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Class Information
Number: 257/782
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Die bond
Description: Subject matter wherein a semiconductor chip containing at least one active solid-state device and provided with a contact or lead is provided with a means for attaching the chip to a supporting member.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619312 |
Method and apparatus for precisely aligning integrated circuit chips |
Nov. 17, 2009 |
| 7615871 |
Method and apparatus for attaching microelectronic substrates and support members |
Nov. 10, 2009 |
| 7612457 |
Semiconductor device including a stress buffer |
Nov. 3, 2009 |
| 7608925 |
Relay board with bonding pads connected by wirings |
Oct. 27, 2009 |
| 7598620 |
Copper bonding compatible bond pad structure and method |
Oct. 6, 2009 |
| 7596477 |
Peel strength simulating apparatus, peel strength simulating program storage medium, and peel strength simulating method |
Sep. 29, 2009 |
| 7586194 |
Semiconductor device having exposed heat dissipating metal plate |
Sep. 8, 2009 |
| 7579676 |
Leadless leadframe implemented in a leadframe-based BGA package |
Aug. 25, 2009 |
| 7579693 |
Mounting structure of ball grid array |
Aug. 25, 2009 |
| 7569921 |
Semiconductor device and manufacturing method thereof |
Aug. 4, 2009 |
| 7566575 |
Mounting circuit and method for producing semiconductor-chip-mounting circuit |
Jul. 28, 2009 |
| 7566977 |
Semiconductor device and method for manufacturing the same |
Jul. 28, 2009 |
| 7564139 |
Semiconductor device and method for manufacturing the same |
Jul. 21, 2009 |
| 7563651 |
Method of fabricating a substrate with a concave surface |
Jul. 21, 2009 |
| 7553699 |
Method of fabricating microelectronic devices |
Jun. 30, 2009 |
| 7553701 |
Semiconductor packaging method |
Jun. 30, 2009 |
| 7554185 |
Flip chip and wire bond semiconductor package |
Jun. 30, 2009 |
| 7545031 |
Multipackage module having stacked packages with asymmetrically arranged die and molding |
Jun. 9, 2009 |
| 7545029 |
Stack microelectronic assemblies |
Jun. 9, 2009 |
| 7541222 |
Wire sweep resistant semiconductor package and manufacturing method therefor |
Jun. 2, 2009 |
| 7541667 |
Semiconductor device and method of manufacturing the same |
Jun. 2, 2009 |
| 7511382 |
Semiconductor chip arrangement and method |
Mar. 31, 2009 |
| 7508081 |
Dicing die-bonding film |
Mar. 24, 2009 |
| 7498679 |
Package substrate and semiconductor package using the same |
Mar. 3, 2009 |
| 7485976 |
Tamper resistant packaging and approach |
Feb. 3, 2009 |
| 7482638 |
Package for a semiconductor light emitting device |
Jan. 27, 2009 |
| 7476980 |
Die configurations and methods of manufacture |
Jan. 13, 2009 |
| 7476979 |
Chip scale surface mounted device and process of manufacture |
Jan. 13, 2009 |
| 7476959 |
Encapsulated electronic device |
Jan. 13, 2009 |
| 7476570 |
System and method of attaching an integrated circuit assembly to a printed wiring board |
Jan. 13, 2009 |
| 7466030 |
Semiconductor device and fabrication process thereof |
Dec. 16, 2008 |
| 7462942 |
Die pillar structures and a method of their formation |
Dec. 9, 2008 |
| 7456494 |
Surface mount electronic component and process for manufacturing same |
Nov. 25, 2008 |
| 7456502 |
Wiring board with connection electrode formed in opening and semiconductor device using the same |
Nov. 25, 2008 |
| 7453150 |
Three-dimensional face-to-face integration assembly |
Nov. 18, 2008 |
| 7443043 |
Circuit device and method of manufacture thereof |
Oct. 28, 2008 |
| 7443041 |
Packaging of a microchip device |
Oct. 28, 2008 |
| 7443013 |
Flexible substrate for package of die |
Oct. 28, 2008 |
| 7439475 |
Thermally conductive body and method of manufacturing the same |
Oct. 21, 2008 |
| 7427811 |
Semiconductor substrate |
Sep. 23, 2008 |
| 7423349 |
Semiconductor device |
Sep. 9, 2008 |
| 7420280 |
Reduced stress under bump metallization structure |
Sep. 2, 2008 |
| 7417295 |
Insulated gate semiconductor device and manufacturing method thereof |
Aug. 26, 2008 |
| 7417299 |
Direct connection multi-chip semiconductor element structure |
Aug. 26, 2008 |
| 7417323 |
Neo-wafer device and method |
Aug. 26, 2008 |
| 7417324 |
Semiconductor device and method for manufacturing the same |
Aug. 26, 2008 |
| 7414301 |
Printed circuit board with soldering lands |
Aug. 19, 2008 |
| 7402503 |
Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus |
Jul. 22, 2008 |
| 7400032 |
Module assembly for stacked BGA packages |
Jul. 15, 2008 |
| 7394163 |
Method of mounting semiconductor chip |
Jul. 1, 2008 |
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