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Class Information
Number: 257/780
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Ball or nail head type contact, lead, or bond
Description: Subject matter wherein a contact, lead, or bond is in the form of a wire having an end for connection to the semiconductor which is in the shape of a ball or nail head.










Sub-classes under this class:

Class Number Class Name Patents
257/781 Layered contact, lead or bond 942


Patents under this class:

Patent Number Title Of Patent Date Issued
8710653 Chip on chip semiconductor device including an underfill layer having a resin containing an amine-based curing agent Apr. 29, 2014
8704372 Integrated circuits and methods for processing integrated circuits with embedded features Apr. 22, 2014
8704356 High temperature interconnect assemblies for high temperature electronics utilizing transition pads Apr. 22, 2014
8704350 Stacked wafer level package and method of manufacturing the same Apr. 22, 2014
8691610 Semiconductor device and method for manufacturing the same Apr. 8, 2014
8686564 Semiconductor device Apr. 1, 2014
8686560 Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress Apr. 1, 2014
8686551 Substrate for a microelectronic package and method of fabricating thereof Apr. 1, 2014
8680691 Semiconductor device having semiconductor member and mounting member Mar. 25, 2014
8680676 Semiconductor package with under bump metallization routing Mar. 25, 2014
8679591 Method for reducing voids in a copper-tin interface and structure formed thereby Mar. 25, 2014
8669665 Flip-chip mounting substrate and flip-chip mounting method Mar. 11, 2014
8669173 Methods of fluxless micro-piercing of solder balls, and resulting devices Mar. 11, 2014
8653673 Method for packaging semiconductors at a wafer level Feb. 18, 2014
8653668 Copper bonding wire for semiconductor device and bonding structure thereof Feb. 18, 2014
8653662 Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuits Feb. 18, 2014
8653640 Semiconductor package apparatus Feb. 18, 2014
8647974 Method of fabricating a semiconductor chip with supportive terminal pad Feb. 11, 2014
8643196 Structure and method for bump to landing trace ratio Feb. 4, 2014
8643179 Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package Feb. 4, 2014
8637391 Flip chip semiconductor assembly with variable volume solder bumps Jan. 28, 2014
8633601 Interconnect assemblies and methods of making and using same Jan. 21, 2014
8633599 Semiconductor chip with underfill anchors Jan. 21, 2014
8633592 Hybrid interconnect technology Jan. 21, 2014
8633101 Semiconductor device and manufacturing method of semiconductor device Jan. 21, 2014
8629557 Structures and methods for detecting solder wetting of pedestal sidewalls Jan. 14, 2014
8624403 Semiconductor device and a method of manufacturing the same Jan. 7, 2014
8618676 Method of assembly of a semiconductor package for the improvement of the electrical testing yield on the packages so obtained Dec. 31, 2013
8618642 Semiconductor device Dec. 31, 2013
8614512 Solder ball contact susceptible to lower stress Dec. 24, 2013
8610277 Bridge type pad structure of a semiconductor device Dec. 17, 2013
8609463 Integrated circuit package system employing multi-package module techniques Dec. 17, 2013
8604627 Semiconductor device Dec. 10, 2013
8604625 Semiconductor device having conductive pads to prevent solder reflow Dec. 10, 2013
8587134 Semiconductor packages Nov. 19, 2013
8587133 Semiconductor device Nov. 19, 2013
8587107 Silicon carbide semiconductor Nov. 19, 2013
8581423 Double solid metal pad with reduced area Nov. 12, 2013
8581420 Under-bump metallization (UBM) structure and method of forming the same Nov. 12, 2013
8575755 Semiconductor device having mode of operation defined by inner bump assembly connection Nov. 5, 2013
8575018 Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area Nov. 5, 2013
RE44562 Solder joint flip chip interconnection having relief structure Oct. 29, 2013
8569896 Active area bonding compatible high current structures Oct. 29, 2013
8558380 Stack package and method for manufacturing the same Oct. 15, 2013
8551816 Direct edge connection for multi-chip integrated circuits Oct. 8, 2013
8546942 Flip-chip semiconductor device having anisotropic electrical interconnection and substrate utilized for the package Oct. 1, 2013
8546940 Manufacturing method of lead frame substrate and semiconductor apparatus Oct. 1, 2013
8546257 Electrode arrays and methods of fabricating the same using printing plates to arrange particles in an array Oct. 1, 2013
8541872 Integrated circuit package system with package stacking and method of manufacture thereof Sep. 24, 2013
8536716 Supply voltage or ground connections for integrated circuit device Sep. 17, 2013











 
 
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