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Class Information
Number: 257/782
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Die bond
Description: Subject matter wherein a semiconductor chip containing at least one active solid-state device and provided with a contact or lead is provided with a means for attaching the chip to a supporting member.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7456494 |
Surface mount electronic component and process for manufacturing same |
Nov. 25, 2008 |
| 7456502 |
Wiring board with connection electrode formed in opening and semiconductor device using the same |
Nov. 25, 2008 |
| 7453150 |
Three-dimensional face-to-face integration assembly |
Nov. 18, 2008 |
| 7443013 |
Flexible substrate for package of die |
Oct. 28, 2008 |
| 7443043 |
Circuit device and method of manufacture thereof |
Oct. 28, 2008 |
| 7443041 |
Packaging of a microchip device |
Oct. 28, 2008 |
| 7439475 |
Thermally conductive body and method of manufacturing the same |
Oct. 21, 2008 |
| 7427811 |
Semiconductor substrate |
Sep. 23, 2008 |
| 7423349 |
Semiconductor device |
Sep. 9, 2008 |
| 7420280 |
Reduced stress under bump metallization structure |
Sep. 2, 2008 |
| 7417295 |
Insulated gate semiconductor device and manufacturing method thereof |
Aug. 26, 2008 |
| 7417299 |
Direct connection multi-chip semiconductor element structure |
Aug. 26, 2008 |
| 7417323 |
Neo-wafer device and method |
Aug. 26, 2008 |
| 7417324 |
Semiconductor device and method for manufacturing the same |
Aug. 26, 2008 |
| 7414301 |
Printed circuit board with soldering lands |
Aug. 19, 2008 |
| 7402503 |
Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus |
Jul. 22, 2008 |
| 7400032 |
Module assembly for stacked BGA packages |
Jul. 15, 2008 |
| 7394163 |
Method of mounting semiconductor chip |
Jul. 1, 2008 |
| 7394164 |
Semiconductor device having bumps in a same row for staggered probing |
Jul. 1, 2008 |
| 7391120 |
Increasing the adhesion of an adhesive connection in housings |
Jun. 24, 2008 |
| 7358616 |
Semiconductor stacked die/wafer configuration and packaging and method thereof |
Apr. 15, 2008 |
| 7358619 |
Tape carrier for TAB |
Apr. 15, 2008 |
| 7345369 |
Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same |
Mar. 18, 2008 |
| 7345368 |
Semiconductor device and the manufacturing method for the same |
Mar. 18, 2008 |
| 7335533 |
Methods for assembling semiconductor devices in superimposed relation with adhesive material defining the distance adjacent semiconductor devices are spaced apart from one another |
Feb. 26, 2008 |
| 7335996 |
Method of room temperature covalent bonding |
Feb. 26, 2008 |
| 7332372 |
Methods for forming assemblies and packages that include stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween |
Feb. 19, 2008 |
| 7332819 |
Stacked die in die BGA package |
Feb. 19, 2008 |
| RE40061 |
Multi-chip stacked devices |
Feb. 12, 2008 |
| 7327030 |
Apparatus and method incorporating discrete passive components in an electronic package |
Feb. 5, 2008 |
| 7327038 |
Semiconductor device package |
Feb. 5, 2008 |
| 7323765 |
Die attach paddle for mounting integrated circuit die |
Jan. 29, 2008 |
| 7320902 |
Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument |
Jan. 22, 2008 |
| 7319266 |
Encapsulated electronic device structure |
Jan. 15, 2008 |
| 7312519 |
Stacked integrated circuit package-in-package system |
Dec. 25, 2007 |
| 7312521 |
Semiconductor device with holding member |
Dec. 25, 2007 |
| 7304394 |
Semiconductor device and method for manufacturing same |
Dec. 4, 2007 |
| 7298031 |
Multiple substrate microelectronic devices and methods of manufacture |
Nov. 20, 2007 |
| 7294853 |
Substrate for mounting a semiconductor |
Nov. 13, 2007 |
| 7288436 |
Semiconductor chip package manufacturing method including screen printing process |
Oct. 30, 2007 |
| 7285866 |
Surface mounted package with die bottom spaced from support board |
Oct. 23, 2007 |
| 7279797 |
Module assembly and method for stacked BGA packages |
Oct. 9, 2007 |
| 7276396 |
Die handling system |
Oct. 2, 2007 |
| 7271033 |
Method for fabricating chip package |
Sep. 18, 2007 |
| 7268015 |
Method for wafer stacking using copper structures of substantially uniform height |
Sep. 11, 2007 |
| 7259466 |
Low temperature bonding of multilayer substrates |
Aug. 21, 2007 |
| 7253511 |
Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package |
Aug. 7, 2007 |
| 7253516 |
Electronic device and carrier substrate for same |
Aug. 7, 2007 |
| 7253519 |
Chip packaging structure having redistribution layer with recess |
Aug. 7, 2007 |
| 7253520 |
CSP semiconductor device having signal and radiation bump groups |
Aug. 7, 2007 |
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