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Class Information
Number: 257/781
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Ball or nail head type contact, lead, or bond > Layered contact, lead or bond
Description: Subject matter wherein a ball or nail head type contact is made up of a plurality of layers of the same or different material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7612456 |
Electronic device, semiconductor device using same, and method for manufacturing semiconductor device |
Nov. 3, 2009 |
| 7608929 |
Electrical connector structure of circuit board and method for fabricating the same |
Oct. 27, 2009 |
| 7605479 |
Stacked chip assembly with encapsulant layer |
Oct. 20, 2009 |
| 7602070 |
Room temperature metal direct bonding |
Oct. 13, 2009 |
| 7598620 |
Copper bonding compatible bond pad structure and method |
Oct. 6, 2009 |
| 7598612 |
Semiconductor device and manufacturing method thereof |
Oct. 6, 2009 |
| 7595560 |
Semiconductor device |
Sep. 29, 2009 |
| 7592244 |
Semiconductor device and method of manufacturing the same |
Sep. 22, 2009 |
| 7592710 |
Bond pad structure for wire bonding |
Sep. 22, 2009 |
| 7586180 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
Sep. 8, 2009 |
| RE40887 |
Semiconductor chip with redistribution metal layer |
Sep. 1, 2009 |
| 7582972 |
Semiconductor device and fabrication method thereof |
Sep. 1, 2009 |
| 7579679 |
Chipcard with contact areas and method for producing contact areas |
Aug. 25, 2009 |
| 7579681 |
Super high density module with integrated wafer level packages |
Aug. 25, 2009 |
| 7576438 |
Printed circuit board and method thereof and a solder ball land and method thereof |
Aug. 18, 2009 |
| 7573139 |
Packed system of semiconductor chips having a semiconductor interposer |
Aug. 11, 2009 |
| 7569937 |
Technique for forming a copper-based contact layer without a terminal metal |
Aug. 4, 2009 |
| 7566977 |
Semiconductor device and method for manufacturing the same |
Jul. 28, 2009 |
| 7564062 |
Electrode for p-type SiC |
Jul. 21, 2009 |
| 7557452 |
Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same |
Jul. 7, 2009 |
| 7557453 |
Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device |
Jul. 7, 2009 |
| 7554207 |
Method of forming a lamination film pattern and improved lamination film pattern |
Jun. 30, 2009 |
| 7554208 |
Wirebond pad for semiconductor chip or wafer |
Jun. 30, 2009 |
| 7550858 |
Random sequence generation using alpha particle emission |
Jun. 23, 2009 |
| 7550846 |
Conductive bump with a plurality of contact elements |
Jun. 23, 2009 |
| 7550763 |
Semiconductor integrated circuit device and manufacture thereof |
Jun. 23, 2009 |
| 7547976 |
Electrode pad arrangement with open side for waste removal |
Jun. 16, 2009 |
| 7545037 |
Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same |
Jun. 9, 2009 |
| 7541681 |
Interconnection structure, electronic component and method of manufacturing the same |
Jun. 2, 2009 |
| 7538429 |
Method of enabling solder deposition on a substrate and electronic package formed thereby |
May. 26, 2009 |
| 7535104 |
Structure and method for bond pads of copper-metallized integrated circuits |
May. 19, 2009 |
| 7534651 |
Seedless wirebond pad plating |
May. 19, 2009 |
| 7528487 |
Semiconductor device having insulating material dispersed with conductive particles which establish electrical connection by penetrating to both copper conductive layer and land of wiring boar |
May. 5, 2009 |
| 7525181 |
Tape wiring substrate and tape package using the same |
Apr. 28, 2009 |
| 7525193 |
Semiconductor device and method of manufacturing the same |
Apr. 28, 2009 |
| 7521811 |
Substrate for packaging semiconductor chip and method for manufacturing the same |
Apr. 21, 2009 |
| 7521801 |
Semiconductor device |
Apr. 21, 2009 |
| 7521276 |
Compliant terminal mountings with vented spaces and methods |
Apr. 21, 2009 |
| 7517732 |
Thin semiconductor device package |
Apr. 14, 2009 |
| 7518251 |
Stacked electronics for sensors |
Apr. 14, 2009 |
| 7514799 |
Connecting structure used in a chip module |
Apr. 7, 2009 |
| 7514787 |
Semiconductor device |
Apr. 7, 2009 |
| 7508072 |
Semiconductor device with pad electrode for testing and manufacturing method of the same |
Mar. 24, 2009 |
| 7508082 |
Semiconductor device and method of manufacturing the same |
Mar. 24, 2009 |
| 7498680 |
Test structure |
Mar. 3, 2009 |
| 7489041 |
Copper interconnect |
Feb. 10, 2009 |
| 7489042 |
Stem for optical element and optical semiconductor device using the same |
Feb. 10, 2009 |
| 7485971 |
Electronic device package |
Feb. 3, 2009 |
| 7485948 |
Front-end processing of nickel plated bond pads |
Feb. 3, 2009 |
| 7476968 |
Semiconductor device including an under electrode and a bump electrode |
Jan. 13, 2009 |
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