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Class Information
Number: 257/782
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Die bond
Description: Subject matter wherein a semiconductor chip containing at least one active solid-state device and provided with a contact or lead is provided with a means for attaching the chip to a supporting member.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| RE36907 |
Leadframe with power and ground planes |
Oct. 10, 2000 |
| 6127728 |
Single reference plane plastic ball grid array package |
Oct. 3, 2000 |
| 6125042 |
Ball grid array semiconductor package having improved EMI characteristics |
Sep. 26, 2000 |
| 6121680 |
Mesh structure to avoid thermal grease pump-out in integrated circuit heat sink attachments |
Sep. 19, 2000 |
| 6118183 |
Semiconductor device, manufacturing method thereof, and insulating substrate for same |
Sep. 12, 2000 |
| 6114753 |
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same |
Sep. 5, 2000 |
| 6111761 |
Electronic assembly |
Aug. 29, 2000 |
| 6097099 |
Electro-thermal nested die-attach design |
Aug. 1, 2000 |
| 6097611 |
Multi-chip land grid array carrier |
Aug. 1, 2000 |
| 6093971 |
Chip module with conductor paths on the chip bonding side of a chip carrier |
Jul. 25, 2000 |
| 6091136 |
Plastic lead frames for semiconductor devices |
Jul. 18, 2000 |
| 6088230 |
Procedure for producing a chip mounting board and chip-mounting board thus produced |
Jul. 11, 2000 |
| 6084311 |
Method and apparatus for reducing resin bleed during the formation of a semiconductor device |
Jul. 4, 2000 |
| 6084779 |
Ground and power patches on printed circuit board signal planes in the areas of integrated circuit chips |
Jul. 4, 2000 |
| 6077380 |
Method of forming an adhesive connection |
Jun. 20, 2000 |
| 6064116 |
Device for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications |
May. 16, 2000 |
| 6061251 |
Lead-frame based vertical interconnect package |
May. 9, 2000 |
| 6054761 |
Multi-layer circuit substrates and electrical assemblies having conductive composition connectors |
Apr. 25, 2000 |
| 6054755 |
Semiconductor package with improved moisture vapor relief function and method of fabricating the same |
Apr. 25, 2000 |
| 6052287 |
Silicon ball grid array chip carrier |
Apr. 18, 2000 |
| 6049121 |
Tape carrier package and liquid crystal display device including such tape carrier package |
Apr. 11, 2000 |
| 6049124 |
Semiconductor package |
Apr. 11, 2000 |
| 6046909 |
Computer card with a printed circuit board with vias providing strength to the printed circuit board |
Apr. 4, 2000 |
| 6040630 |
Integrated circuit package for flip chip with alignment preform feature and method of forming same |
Mar. 21, 2000 |
| 6037652 |
Lead frame with each lead having a peel generation preventing means and a semiconductor device using same |
Mar. 14, 2000 |
| 6034437 |
Semiconductor device having a matrix of bonding pads |
Mar. 7, 2000 |
| 6028773 |
Packaging for silicon sensors |
Feb. 22, 2000 |
| 6025641 |
Tape automated bonding (tab) tapes having underlying camber suppressing films to inhibit warping |
Feb. 15, 2000 |
| 6025995 |
Integrated circuit module and method |
Feb. 15, 2000 |
| 6025651 |
Semiconductor package structures using epoxy molding compound pads and a method for fabricating the epoxy molding compound pads |
Feb. 15, 2000 |
| 6020646 |
Intergrated circuit die assembly |
Feb. 1, 2000 |
| 6013947 |
Substrate having gate recesses or slots and molding device and molding method thereof |
Jan. 11, 2000 |
| 6011315 |
Semiconductor device and film carrier tape and respective manufacturing methods thereof |
Jan. 4, 2000 |
| 6008532 |
Integrated circuit package having bond fingers with alternate bonding areas |
Dec. 28, 1999 |
| 6002180 |
Multi chip module with conductive adhesive layer |
Dec. 14, 1999 |
| 5991161 |
Multi-chip land grid array carrier |
Nov. 23, 1999 |
| 5978229 |
Circuit board |
Nov. 2, 1999 |
| 5973927 |
Mounting structure for an integrated circuit |
Oct. 26, 1999 |
| 5973931 |
Printed wiring board and electronic device using same |
Oct. 26, 1999 |
| 5965946 |
Package having Au layer semiconductor device having Au layer |
Oct. 12, 1999 |
| 5959846 |
Modular surface mount circuit device and a manufacturing method thereof |
Sep. 28, 1999 |
| 5956232 |
Chip support arrangement and chip support for the manufacture of a chip casing |
Sep. 21, 1999 |
| 5956237 |
Primary printed wiring board |
Sep. 21, 1999 |
| 5945731 |
Resin encapsulated semiconductor device and method for manufacturing the same |
Aug. 31, 1999 |
| 5936844 |
Memory system printed circuit board |
Aug. 10, 1999 |
| 5917235 |
Semiconductor device having LOC structure, a semiconductor device lead frame, TAB leads, and an insulating TAB tape |
Jun. 29, 1999 |
| 5910681 |
Resin sealed semiconductor device |
Jun. 8, 1999 |
| 5892288 |
Semiconductor integrated circuit device |
Apr. 6, 1999 |
| 5880529 |
Silicon metal-pillar conductors under stagger bond pads |
Mar. 9, 1999 |
| 5874784 |
Semiconductor device having external connection terminals provided on an interconnection plate and fabrication process therefor |
Feb. 23, 1999 |
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