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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/779
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Solder wettable contact, lead, or bond
Description: Subject matter wherein an electrical contact or lead has a surface to which solder will readily adhere.










Patents under this class:
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Patent Number Title Of Patent Date Issued
7038322 Multi-chip module May. 2, 2006
7038323 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument May. 2, 2006
7038327 Anisotropic conductive film bonding pad May. 2, 2006
7030492 Under bump metallurgic layer Apr. 18, 2006
7026721 Method of improving copper pad adhesion Apr. 11, 2006
7019406 Thermally enhanced semiconductor package Mar. 28, 2006
7015571 Multi-chips module assembly package Mar. 21, 2006
7015576 Semiconductor device which prevents light from entering therein Mar. 21, 2006
7005719 Integrated circuit structure having a flip-chip mounted photoreceiver Feb. 28, 2006
7005745 Method and structure to reduce risk of gold embrittlement in solder joints Feb. 28, 2006
7005750 Substrate with reinforced contact pad structure Feb. 28, 2006
6998713 Wiring board and method for producing same Feb. 14, 2006
6994918 Selective application of conductive material to circuit boards by pick and place Feb. 7, 2006
6992399 Die connected with integrated circuit component for electrical signal passing therebetween Jan. 31, 2006
6989293 Thermally enhanced packaging structure and fabrication method thereof Jan. 24, 2006
6989586 Integrated circuit packages with reduced stress on die and associated substrates, assemblies, and systems Jan. 24, 2006
6989591 Method for making an integrated circuit of the surface-mount type and resulting circuit Jan. 24, 2006
6989605 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board Jan. 24, 2006
6984792 Dielectric interposer for chip to substrate soldering Jan. 10, 2006
6979906 Solder on a sloped surface Dec. 27, 2005
6978068 Snap-fit optical element for optical coupling between a light source and target element using surface mount technology Dec. 20, 2005
6975036 Flip-chip semiconductor device utilizing an elongated tip bump Dec. 13, 2005
6972464 Power MOSFET Dec. 6, 2005
6972489 Flip chip package with thermometer Dec. 6, 2005
6969674 Structure and method for fine pitch flip chip substrate Nov. 29, 2005
6960827 Semiconductor device and manufacturing method thereof Nov. 1, 2005
6958546 Method for dual-layer polyimide processing on bumping technology Oct. 25, 2005
6956295 Flip-chip image sensor packages Oct. 18, 2005
6953990 Wafer-level packaging of optoelectronic devices Oct. 11, 2005
6952054 Semiconductor package having interconnect with conductive members Oct. 4, 2005
6946740 High power MCM package Sep. 20, 2005
6946741 Semiconductor device and manufacturing method thereof Sep. 20, 2005
6946744 System and method of reducing die attach stress and strain Sep. 20, 2005
6940093 Special contact points for accessing internal circuitry of an integrated circuit Sep. 6, 2005
6940167 Variable cross-section plated mushroom with stud for bumping Sep. 6, 2005
6940168 Enhanced pad design for substrate Sep. 6, 2005
6940177 Semiconductor package and method of preparing same Sep. 6, 2005
6940178 Self-coplanarity bumping shape for flip chip Sep. 6, 2005
6936923 Method to form very a fine pitch solder bump using methods of electroplating Aug. 30, 2005
6927425 Luminescent diode chip that is flip-chip mounted on a carrier, and method for production thereof Aug. 9, 2005
6927487 Protective device with spacer for subassemblies Aug. 9, 2005
6927492 Solder pads and method of making a solder pad Aug. 9, 2005
6924868 Liquid crystal display device, method for fabricating the same, and portable telephone using the same Aug. 2, 2005
6921979 Semiconductor device having a bond pad and method therefor Jul. 26, 2005
6919137 High-strength solder joint Jul. 19, 2005
6919643 Multi-chip module semiconductor devices Jul. 19, 2005
6919644 Semiconductor device manufacturing method and semiconductor device manufactured thereby Jul. 19, 2005
6913948 Partially captured oriented interconnections for BGA packages and a method of forming the interconnections Jul. 5, 2005
6909191 Semiconductor device Jun. 21, 2005
6909194 Electronic assembly having semiconductor component with polymer support member and method of fabrication Jun. 21, 2005

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