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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/779
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Solder wettable contact, lead, or bond
Description: Subject matter wherein an electrical contact or lead has a surface to which solder will readily adhere.










Patents under this class:

Patent Number Title Of Patent Date Issued
RE43807 Microcircuit package having ductile layer Nov. 20, 2012
8314500 Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers Nov. 20, 2012
8314347 Wiring board with lead pins and method of producing the same Nov. 20, 2012
8304904 Semiconductor device with solder bump formed on high topography plated Cu pads Nov. 6, 2012
8304900 Integrated circuit packaging system with stacked lead and method of manufacture thereof Nov. 6, 2012
8304290 Overcoming laminate warpage and misalignment in flip-chip packages Nov. 6, 2012
8299631 Semiconductor element and display device provided with the same Oct. 30, 2012
8299611 Ball-limiting-metallurgy layers in solder ball structures Oct. 30, 2012
8294272 Power module Oct. 23, 2012
8294271 Gold-tin-indium solder for processing compatibility with lead-free tin-based solder Oct. 23, 2012
8294265 Semiconductor device for improving electrical and mechanical connectivity of conductive pillers and method therefor Oct. 23, 2012
8283790 Electronic device Oct. 9, 2012
8274161 Flux-free chip to substrate joint serial linear thermal processor arrangement Sep. 25, 2012
8274160 Active area bonding compatible high current structures Sep. 25, 2012
8272120 Apparatus for applying solder to semiconductor chips using decals with aperatures present therein Sep. 25, 2012
8270137 Interposer for an integrated DC-DC converter Sep. 18, 2012
8269355 Flexible contactless wire bonding structure and methodology for semiconductor device Sep. 18, 2012
8269354 Semiconductor package substrate structure and manufacturing method thereof Sep. 18, 2012
8264087 Semiconductor package for discharging heat and method for fabricating the same Sep. 11, 2012
8258637 Bonding structure and method for manufacturing same Sep. 4, 2012
8258616 Semiconductor dice having a shielded area created under bond wires connecting pairs of bonding pads Sep. 4, 2012
8258005 Method of making a semiconductor device having a conductive particle on an electric pad Sep. 4, 2012
8253248 Fabrication method of semiconductor device having conductive bumps Aug. 28, 2012
8252678 Flux-free chip to wafer joint serial thermal processor arrangement Aug. 28, 2012
8242597 Crystal structure of a solder bump of flip chip semiconductor device Aug. 14, 2012
8232652 Semiconductor device Jul. 31, 2012
8232643 Lead free solder interconnections for integrated circuits Jul. 31, 2012
8227916 Package structure and method for reducing dielectric layer delamination Jul. 24, 2012
8227908 Electronic device having contact elements with a specified cross section and manufacturing thereof Jul. 24, 2012
8227297 Method for producing a hermetically sealed, electrical feedthrough using exothermic nanofilm Jul. 24, 2012
8222748 Packaged electronic devices having die attach regions with selective thin dielectric layer Jul. 17, 2012
8222739 System to improve coreless package connections Jul. 17, 2012
8217502 Integrated circuit packaging system with multipart conductive pillars and method of manufacture thereof Jul. 10, 2012
8203200 Diode leadframe for solar module assembly Jun. 19, 2012
8198727 Integrated circuit/substrate interconnect system and method of manufacture Jun. 12, 2012
8193629 Bonding structure for a terminal of a susceptor of a semiconductor device manufacturing apparatus Jun. 5, 2012
8193610 Semiconductor device and method of forming B-stage conductive polymer over contact pads of semiconductor die in Fo-WLCSP Jun. 5, 2012
8188605 Components joining method and components joining structure May. 29, 2012
8187907 Solder structures for fabrication of inverted metamorphic multijunction solar cells May. 29, 2012
8183697 Apparatus and methods of forming an interconnect between a workpiece and substrate May. 22, 2012
8183695 Semiconductor device and method of manufacturing the same May. 22, 2012
8178980 Bond pad structure May. 15, 2012
8178970 Strong interconnection post geometry May. 15, 2012
8174120 Integrated circuit package system with leadframe substrate May. 8, 2012
8174094 Bonded structures formed by plasma enhanced bonding May. 8, 2012
8168477 Packaging configurations for vertical electronic devices using conductive traces disposed on laminated board layers May. 1, 2012
8159827 Circuit board and method of mounting electronic component on printed board Apr. 17, 2012
8154122 Semiconductor package and methods of manufacturing the semiconductor package Apr. 10, 2012
8148813 Integrated circuit package architecture Apr. 3, 2012
8148258 Method for fabricating electrical bonding pads on a wafer Apr. 3, 2012











 
 
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