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Class Information
Number: 257/782
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Die bond
Description: Subject matter wherein a semiconductor chip containing at least one active solid-state device and provided with a contact or lead is provided with a means for attaching the chip to a supporting member.










Sub-classes under this class:

Class Number Class Name Patents
257/783 With adhesive means 1,265


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

Patent Number Title Of Patent Date Issued
8710681 Isolation rings for blocking the interface between package components and the respective molding compound Apr. 29, 2014
8704384 Stacked die assembly Apr. 22, 2014
8686550 Method and apparatus for high pressure sensor device Apr. 1, 2014
8686556 Wafer level applied thermal heat sink Apr. 1, 2014
8674520 Semiconductor device, method for manufacturing the same, and power supply unit Mar. 18, 2014
8674521 Semiconductor device package including a paste member Mar. 18, 2014
8669652 Lead component and method for manufacturing the same, and semiconductor package Mar. 11, 2014
8664083 Vertical outgassing channels Mar. 4, 2014
8653660 Semiconductor device and package Feb. 18, 2014
8653673 Method for packaging semiconductors at a wafer level Feb. 18, 2014
8648476 Dicing tape-integrated wafer back surface protective film Feb. 11, 2014
8643189 Packaged semiconductor die with power rail pads Feb. 4, 2014
8642397 Semiconductor wafer level package (WLP) and method of manufacture thereof Feb. 4, 2014
8638000 Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chip Jan. 28, 2014
8633590 Semiconductor device and method for manufacturing the same Jan. 21, 2014
8633592 Hybrid interconnect technology Jan. 21, 2014
8633598 Underfill contacting stacking balls package fabrication method and structure Jan. 21, 2014
8633600 Device and method for manufacturing a device Jan. 21, 2014
8624362 IC wafer having electromagnetic shielding effects and method for making the same Jan. 7, 2014
8604601 Semiconductor device having wiring layers with power-supply plane and ground plane Dec. 10, 2013
8604627 Semiconductor device Dec. 10, 2013
8604618 Structure and method for reducing vertical crack propagation Dec. 10, 2013
8598029 Method for fabricating flip-attached and underfilled semiconductor devices Dec. 3, 2013
8598691 Semiconductor devices and methods of manufacturing and packaging thereof Dec. 3, 2013
8592926 Substrate bonding with metal germanium silicon material Nov. 26, 2013
8592984 Semiconductor integrated circuit device and method of manufacturing the same Nov. 26, 2013
8592996 Semiconductor device and method of manufacturing the same Nov. 26, 2013
8581250 Method and apparatus of fabricating a pad structure for a semiconductor device Nov. 12, 2013
8580683 Apparatus and methods for molding die on wafer interposers Nov. 12, 2013
8569109 Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module Oct. 29, 2013
8569895 Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die Oct. 29, 2013
8558360 Flip chip package and method of manufacturing the same Oct. 15, 2013
8558397 Dicing tape-integrated wafer back surface protective film Oct. 15, 2013
8558400 Semiconductor packages and methods of fabricating the same Oct. 15, 2013
8552543 Semiconductor package Oct. 8, 2013
8546937 Semiconductor device Oct. 1, 2013
8546957 Integrated circuit packaging system with dielectric support and method of manufacture thereof Oct. 1, 2013
8547701 Electronics module and method for manufacturing the same Oct. 1, 2013
8547705 Semiconductor device having power supply-side and ground-side metal reinforcing members insulated from each other Oct. 1, 2013
8541881 Package structure and manufacturing method thereof Sep. 24, 2013
8525334 Semiconductor on semiconductor substrate multi-chip-scale package Sep. 3, 2013
8525341 Printed circuit board having different sub-core layers and semicondutor package comprising the same Sep. 3, 2013
8519538 Laser etch via formation Aug. 27, 2013
8513811 Electronic device and method for connecting a die to a connection terminal Aug. 20, 2013
8508055 Semiconductor device and manufacturing method thereof Aug. 13, 2013
8502376 Wirebondless wafer level package with plated bumps and interconnects Aug. 6, 2013
8487433 Semiconductor device Jul. 16, 2013
8482137 Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its Jul. 9, 2013
8482135 Method for producing a component and device having a component Jul. 9, 2013
8481861 Method of attaching die to circuit board with an intermediate interposer Jul. 9, 2013

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