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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/779
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Solder wettable contact, lead, or bond
Description: Subject matter wherein an electrical contact or lead has a surface to which solder will readily adhere.










Patents under this class:
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Patent Number Title Of Patent Date Issued
7256496 Semiconductor device having adhesion increasing film to prevent peeling Aug. 14, 2007
7256117 Method for evaluating and modifying solder attach design for integrated circuit packaging assembly Aug. 14, 2007
7245025 Low cost bonding pad and method of fabricating same Jul. 17, 2007
7245024 Electronic assembly with reduced leakage current Jul. 17, 2007
7245023 Semiconductor chip assembly with solder-attached ground plane Jul. 17, 2007
7242097 Electromigration barrier layers for solder joints Jul. 10, 2007
7241678 Integrated die bumping process Jul. 10, 2007
7239027 Bonding structure of device packaging Jul. 3, 2007
7239025 Selective deposition of solder ball contacts Jul. 3, 2007
7239023 Package assembly for electronic device Jul. 3, 2007
7235887 Semiconductor package with improved chip attachment and manufacturing method thereof Jun. 26, 2007
7235871 Stacked microelectronic dies Jun. 26, 2007
7235309 Electronic device having external terminals with lead-free metal thin film formed on the surface thereof Jun. 26, 2007
7224074 Active area bonding compatible high current structures May. 29, 2007
7224073 Substrate for solder joint May. 29, 2007
7224066 Bonding material and circuit device using the same May. 29, 2007
7224054 Semiconductor device and system having semiconductor device mounted thereon May. 29, 2007
7221045 Flat chip semiconductor device and manufacturing method thereof May. 22, 2007
7218003 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods May. 15, 2007
7215030 Lead-free semiconductor package May. 8, 2007
7215011 Flip chip in leaded molded package and method of manufacture thereof May. 8, 2007
7214561 Packaging assembly and method of assembling the same May. 8, 2007
7211901 Self-coplanarity bumping shape for flip chip May. 1, 2007
7208842 Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof Apr. 24, 2007
7208834 Bonding structure with pillar and cap Apr. 24, 2007
7208827 Encasing arrangement for a semiconductor component Apr. 24, 2007
7208402 Method and apparatus for improved power routing Apr. 24, 2007
7205650 Composite devices of laminate type and processes Apr. 17, 2007
7205178 Land grid array packaged device and method of forming same Apr. 17, 2007
7202569 Semiconductor device and manufacturing method of the same Apr. 10, 2007
7202566 Crossed power strapped layout for full CMOS circuit design Apr. 10, 2007
7199476 Electronic device Apr. 3, 2007
7199475 Semiconductor copper bond pad surface protection Apr. 3, 2007
7193328 Semiconductor device Mar. 20, 2007
7193319 Semiconductor device Mar. 20, 2007
7191515 Method for manufacturing an interconnected circuit board assembly Mar. 20, 2007
7190065 Circuit substrate, semiconductor module and method of manufacturing circuit substrate Mar. 13, 2007
7190063 Semiconductor device and method of manufacturing the same, circuit board, and electronic apparatus Mar. 13, 2007
7190060 Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same Mar. 13, 2007
7187083 Thermal interface material and solder preforms Mar. 6, 2007
7183656 Bilayer aluminum last metal for interconnects and wirebond pads Feb. 27, 2007
7183652 Electronic component and electronic configuration Feb. 27, 2007
7183647 Wiring substrate and electronic parts packaging structure Feb. 27, 2007
7183194 Method of forming socket contacts Feb. 27, 2007
7180195 Method and apparatus for improved power routing Feb. 20, 2007
7180006 Tape substrate and method for fabricating the same Feb. 20, 2007
7177142 Hybrid compression socket connector for integrated circuits Feb. 13, 2007
7166906 Package with barrier wall and method for manufacturing the same Jan. 23, 2007
7164158 Electrical contact for optoelectronic semiconductor chip and method for its production Jan. 16, 2007
7161250 Projected contact structures for engaging bumped semiconductor devices and methods of making the same Jan. 9, 2007

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