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Class Information
Number: 257/780
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Ball or nail head type contact, lead, or bond
Description: Subject matter wherein a contact, lead, or bond is in the form of a wire having an end for connection to the semiconductor which is in the shape of a ball or nail head.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6281592 |
Package structure for semiconductor chip |
Aug. 28, 2001 |
| 6278180 |
Ball-grid-array-type semiconductor device and its fabrication method and electronic device |
Aug. 21, 2001 |
| 6278182 |
Lead frame type semiconductor package |
Aug. 21, 2001 |
| 6278185 |
Semi-additive process (SAP) architecture for organic leadless grid array packages |
Aug. 21, 2001 |
| 6278191 |
Bond pad sealing using wire bonding |
Aug. 21, 2001 |
| 6278192 |
Semiconductor device with encapsulating material composed of silica |
Aug. 21, 2001 |
| 6271588 |
Semiconductor device and manufacturing method thereof |
Aug. 7, 2001 |
| 6271599 |
Wire interconnect structure for electrically and mechanically connecting an integrated circuit chip to a substrate |
Aug. 7, 2001 |
| 6268642 |
Wafer level package |
Jul. 31, 2001 |
| 6268655 |
Semiconductor device including edge bond pads and methods |
Jul. 31, 2001 |
| 6268656 |
Method and structure for uniform height solder bumps on a semiconductor wafer |
Jul. 31, 2001 |
| 6265783 |
Resin overmolded type semiconductor device |
Jul. 24, 2001 |
| 6266249 |
Semiconductor flip chip ball grid array package |
Jul. 24, 2001 |
| 6259038 |
Semiconductor chip mounting board and method of inspecting the same mounting board |
Jul. 10, 2001 |
| 6259159 |
Reflowed solder ball with low melting point metal cap |
Jul. 10, 2001 |
| 6255727 |
Contact structure formed by microfabrication process |
Jul. 3, 2001 |
| 6252777 |
IC card and its frame |
Jun. 26, 2001 |
| 6249044 |
Opaque metallization to cover flip chip die surface for light sensitive semiconductor devices |
Jun. 19, 2001 |
| 6249046 |
Semiconductor device and method for manufacturing and mounting thereof, and circuit board mounted with the semiconductor device |
Jun. 19, 2001 |
| 6249048 |
Polymer stud grid array |
Jun. 19, 2001 |
| 6246117 |
Semiconductor device comprised of a ball grid array and an insulating film with preformed land openings |
Jun. 12, 2001 |
| 6246121 |
High performance flip-chip semiconductor device |
Jun. 12, 2001 |
| 6242103 |
Method for producing laminated film/metal structures |
Jun. 5, 2001 |
| 6242815 |
Flexible substrate based ball grid array (BGA) package |
Jun. 5, 2001 |
| 6239013 |
Method for transferring particles from an adhesive sheet to a substrate |
May. 29, 2001 |
| 6239485 |
Reduced cross-talk noise high density signal interposer with power and ground wrap |
May. 29, 2001 |
| 6235996 |
Interconnection structure and process module assembly and rework |
May. 22, 2001 |
| 6232563 |
Bump electrode and method for fabricating the same |
May. 15, 2001 |
| 6232660 |
High-frequency semiconductor device provided with peripheral bumps on chip periphery that surround high-frequency semiconductor chip |
May. 15, 2001 |
| 6232666 |
Interconnect for packaging semiconductor dice and fabricating BGA packages |
May. 15, 2001 |
| 6232668 |
Semiconductor device of chip-on-chip structure and semiconductor chip for use therein |
May. 15, 2001 |
| 6229220 |
Bump structure, bump forming method and package connecting body |
May. 8, 2001 |
| 6229222 |
Semiconductor device and method of fabricating the same |
May. 8, 2001 |
| 6229711 |
Flip-chip mount board and flip-chip mount structure with improved mounting reliability |
May. 8, 2001 |
| 6225700 |
Package for a semiconductor element having depressions containing solder terminals |
May. 1, 2001 |
| 6225702 |
Ball grid array to prevent shorting between a power supply and ground terminal |
May. 1, 2001 |
| 6222274 |
Bonding wire loop shape for a semiconductor device |
Apr. 24, 2001 |
| 6222279 |
Solder bump fabrication methods and structures including a titanium barrier layer |
Apr. 24, 2001 |
| 6222280 |
Test interconnect for semiconductor components having bumped and planar contacts |
Apr. 24, 2001 |
| 6222281 |
IC chip, IC assembly, liquid crystal device, and electric apparatus |
Apr. 24, 2001 |
| 6218731 |
Tiny ball grid array package |
Apr. 17, 2001 |
| 6212768 |
Flip chip mounting method and apparatus therefor |
Apr. 10, 2001 |
| 6214642 |
Area array stud bump flip chip device and assembly process |
Apr. 10, 2001 |
| 6211461 |
Chip size package and method of fabricating the same |
Apr. 3, 2001 |
| 6211571 |
Method and apparatus for testing chips |
Apr. 3, 2001 |
| 6211575 |
Method and apparatus for identifying customized integrated circuits |
Apr. 3, 2001 |
| 6208546 |
Memory module |
Mar. 27, 2001 |
| 6204559 |
Ball grid assembly type semiconductor package having improved chip edge support to prevent chip cracking |
Mar. 20, 2001 |
| 6204563 |
Semiconductor device |
Mar. 20, 2001 |
| 6204564 |
Semiconductor device and method for making the same |
Mar. 20, 2001 |
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