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Class Information
Number: 257/780
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Ball or nail head type contact, lead, or bond
Description: Subject matter wherein a contact, lead, or bond is in the form of a wire having an end for connection to the semiconductor which is in the shape of a ball or nail head.


Sub-classes under this class:

Class Number Class Name Patents
257/781 Layered contact, lead or bond 656


Patents under this class:

Patent Number Title Of Patent Date Issued
7619305 Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking Nov. 17, 2009
7619304 Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof Nov. 17, 2009
7615842 Inductor integrated chip Nov. 10, 2009
7612444 Semiconductor package with flow controller Nov. 3, 2009
7608929 Electrical connector structure of circuit board and method for fabricating the same Oct. 27, 2009
7608922 Semiconductor device including amplifier and frequency converter Oct. 27, 2009
7605479 Stacked chip assembly with encapsulant layer Oct. 20, 2009
7605478 Semiconductor package and method of manufacturing the same Oct. 20, 2009
7598621 Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths Oct. 6, 2009
7598613 Flip chip bonding structure Oct. 6, 2009
7598610 Plate structure having chip embedded therein and the manufacturing method of the same Oct. 6, 2009
7592710 Bond pad structure for wire bonding Sep. 22, 2009
7592244 Semiconductor device and method of manufacturing the same Sep. 22, 2009
7589426 Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom Sep. 15, 2009
7586200 Light emitting diode chip with reflective layer thereon Sep. 8, 2009
7586182 Packaged semiconductor die and manufacturing method thereof Sep. 8, 2009
7586180 Semiconductor packaging device comprising a semiconductor chip including a MOSFET Sep. 8, 2009
7582972 Semiconductor device and fabrication method thereof Sep. 1, 2009
7582971 Semiconductor device and manufacturing method of the same Sep. 1, 2009
7582956 Flip chip in leaded molded package and method of manufacture thereof Sep. 1, 2009
7579695 Integration type semiconductor device and method for manufacturing the same Aug. 25, 2009
7579694 Electronic devices including offset conductive bumps Aug. 25, 2009
7579693 Mounting structure of ball grid array Aug. 25, 2009
7579681 Super high density module with integrated wafer level packages Aug. 25, 2009
7579679 Chipcard with contact areas and method for producing contact areas Aug. 25, 2009
7579212 Semiconductor device having tin-based solder layer and method for manufacturing the same Aug. 25, 2009
7576440 Semiconductor chip having bond pads and multi-chip package Aug. 18, 2009
7576438 Printed circuit board and method thereof and a solder ball land and method thereof Aug. 18, 2009
7576436 Structure of wafer level package with area bump Aug. 18, 2009
7573140 Semiconductor device and method for manufacturing the same Aug. 11, 2009
7573131 Die-up integrated circuit package with grounded stiffener Aug. 11, 2009
7572725 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods Aug. 11, 2009
7569939 Self alignment features for an electronic assembly Aug. 4, 2009
7569934 Copper interconnect Aug. 4, 2009
7566649 Compressible films surrounding solder connectors Jul. 28, 2009
7564130 Power micro surface-mount device package Jul. 21, 2009
7560802 Electrical connections in substrates Jul. 14, 2009
7557452 Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same Jul. 7, 2009
7554208 Wirebond pad for semiconductor chip or wafer Jun. 30, 2009
7554206 Microelectronic packages and methods therefor Jun. 30, 2009
7554198 Flexible joint methodology to attach a die on an organic substrate Jun. 30, 2009
7550845 Ball grid array package with separated stiffener layer Jun. 23, 2009
7550836 Structure of package on package and method for fabricating the same Jun. 23, 2009
7550835 Chip stack package utilizing a dummy pattern die between stacked chips for reducing package size Jun. 23, 2009
7545028 Solder ball assembly for a semiconductor device and method of fabricating same Jun. 9, 2009
7541682 Semiconductor chip having bond pads Jun. 2, 2009
7541681 Interconnection structure, electronic component and method of manufacturing the same Jun. 2, 2009
7541674 Integrated circuit die for wire bonding and flip-chip mounting Jun. 2, 2009
7538442 Semiconductor chip and semiconductor device May. 26, 2009
7538440 Method for improved high current component interconnections May. 26, 2009



 
 
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