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Class Information
Number: 257/780
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Ball or nail head type contact, lead, or bond
Description: Subject matter wherein a contact, lead, or bond is in the form of a wire having an end for connection to the semiconductor which is in the shape of a ball or nail head.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619305 |
Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking |
Nov. 17, 2009 |
| 7619304 |
Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof |
Nov. 17, 2009 |
| 7615842 |
Inductor integrated chip |
Nov. 10, 2009 |
| 7612444 |
Semiconductor package with flow controller |
Nov. 3, 2009 |
| 7608929 |
Electrical connector structure of circuit board and method for fabricating the same |
Oct. 27, 2009 |
| 7608922 |
Semiconductor device including amplifier and frequency converter |
Oct. 27, 2009 |
| 7605479 |
Stacked chip assembly with encapsulant layer |
Oct. 20, 2009 |
| 7605478 |
Semiconductor package and method of manufacturing the same |
Oct. 20, 2009 |
| 7598621 |
Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths |
Oct. 6, 2009 |
| 7598613 |
Flip chip bonding structure |
Oct. 6, 2009 |
| 7598610 |
Plate structure having chip embedded therein and the manufacturing method of the same |
Oct. 6, 2009 |
| 7592710 |
Bond pad structure for wire bonding |
Sep. 22, 2009 |
| 7592244 |
Semiconductor device and method of manufacturing the same |
Sep. 22, 2009 |
| 7589426 |
Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom |
Sep. 15, 2009 |
| 7586200 |
Light emitting diode chip with reflective layer thereon |
Sep. 8, 2009 |
| 7586182 |
Packaged semiconductor die and manufacturing method thereof |
Sep. 8, 2009 |
| 7586180 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
Sep. 8, 2009 |
| 7582972 |
Semiconductor device and fabrication method thereof |
Sep. 1, 2009 |
| 7582971 |
Semiconductor device and manufacturing method of the same |
Sep. 1, 2009 |
| 7582956 |
Flip chip in leaded molded package and method of manufacture thereof |
Sep. 1, 2009 |
| 7579695 |
Integration type semiconductor device and method for manufacturing the same |
Aug. 25, 2009 |
| 7579694 |
Electronic devices including offset conductive bumps |
Aug. 25, 2009 |
| 7579693 |
Mounting structure of ball grid array |
Aug. 25, 2009 |
| 7579681 |
Super high density module with integrated wafer level packages |
Aug. 25, 2009 |
| 7579679 |
Chipcard with contact areas and method for producing contact areas |
Aug. 25, 2009 |
| 7579212 |
Semiconductor device having tin-based solder layer and method for manufacturing the same |
Aug. 25, 2009 |
| 7576440 |
Semiconductor chip having bond pads and multi-chip package |
Aug. 18, 2009 |
| 7576438 |
Printed circuit board and method thereof and a solder ball land and method thereof |
Aug. 18, 2009 |
| 7576436 |
Structure of wafer level package with area bump |
Aug. 18, 2009 |
| 7573140 |
Semiconductor device and method for manufacturing the same |
Aug. 11, 2009 |
| 7573131 |
Die-up integrated circuit package with grounded stiffener |
Aug. 11, 2009 |
| 7572725 |
Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods |
Aug. 11, 2009 |
| 7569939 |
Self alignment features for an electronic assembly |
Aug. 4, 2009 |
| 7569934 |
Copper interconnect |
Aug. 4, 2009 |
| 7566649 |
Compressible films surrounding solder connectors |
Jul. 28, 2009 |
| 7564130 |
Power micro surface-mount device package |
Jul. 21, 2009 |
| 7560802 |
Electrical connections in substrates |
Jul. 14, 2009 |
| 7557452 |
Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same |
Jul. 7, 2009 |
| 7554208 |
Wirebond pad for semiconductor chip or wafer |
Jun. 30, 2009 |
| 7554206 |
Microelectronic packages and methods therefor |
Jun. 30, 2009 |
| 7554198 |
Flexible joint methodology to attach a die on an organic substrate |
Jun. 30, 2009 |
| 7550845 |
Ball grid array package with separated stiffener layer |
Jun. 23, 2009 |
| 7550836 |
Structure of package on package and method for fabricating the same |
Jun. 23, 2009 |
| 7550835 |
Chip stack package utilizing a dummy pattern die between stacked chips for reducing package size |
Jun. 23, 2009 |
| 7545028 |
Solder ball assembly for a semiconductor device and method of fabricating same |
Jun. 9, 2009 |
| 7541682 |
Semiconductor chip having bond pads |
Jun. 2, 2009 |
| 7541681 |
Interconnection structure, electronic component and method of manufacturing the same |
Jun. 2, 2009 |
| 7541674 |
Integrated circuit die for wire bonding and flip-chip mounting |
Jun. 2, 2009 |
| 7538442 |
Semiconductor chip and semiconductor device |
May. 26, 2009 |
| 7538440 |
Method for improved high current component interconnections |
May. 26, 2009 |
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