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Class Information
Number: 257/779
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Solder wettable contact, lead, or bond
Description: Subject matter wherein an electrical contact or lead has a surface to which solder will readily adhere.

Patents under this class:

Patent Number Title Of Patent Date Issued
8008786 Dynamic pad size to reduce solder fatigue Aug. 30, 2011
7999395 Pillar structure on bump pad Aug. 16, 2011
7999394 Void reduction in indium thermal interface material Aug. 16, 2011
7999380 Process for manufacturing substrate with bumps and substrate structure Aug. 16, 2011
7999379 Microelectronic assemblies having compliancy Aug. 16, 2011
7994630 Power transistor package with integrated bus bar Aug. 9, 2011
7989934 Carrier for bonding a semiconductor chip onto and a method of contracting a semiconductor chip to a carrier Aug. 2, 2011
7985671 Structures and methods for improving solder bump connections in semiconductor devices Jul. 26, 2011
7982320 Arrangement for solder bump formation on wafers Jul. 19, 2011
7982311 Solder limiting layer for integrated circuit die copper bumps Jul. 19, 2011
7977784 Semiconductor package having redistribution layer Jul. 12, 2011
7973417 Integrated circuit and method of fabricating the same Jul. 5, 2011
7968372 Method of joining chips utilizing copper pillar Jun. 28, 2011
7964964 Method of packaging and interconnection of integrated circuits Jun. 21, 2011
7960845 Flexible contactless wire bonding structure and methodology for semiconductor device Jun. 14, 2011
7960752 RFID tag Jun. 14, 2011
7960739 Optical module and production method therefor Jun. 14, 2011
7956472 Packaging substrate having electrical connection structure and method for fabricating the same Jun. 7, 2011
7952203 Methods of forming C4 round dimple metal stud bumps for fine pitch packaging applications and structures formed thereby May. 31, 2011
7948043 MEMS package that includes MEMS device wafer bonded to cap wafer and exposed array pads May. 24, 2011
7936075 Semiconductor device and semiconductor device manufacturing method May. 3, 2011
7935408 Substrate anchor structure and method May. 3, 2011
7932613 Interconnect structure for a semiconductor device Apr. 26, 2011
7932169 Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers Apr. 26, 2011
7928585 Sprocket opening alignment process and apparatus for multilayer solder decal Apr. 19, 2011
7927997 Flip-chip mounting method and bump formation method Apr. 19, 2011
7923836 BLM structure for application to copper pad Apr. 12, 2011
7919874 Chip package without core and stacked chip package structure Apr. 5, 2011
7919851 Laminate substrate and semiconductor package utilizing the substrate Apr. 5, 2011
7915732 Production of integrated circuit chip packages prohibiting formation of micro solder balls Mar. 29, 2011
7911056 Substrate structure having N-SMD ball pads Mar. 22, 2011
7906733 Electronic circuit device Mar. 15, 2011
7902681 Semiconductor device, production method for the same, and substrate Mar. 8, 2011
7902680 Layered structure, electron device, and an electron device array having a variable wettability layer and semiconductor layer formed thereon Mar. 8, 2011
7902679 Structure and manufacturing method of a chip scale package with low fabrication cost, fine pitch and high reliability solder bump Mar. 8, 2011
7902678 Semiconductor device and manufacturing method thereof Mar. 8, 2011
7897059 High tin solder etching solution Mar. 1, 2011
7893545 Semiconductor device Feb. 22, 2011
7888185 Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device Feb. 15, 2011
7880315 Methods for bonding and micro-electronic devices produced according to such methods Feb. 1, 2011
7880313 Semiconductor flip chip package having substantially non-collapsible spacer Feb. 1, 2011
7879713 Mounting method of semiconductor element using outside connection projection electyrode and manufacturing method of semiconductor device using outside connection projection electrode Feb. 1, 2011
7871917 Semiconductor device and manufacturing method for the same Jan. 18, 2011
7863740 Semiconductor device having conductive bumps, metallic layers, covering layers and fabrication method thereof Jan. 4, 2011
7863705 Semiconductor device having a bonding pad structure including an annular contact Jan. 4, 2011
7859119 Stacked flip chip die assembly Dec. 28, 2010
7859115 Semiconductor package for improving characteristics for transmitting signals and power Dec. 28, 2010
7858448 Method of forming support structures for semiconductor devices Dec. 28, 2010
7855443 Stack structure of semiconductor packages and method for fabricating the stack structure Dec. 21, 2010
7851928 Semiconductor device having substrate with differentially plated copper and selective solder Dec. 14, 2010

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