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Class Information
Number: 257/779
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Solder wettable contact, lead, or bond
Description: Subject matter wherein an electrical contact or lead has a surface to which solder will readily adhere.

Patents under this class:

Patent Number Title Of Patent Date Issued
6157076 Hermetic thin pack semiconductor device Dec. 5, 2000
6153938 Flip-chip connecting method, flip-chip connected structure and electronic device using the same Nov. 28, 2000
6153940 Core metal soldering knob flip-chip technology Nov. 28, 2000
6150712 Lead frame for semiconductor device, and semiconductor device Nov. 21, 2000
6150717 Direct die contact (DDC) semiconductor package Nov. 21, 2000
6147411 Vertical surface mount package utilizing a back-to-back semiconductor device module Nov. 14, 2000
6147413 Mask repattern process Nov. 14, 2000
6144103 Graded PB for C4 bump technology Nov. 7, 2000
6140696 Vertically mountable semiconductor device and methods Oct. 31, 2000
6140703 Semiconductor metallization structure Oct. 31, 2000
6140707 Laminated integrated circuit package Oct. 31, 2000
6137185 Electrode structure of a wiring substrate of semiconductor device having expanded pitch Oct. 24, 2000
6133634 High performance flip chip package Oct. 17, 2000
6133637 Semiconductor device having a plurality of semiconductor chips Oct. 17, 2000
6127727 Semiconductor substrate subassembly with alignment and stress relief features Oct. 3, 2000
6127735 Interconnect for low temperature chip attachment Oct. 3, 2000
6125042 Ball grid array semiconductor package having improved EMI characteristics Sep. 26, 2000
6125043 Circuit board arrangement with accurately positioned components mounted thereon Sep. 26, 2000
6118176 Stacked chip assembly utilizing a lead frame Sep. 12, 2000
6118182 Integrated circuit package with rectangular contact pads Sep. 12, 2000
6114763 Semiconductor package with translator for connection to an external substrate Sep. 5, 2000
6110760 Methods of forming electrically conductive interconnections and electrically interconnected substrates Aug. 29, 2000
6111309 Semiconductor device Aug. 29, 2000
6107682 Compliant wirebond packages having wire loop Aug. 22, 2000
6100596 Connectorized substrate and method of connectorizing a substrate Aug. 8, 2000
6097098 Die interconnections using intermediate connection elements secured to the die face Aug. 1, 2000
6087712 Lead frame containing leads plated with tin alloy for increased wettability and method for plating the leads Jul. 11, 2000
6084308 Chip-on-chip integrated circuit package and method for making the same Jul. 4, 2000
6084309 Semiconductor device and semiconductor device mounting structure Jul. 4, 2000
6084310 Semiconductor device, lead frame, and lead bonding Jul. 4, 2000
6078514 Semiconductor device and semiconductor system for high-speed data transfer Jun. 20, 2000
6071800 Electronic device and manufacturing method thereof Jun. 6, 2000
6046499 Heat transfer configuration for a semiconductor device Apr. 4, 2000
6037667 Socket assembly for use with solder ball Mar. 14, 2000
6028366 Ball grid array semiconductor device Feb. 22, 2000
6025649 Pb-In-Sn tall C-4 for fatigue enhancement Feb. 15, 2000
6018196 Semiconductor flip chip package Jan. 25, 2000
6018197 Wired board with improved bonding pads Jan. 25, 2000
6011306 Semiconductor device and method for fabricating same Jan. 4, 2000
6011313 Flip chip interconnections on electronic modules Jan. 4, 2000
6011314 Redistribution layer and under bump material structure for converting periphery conductive pads to an array of solder bumps Jan. 4, 2000
6008542 Semiconductor device having long pads and short pads alternated for fine pitch without sacrifice of probing Dec. 28, 1999
6008543 Conductive bumps on pads for flip chip application Dec. 28, 1999
5994783 Semiconductor chip package and fabrication method thereof Nov. 30, 1999
5990565 Flip chip package Nov. 23, 1999
5986338 Assembly of semiconductor device Nov. 16, 1999
5982038 Cast metal seal for semiconductor substrates Nov. 9, 1999
5977633 Semiconductor device with metal base substrate having hollows Nov. 2, 1999
5973404 Underfill of bumped or raised die using a barrier adjacent to the sidewall of semiconductor device Oct. 26, 1999
5965944 Printed circuit boards for mounting a semiconductor integrated circuit die Oct. 12, 1999

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