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Browse by Category: Main > Physics
Class Information
Number: 257/781
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Ball or nail head type contact, lead, or bond > Layered contact, lead or bond
Description: Subject matter wherein a ball or nail head type contact is made up of a plurality of layers of the same or different material.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

Patent Number Title Of Patent Date Issued
8704385 Semiconductor device having pad region for wire-bonding and method of manufacturing the semiconductor device Apr. 22, 2014
8686564 Semiconductor device Apr. 1, 2014
8686573 Semiconductor device Apr. 1, 2014
8680683 Wafer level package with embedded passive components and method of manufacturing Mar. 25, 2014
8669659 Semiconductor device and a method of manufacturing the same Mar. 11, 2014
8664777 Routing layer for mitigating stress in a semiconductor die Mar. 4, 2014
8659174 Semiconductor device Feb. 25, 2014
8659173 Isolated wire structures with reduced stress, methods of manufacturing and design structures Feb. 25, 2014
8658472 Semiconductor device Feb. 25, 2014
8653657 Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device Feb. 18, 2014
8647978 Use of graphene to limit copper surface oxidation, diffusion and electromigration in interconnect structures Feb. 11, 2014
8643196 Structure and method for bump to landing trace ratio Feb. 4, 2014
8643178 Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same Feb. 4, 2014
8643053 Light emitting device Feb. 4, 2014
8642384 Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability Feb. 4, 2014
8633101 Semiconductor device and manufacturing method of semiconductor device Jan. 21, 2014
8633592 Hybrid interconnect technology Jan. 21, 2014
8624404 Integrated circuit package having offset vias Jan. 7, 2014
8618676 Method of assembly of a semiconductor package for the improvement of the electrical testing yield on the packages so obtained Dec. 31, 2013
8614512 Solder ball contact susceptible to lower stress Dec. 24, 2013
8610278 Use of graphene to limit copper surface oxidation, diffusion and electromigration in interconnect structures Dec. 17, 2013
8604627 Semiconductor device Dec. 10, 2013
8598696 Multi-surface IC packaging structures Dec. 3, 2013
8592989 Integrated circuit package system with bump over via Nov. 26, 2013
RE44608 Solder joint flip chip interconnection Nov. 26, 2013
8581423 Double solid metal pad with reduced area Nov. 12, 2013
8581420 Under-bump metallization (UBM) structure and method of forming the same Nov. 12, 2013
8581366 Method and system for forming conductive bumping with copper interconnection Nov. 12, 2013
8581421 Semiconductor package manufacturing method and semiconductor package Nov. 12, 2013
8575751 Conductive bump, method for producing the same, and electronic component mounted structure Nov. 5, 2013
8575754 Micro-bump structure Nov. 5, 2013
8569897 Protection layer for preventing UBM layer from chemical attack and oxidation Oct. 29, 2013
8558369 Integrated circuit packaging system with interconnects and method of manufacture thereof Oct. 15, 2013
8558380 Stack package and method for manufacturing the same Oct. 15, 2013
8558396 Bond pad configurations for semiconductor dies Oct. 15, 2013
8536716 Supply voltage or ground connections for integrated circuit device Sep. 17, 2013
8536047 Methods and systems for material bonding Sep. 17, 2013
8525330 Connecting member for connecting a semiconductor element and a frame, formed of an Al-based layer and first and second Zn-based layers provided on surfaces of the Al-based layer Sep. 3, 2013
8525334 Semiconductor on semiconductor substrate multi-chip-scale package Sep. 3, 2013
8525350 Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps Sep. 3, 2013
8519470 Semiconductor chip, and semiconductor package and system each including the semiconductor chip Aug. 27, 2013
8513814 Buffer pad in solder bump connections and methods of manufacture Aug. 20, 2013
8513818 Semiconductor device and method for fabricating the same Aug. 20, 2013
8482137 Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its Jul. 9, 2013
8476773 Electrical interconnect structure Jul. 2, 2013
8471383 Semiconductor package and fabrication method thereof Jun. 25, 2013
8466566 Semiconductor device, method for manufacturing of semiconductor device, and switching circuit Jun. 18, 2013
8461695 Grain refinement by precipitate formation in Pb-free alloys of tin Jun. 11, 2013
8456022 Weldable contact and method for the production thereof Jun. 4, 2013
8441112 Method of manufacturing layered chip package May. 14, 2013

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