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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/779
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Solder wettable contact, lead, or bond
Description: Subject matter wherein an electrical contact or lead has a surface to which solder will readily adhere.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6717276 Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and flip-chip semiconductor assembly Apr. 6, 2004
6717277 Electrical assembly with vertical multiple layer structure Apr. 6, 2004
6710434 Window-type semiconductor package and fabrication method thereof Mar. 23, 2004
6710438 Enhanced chip scale package for wire bond dies Mar. 23, 2004
6710444 Molded substrate stiffener with embedded capacitors Mar. 23, 2004
6710448 Bonding pad structure Mar. 23, 2004
6710460 Semiconductor devices and methods for manufacturing the same Mar. 23, 2004
6710461 Wafer level packaging of micro electromechanical device Mar. 23, 2004
6707137 Semiconductor package and method for fabricating the same Mar. 16, 2004
6707152 Semiconductor device, electrical conductor system, and method of making Mar. 16, 2004
6707161 Optical module package of flip chip bonding Mar. 16, 2004
6700204 Substrate for accommodating passive component Mar. 2, 2004
6700208 Surface mounting substrate having bonding pads in staggered arrangement Mar. 2, 2004
6696763 Solder ball allocation on a chip and method of the same Feb. 24, 2004
6696765 Multi-chip module Feb. 24, 2004
6697261 Multileveled printed circuit board unit including substrate interposed between stacked bumps Feb. 24, 2004
6691406 Methods of die attachment for BOC and F/C surface mount Feb. 17, 2004
6689678 Process for fabricating ball grid array package for enhanced stress tolerance Feb. 10, 2004
6690090 Semiconductor device having reliable coupling with mounting substrate Feb. 10, 2004
6683387 Flip chip carrier package with adapted landing pads Jan. 27, 2004
6680492 Semiconductor light emitting device and method for producing the same Jan. 20, 2004
6674159 Bi-level microelectronic device package with an integral window Jan. 6, 2004
6670215 Semiconductor device and manufacturing method thereof Dec. 30, 2003
6670718 Wiring board utilizing a conductive member having a reduced thickness Dec. 30, 2003
6670719 Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture Dec. 30, 2003
6667192 Device and method for making devices comprising at least a chip fixed on a support Dec. 23, 2003
6667559 Ball grid array module and method of manufacturing same Dec. 23, 2003
6664621 Semiconductor chip package with interconnect structure Dec. 16, 2003
6664637 Flip chip C4 extension structure and process Dec. 16, 2003
6664643 Semiconductor device and method for manufacturing the same Dec. 16, 2003
6661084 Single level microelectronic device package with an integral window Dec. 9, 2003
6661098 High density area array solder microjoining interconnect structure and fabrication method Dec. 9, 2003
6655022 Implementing micro BGA assembly techniques for small die Dec. 2, 2003
6657296 Semicondctor package Dec. 2, 2003
6657313 Dielectric interposer for chip to substrate soldering Dec. 2, 2003
6653740 Vertical conduction flip-chip device with bump contacts on single surface Nov. 25, 2003
6653741 Thermal interface material and heat sink configuration Nov. 25, 2003
6650016 Selective C4 connection in IC packaging Nov. 18, 2003
6650020 Resin-sealed semiconductor device Nov. 18, 2003
6646333 Semiconductor module having interconnected semiconductor chips disposed one above the other Nov. 11, 2003
6647036 Integration and alignment of VCSEL's with MEMS using micromachining and flip-chip techniques Nov. 11, 2003
6642624 Ball grid array type semiconductor device Nov. 4, 2003
6628178 Radio frequency module parts including surface acoustic wave elements and manufacturing method thereof Sep. 30, 2003
6621152 Thin, small-sized power semiconductor package Sep. 16, 2003
6621168 Interconnected circuit board assembly and system Sep. 16, 2003
6617680 Chip carrier, semiconductor package and fabricating method thereof Sep. 9, 2003
6617694 Semiconductor chip, semiconductor device, methods of fabricating thereof, circuit board and electronic device Sep. 9, 2003
6611055 Leadless flip chip carrier design and structure Aug. 26, 2003
6608382 Metal bump Aug. 19, 2003
6603210 Semiconductor module and producing method therefor Aug. 5, 2003

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