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Browse by Category: Main > Physics
Class Information
Number: 257/783
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Die bond > With adhesive means
Description: Subject matter wherein adhesive means (e.g., a layer) is provided to secure a die (chip) which contains an active solid-state electronic device to a supporting member.


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Patent Number Title Of Patent Date Issued
7615871 Method and apparatus for attaching microelectronic substrates and support members Nov. 10, 2009
7615872 Semiconductor device Nov. 10, 2009
7611926 Thermosetting die bonding film Nov. 3, 2009
7605474 Structure of polymer-matrix conductive film and method for fabricating the same Oct. 20, 2009
7598622 Encapsulation of a chip module Oct. 6, 2009
7592708 Package board, semiconductor package, and fabricating method thereof Sep. 22, 2009
7586180 Semiconductor packaging device comprising a semiconductor chip including a MOSFET Sep. 8, 2009
7582974 Semiconductor device and method of manufacturing same Sep. 1, 2009
7579260 Method of dividing an adhesive film bonded to a wafer Aug. 25, 2009
7579676 Leadless leadframe implemented in a leadframe-based BGA package Aug. 25, 2009
7573141 Semiconductor package with a chip on a support plate Aug. 11, 2009
7566575 Mounting circuit and method for producing semiconductor-chip-mounting circuit Jul. 28, 2009
7564140 Semiconductor package and substrate structure thereof Jul. 21, 2009
7564139 Semiconductor device and method for manufacturing the same Jul. 21, 2009
7563706 Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device Jul. 21, 2009
7560819 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument Jul. 14, 2009
7554197 High frequency IC package and method for fabricating the same Jun. 30, 2009
7553701 Semiconductor packaging method Jun. 30, 2009
7550318 Interconnect for improved die to substrate electrical coupling Jun. 23, 2009
7541667 Semiconductor device and method of manufacturing the same Jun. 2, 2009
7535111 Semiconductor component with semiconductor chip and adhesive film, and method for its production May. 19, 2009
7535094 Substrate structure, a method and an arrangement for producing such substrate structure May. 19, 2009
7521797 Method of manufacturing substrate joint body, substrate joint body and electrooptical device Apr. 21, 2009
7518237 Microfeature systems including adhered microfeature workpieces and support members Apr. 14, 2009
7514772 Method of manufacturing a semiconductor apparatus Apr. 7, 2009
7511382 Semiconductor chip arrangement and method Mar. 31, 2009
7507604 Breakable interconnects and structures formed thereby Mar. 24, 2009
7504670 Sealing structure for mounting a semiconductor device to a substrate Mar. 17, 2009
7498679 Package substrate and semiconductor package using the same Mar. 3, 2009
7495345 Semiconductor device-composing substrate and semiconductor device Feb. 24, 2009
7495326 Stacked electronic structures including offset substrates Feb. 24, 2009
7488532 Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same Feb. 10, 2009
7485494 Dicing die adhesive film for semiconductor Feb. 3, 2009
7485496 Semiconductor device package with a heat sink and method for fabricating the same Feb. 3, 2009
7479702 Composite conductive film and semiconductor package using such film Jan. 20, 2009
7479705 Semiconductor device Jan. 20, 2009
7476982 Fabricated adhesive microstructures for making an electrical connection Jan. 13, 2009
7476981 Electronic module with layer of adhesive and process for producing it Jan. 13, 2009
7476975 Semiconductor device and resin structure therefor Jan. 13, 2009
7476959 Encapsulated electronic device Jan. 13, 2009
7476955 Die package having an adhesive flow restriction area Jan. 13, 2009
7470986 Mounting structure, electro-optical device, and electronic apparatus Dec. 30, 2008
7462931 Indented structure for encapsulated devices and method of manufacture Dec. 9, 2008
7462942 Die pillar structures and a method of their formation Dec. 9, 2008
7462943 Semiconductor assembly for improved device warpage and solder ball coplanarity Dec. 9, 2008
7456504 Electronic component assemblies with electrically conductive bonds Nov. 25, 2008
7449367 Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device Nov. 11, 2008
7446424 Interconnect structure for semiconductor package Nov. 4, 2008
7446423 Semiconductor device and method for assembling the same Nov. 4, 2008
7443027 Electronic device having coalesced metal nanoparticles Oct. 28, 2008

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