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Class Information
Number: 257/779
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Solder wettable contact, lead, or bond
Description: Subject matter wherein an electrical contact or lead has a surface to which solder will readily adhere.

Patents under this class:

Patent Number Title Of Patent Date Issued
8487434 Integrated circuit package system with redistribution layer and method for manufacturing thereof Jul. 16, 2013
8476773 Electrical interconnect structure Jul. 2, 2013
8471386 Junction body, semiconductor module, and manufacturing method for junction body Jun. 25, 2013
8471385 Method for the connection of two wafers, and a wafer arrangement Jun. 25, 2013
8456023 Semiconductor wafer processing Jun. 4, 2013
8456022 Weldable contact and method for the production thereof Jun. 4, 2013
8450859 Semiconductor device mounted structure and its manufacturing method May. 28, 2013
8450856 Semiconductor device and method of forming the same May. 28, 2013
8441127 Bump-on-trace structures with wide and narrow portions May. 14, 2013
8436470 Solder joint reliability in microelectronic packaging May. 7, 2013
8432034 Use of a local constraint to enhance attachment of an IC device to a mounting platform Apr. 30, 2013
8431477 Method for joining aligned discrete optical elements Apr. 30, 2013
8431474 Three dimensional multilayer circuit Apr. 30, 2013
8421246 Joint structure and electronic component Apr. 16, 2013
8420522 Semiconductor device and manufacturing method of the same Apr. 16, 2013
8420521 Method for fabricating stack structure of semiconductor packages Apr. 16, 2013
8415780 Package carrier and manufacturing method thereof Apr. 9, 2013
8415741 High voltage vertical channel transistors Apr. 9, 2013
8411455 Mounting structure and motor Apr. 2, 2013
8405230 Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof Mar. 26, 2013
8399996 Chip carrier Mar. 19, 2013
8399995 Semiconductor device including single circuit element for soldering Mar. 19, 2013
8399993 Embedded package and method for manufacturing the same Mar. 19, 2013
8399294 Semiconductor package for discharging heat and method for fabricating the same Mar. 19, 2013
8397977 Solder containment brackets Mar. 19, 2013
8395260 Semiconductor device and manufacturing method thereof Mar. 12, 2013
8390115 Wiring board and semiconductor device using the wiring board Mar. 5, 2013
8390107 Semiconductor device and methods of manufacturing semiconductor devices Mar. 5, 2013
8384216 Package structure and manufacturing method thereof Feb. 26, 2013
8384116 Substrate with chips mounted thereon, method of manufacturing substrate with chips mounted thereon, display, and method of manufacturing display Feb. 26, 2013
8378505 Semiconductor substrate structure and semiconductor device Feb. 19, 2013
8378504 Microelectronic package with self-heating interconnect Feb. 19, 2013
8378492 Semiconductor package Feb. 19, 2013
8378471 Semiconductor chip bump connection apparatus and method Feb. 19, 2013
8368223 Paste for forming an interconnect and interconnect formed from the paste Feb. 5, 2013
8361598 Substrate anchor structure and method Jan. 29, 2013
8354754 Layered chip for use in soldering Jan. 15, 2013
8354692 Vertical semiconductor power switch, electronic component and methods of producing the same Jan. 15, 2013
8350376 Bondwireless power module with three-dimensional current routing Jan. 8, 2013
8350369 High power semiconductor package Jan. 8, 2013
8349721 Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding Jan. 8, 2013
8338966 Joint structure, joining material, and method for producing joining material containing bismuth Dec. 25, 2012
8334598 Power semiconductor device and manufacturing method therefor Dec. 18, 2012
8330279 Semiconductor device Dec. 11, 2012
8330258 System and method for improving solder joint reliability in an integrated circuit package Dec. 11, 2012
8324740 Semiconductor device, and method of manufacturing multilayer wiring board and semiconductor device Dec. 4, 2012
8324737 Modified chip attach process Dec. 4, 2012
8319353 Pre-formed conductive bumps on bonding pads Nov. 27, 2012
8319350 Adhesive tape and semiconductor device using the same Nov. 27, 2012
8319344 Electrical device with protruding contact elements and overhang regions over a cavity Nov. 27, 2012

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