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Class Information
Number: 257/781
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Ball or nail head type contact, lead, or bond > Layered contact, lead or bond
Description: Subject matter wherein a ball or nail head type contact is made up of a plurality of layers of the same or different material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459345 |
Packaging method for an electronic element |
Dec. 2, 2008 |
| 7459785 |
Electrical interconnection structure formation |
Dec. 2, 2008 |
| 7459792 |
Via layout with via groups placed in interlocked arrangement |
Dec. 2, 2008 |
| 7449785 |
Solder bump on a semiconductor substrate |
Nov. 11, 2008 |
| 7449786 |
Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors |
Nov. 11, 2008 |
| 7446405 |
Wafer level chip scale package (WLCSP) with high reliability against thermal stress |
Nov. 4, 2008 |
| 7443041 |
Packaging of a microchip device |
Oct. 28, 2008 |
| 7443039 |
System for different bond pads in an integrated circuit package |
Oct. 28, 2008 |
| 7436058 |
Reactive solder material |
Oct. 14, 2008 |
| 7436065 |
Electrode contact structure |
Oct. 14, 2008 |
| 7436073 |
Junction structure for a terminal pad and solder, and semiconductor device having the same |
Oct. 14, 2008 |
| 7429797 |
Electronic device and carrier substrate |
Sep. 30, 2008 |
| 7425767 |
Chip structure with redistribution traces |
Sep. 16, 2008 |
| 7423348 |
Chip structure and chip package structure |
Sep. 9, 2008 |
| 7420285 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
Sep. 2, 2008 |
| 7420284 |
Semiconductor device and manufacturing method thereof |
Sep. 2, 2008 |
| 7420280 |
Reduced stress under bump metallization structure |
Sep. 2, 2008 |
| 7417324 |
Semiconductor device and method for manufacturing the same |
Aug. 26, 2008 |
| 7417326 |
Semiconductor device and manufacturing method of the same |
Aug. 26, 2008 |
| 7414317 |
BGA package with concave shaped bonding pads |
Aug. 19, 2008 |
| 7414301 |
Printed circuit board with soldering lands |
Aug. 19, 2008 |
| 7411297 |
Microfeature devices and methods for manufacturing microfeature devices |
Aug. 12, 2008 |
| 7408260 |
Microelectronic assemblies having compliant layers |
Aug. 5, 2008 |
| 7405484 |
Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
Jul. 29, 2008 |
| 7402904 |
Semiconductor device having wires that vary in wiring pitch |
Jul. 22, 2008 |
| 7397133 |
Submount for diode with single bottom electrode |
Jul. 8, 2008 |
| 7391107 |
Signal routing on redistribution layer |
Jun. 24, 2008 |
| 7391114 |
Electrode pad section for external connection |
Jun. 24, 2008 |
| 7382060 |
Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts |
Jun. 3, 2008 |
| 7378745 |
Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns |
May. 27, 2008 |
| 7378746 |
Composite bump |
May. 27, 2008 |
| 7372153 |
Integrated circuit package bond pad having plurality of conductive members |
May. 13, 2008 |
| 7368817 |
Bump-on-lead flip chip interconnection |
May. 6, 2008 |
| 7368825 |
Power semiconductor device |
May. 6, 2008 |
| 7365440 |
Semiconductor device and fabrication method thereof |
Apr. 29, 2008 |
| 7358619 |
Tape carrier for TAB |
Apr. 15, 2008 |
| 7345368 |
Semiconductor device and the manufacturing method for the same |
Mar. 18, 2008 |
| 7342302 |
Semiconductor device and a method of manufacturing the same |
Mar. 11, 2008 |
| 7327030 |
Apparatus and method incorporating discrete passive components in an electronic package |
Feb. 5, 2008 |
| 7327031 |
Semiconductor device and method of manufacturing the same |
Feb. 5, 2008 |
| 7327038 |
Semiconductor device package |
Feb. 5, 2008 |
| 7323780 |
Electrical interconnection structure formation |
Jan. 29, 2008 |
| 7321172 |
Selective plating of package terminals |
Jan. 22, 2008 |
| 7319277 |
Chip structure with redistribution traces |
Jan. 15, 2008 |
| 7304392 |
Die for forming an optical element, and production method as well as regeneration method of the same |
Dec. 4, 2007 |
| 7301231 |
Reinforced bond pad for a semiconductor device |
Nov. 27, 2007 |
| 7294389 |
Microstructure array and a microlens array |
Nov. 13, 2007 |
| 7294451 |
Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit board |
Nov. 13, 2007 |
| 7291902 |
Chip component and method for producing a chip component |
Nov. 6, 2007 |
| 7291928 |
Electric power semiconductor device |
Nov. 6, 2007 |
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