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Class Information
Number: 257/779
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Solder wettable contact, lead, or bond
Description: Subject matter wherein an electrical contact or lead has a surface to which solder will readily adhere.

Patents under this class:

Patent Number Title Of Patent Date Issued
7646095 Semiconductor device Jan. 12, 2010
7642660 Method and apparatus for reducing electrical interconnection fatigue Jan. 5, 2010
7642639 COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same Jan. 5, 2010
7638882 Flip-chip package and method of forming thereof Dec. 29, 2009
7635077 Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby Dec. 22, 2009
7632710 Method for soldering electronic component and soldering structure of electronic component Dec. 15, 2009
7626276 Method and apparatus for providing structural support for interconnect pad while allowing signal conductance Dec. 1, 2009
7626275 Semiconductor device Dec. 1, 2009
7626274 Semiconductor device with an improved solder joint Dec. 1, 2009
7626264 Substrate for device bonding and method for manufacturing same Dec. 1, 2009
7622329 Method for fabricating core substrate using paste bumps Nov. 24, 2009
7619305 Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking Nov. 17, 2009
7615873 Solder flow stops for semiconductor die substrates Nov. 10, 2009
7615866 Contact surrounded by passivation and polymide and method therefor Nov. 10, 2009
7615851 Integrated circuit package system Nov. 10, 2009
7612455 Layered structure for electron device including regions of different wettability, electron device and electron device array that uses such a layered structure Nov. 3, 2009
7612444 Semiconductor package with flow controller Nov. 3, 2009
7608930 Semiconductor device and method of manufacturing semiconductor device Oct. 27, 2009
7608929 Electrical connector structure of circuit board and method for fabricating the same Oct. 27, 2009
7605481 Nickel alloy sputtering target and nickel alloy thin film Oct. 20, 2009
7605479 Stacked chip assembly with encapsulant layer Oct. 20, 2009
7598600 Stackable power semiconductor package system Oct. 6, 2009
7595997 Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component Sep. 29, 2009
7592710 Bond pad structure for wire bonding Sep. 22, 2009
7592244 Semiconductor device and method of manufacturing the same Sep. 22, 2009
7589426 Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom Sep. 15, 2009
7589388 Semiconductor device and method of manufacturing the same Sep. 15, 2009
7582968 Wiring board with a protective film greater in heights than bumps Sep. 1, 2009
7582956 Flip chip in leaded molded package and method of manufacture thereof Sep. 1, 2009
7582552 Electronic apparatus with busbar assembly and electronic component mounted thereon by soldering Sep. 1, 2009
7579695 Integration type semiconductor device and method for manufacturing the same Aug. 25, 2009
7579681 Super high density module with integrated wafer level packages Aug. 25, 2009
7579680 Packaging system for semiconductor devices Aug. 25, 2009
7576437 Printed circuit board of semiconductor package and method for mounting semiconductor package using the same Aug. 18, 2009
7572725 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods Aug. 11, 2009
7569939 Self alignment features for an electronic assembly Aug. 4, 2009
7569471 Method of providing mixed size solder bumps on a substrate using a solder delivery head Aug. 4, 2009
7566649 Compressible films surrounding solder connectors Jul. 28, 2009
7564130 Power micro surface-mount device package Jul. 21, 2009
7560802 Electrical connections in substrates Jul. 14, 2009
7557452 Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same Jul. 7, 2009
7554206 Microelectronic packages and methods therefor Jun. 30, 2009
7554198 Flexible joint methodology to attach a die on an organic substrate Jun. 30, 2009
7550844 Semiconductor device and manufacturing method thereof Jun. 23, 2009
7545050 Design structure for final via designs for chip stress reduction Jun. 9, 2009
7545036 Semiconductor device that suppresses variations in high frequency characteristics of circuit elements Jun. 9, 2009
7538440 Method for improved high current component interconnections May. 26, 2009
7538417 Semiconductor device with signal line having decreased characteristic impedance May. 26, 2009
7538021 Removing dry film resist residues using hydrolyzable membranes May. 26, 2009
7531898 Non-Circular via holes for bumping pads and related structures May. 12, 2009

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