7, 2008 |
| 7432590 |
Ceramic package, assembled substrate, and manufacturing method therefor |
Oct. 7, 2008 |
| 7432602 |
Semiconductor device |
Oct. 7, 2008 |
| 7429799 |
Land patterns for a semiconductor stacking structure and method therefor |
Sep. 30, 2008 |
| 7427811 |
Semiconductor substrate |
Sep. 23, 2008 |
| 7423349 |
Semiconductor device |
Sep. 9, 2008 |
| 7423348 |
Chip structure and chip package structure |
Sep. 9, 2008 |
| 7423334 |
Image sensor module with a protection layer and a method for manufacturing the same |
Sep. 9, 2008 |
| 7419855 |
Apparatus and method for miniature semiconductor packages |
Sep. 2, 2008 |
| 7420265 |
Integrated circuit package system with integrated circuit support |
Sep. 2, 2008 |
| 7416921 |
Method for flip-chip mounting utilizing a delay curing-type adhesive with two-part hardening resin |
Aug. 26, 2008 |
| 7416923 |
Underfill film having thermally conductive sheet |
Aug. 26, 2008 |
| 7417327 |
IC chip package with cover |
Aug. 26, 2008 |
| 7414301 |
Printed circuit board with soldering lands |
Aug. 19, 2008 |
| 7408264 |
SMT passive device noflow underfill methodology and structure |
Aug. 5, 2008 |
| 7408263 |
Anisotropic conductive coatings and electronic devices |
Aug. 5, 2008 |
| 7405470 |
Adaptable electronic storage apparatus |
Jul. 29, 2008 |
| 7400032 |
Module assembly for stacked BGA packages |
Jul. 15, 2008 |
| 7397140 |
Chip module |
Jul. 8, 2008 |
| 7394163 |
Method of mounting semiconductor chip |
Jul. 1, 2008 |
| 7394153 |
Encapsulation of electronic devices |
Jul. 1, 2008 |
| 7391120 |
Increasing the adhesion of an adhesive connection in housings |
Jun. 24, 2008 |
| 7387841 |
Silicone-based cyanate-ester cross-linkable die attach adhesive |
Jun. 17, 2008 |
| 7381590 |
Method and device including reworkable alpha particle barrier and corrosion barrier |
Jun. 3, 2008 |
| 7378748 |
Solid-state imaging device and method for manufacturing the same |
May. 27, 2008 |
| 7375435 |
Chip package structure |
May. 20, 2008 |
| 7371608 |
Method of fabricating a stacked die having a recess in a die BGA package |
May. 13, 2008 |
| 7365421 |
IC chip package with isolated vias |
Apr. 29, 2008 |
| 7365441 |
Semiconductor device fabricating apparatus and semiconductor device fabricating method |
Apr. 29, 2008 |
| 7361987 |
Circuit device with at least partial packaging and method for forming |
Apr. 22, 2008 |
| 7358619 |
Tape carrier for TAB |
Apr. 15, 2008 |
| 7358617 |
Bond pad for ball grid array package |
Apr. 15, 2008 |
| 7358616 |
Semiconductor stacked die/wafer configuration and packaging and method thereof |
Apr. 15, 2008 |
| 7355278 |
Mold die for a semiconductor device |
Apr. 8, 2008 |
| 7335533 |
Methods for assembling semiconductor devices in superimposed relation with adhesive material defining the distance adjacent semiconductor devices are spaced apart from one another |
Feb. 26, 2008 |
| 7331106 |
Underfill method |
Feb. 19, 2008 |
| 7332372 |
Methods for forming assemblies and packages that include stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween |
Feb. 19, 2008 |
| RE40061 |
Multi-chip stacked devices |
Feb. 12, 2008 |
| 7327041 |
Semiconductor package and a method for producing the same |
Feb. 5, 2008 |
| 7320902 |
Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument |
Jan. 22, 2008 |
| 7319266 |
Encapsulated electronic device structure |
Jan. 15, 2008 |
|
|
|
