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Class Information
Number: 257/779
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Solder wettable contact, lead, or bond
Description: Subject matter wherein an electrical contact or lead has a surface to which solder will readily adhere.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619305 |
Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking |
Nov. 17, 2009 |
| 7615851 |
Integrated circuit package system |
Nov. 10, 2009 |
| 7615873 |
Solder flow stops for semiconductor die substrates |
Nov. 10, 2009 |
| 7615866 |
Contact surrounded by passivation and polymide and method therefor |
Nov. 10, 2009 |
| 7612444 |
Semiconductor package with flow controller |
Nov. 3, 2009 |
| 7612455 |
Layered structure for electron device including regions of different wettability, electron device and electron device array that uses such a layered structure |
Nov. 3, 2009 |
| 7608929 |
Electrical connector structure of circuit board and method for fabricating the same |
Oct. 27, 2009 |
| 7608930 |
Semiconductor device and method of manufacturing semiconductor device |
Oct. 27, 2009 |
| 7605479 |
Stacked chip assembly with encapsulant layer |
Oct. 20, 2009 |
| 7605481 |
Nickel alloy sputtering target and nickel alloy thin film |
Oct. 20, 2009 |
| 7598600 |
Stackable power semiconductor package system |
Oct. 6, 2009 |
| 7595997 |
Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component |
Sep. 29, 2009 |
| 7592710 |
Bond pad structure for wire bonding |
Sep. 22, 2009 |
| 7592244 |
Semiconductor device and method of manufacturing the same |
Sep. 22, 2009 |
| 7589388 |
Semiconductor device and method of manufacturing the same |
Sep. 15, 2009 |
| 7589426 |
Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom |
Sep. 15, 2009 |
| 7582968 |
Wiring board with a protective film greater in heights than bumps |
Sep. 1, 2009 |
| 7582956 |
Flip chip in leaded molded package and method of manufacture thereof |
Sep. 1, 2009 |
| 7582552 |
Electronic apparatus with busbar assembly and electronic component mounted thereon by soldering |
Sep. 1, 2009 |
| 7579681 |
Super high density module with integrated wafer level packages |
Aug. 25, 2009 |
| 7579695 |
Integration type semiconductor device and method for manufacturing the same |
Aug. 25, 2009 |
| 7579680 |
Packaging system for semiconductor devices |
Aug. 25, 2009 |
| 7576437 |
Printed circuit board of semiconductor package and method for mounting semiconductor package using the same |
Aug. 18, 2009 |
| 7572725 |
Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods |
Aug. 11, 2009 |
| 7569939 |
Self alignment features for an electronic assembly |
Aug. 4, 2009 |
| 7569471 |
Method of providing mixed size solder bumps on a substrate using a solder delivery head |
Aug. 4, 2009 |
| 7566649 |
Compressible films surrounding solder connectors |
Jul. 28, 2009 |
| 7564130 |
Power micro surface-mount device package |
Jul. 21, 2009 |
| 7560802 |
Electrical connections in substrates |
Jul. 14, 2009 |
| 7557452 |
Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same |
Jul. 7, 2009 |
| 7554206 |
Microelectronic packages and methods therefor |
Jun. 30, 2009 |
| 7554198 |
Flexible joint methodology to attach a die on an organic substrate |
Jun. 30, 2009 |
| 7550844 |
Semiconductor device and manufacturing method thereof |
Jun. 23, 2009 |
| 7545036 |
Semiconductor device that suppresses variations in high frequency characteristics of circuit elements |
Jun. 9, 2009 |
| 7545050 |
Design structure for final via designs for chip stress reduction |
Jun. 9, 2009 |
| 7538021 |
Removing dry film resist residues using hydrolyzable membranes |
May. 26, 2009 |
| 7538417 |
Semiconductor device with signal line having decreased characteristic impedance |
May. 26, 2009 |
| 7538440 |
Method for improved high current component interconnections |
May. 26, 2009 |
| 7531898 |
Non-Circular via holes for bumping pads and related structures |
May. 12, 2009 |
| 7525181 |
Tape wiring substrate and tape package using the same |
Apr. 28, 2009 |
| 7521800 |
Solder pad and method of making the same |
Apr. 21, 2009 |
| 7514351 |
Solder ball mounting method and solder ball mounting substrate manufacturing method |
Apr. 7, 2009 |
| 7514790 |
Semiconductor device and method of manufacturing a semiconductor device |
Apr. 7, 2009 |
| 7508082 |
Semiconductor device and method of manufacturing the same |
Mar. 24, 2009 |
| 7495341 |
Methods and apparatus for packaging integrated circuit devices |
Feb. 24, 2009 |
| 7485563 |
Method of providing solder bumps of mixed sizes on a substrate using a sorting mask and bumped substrate formed according to the method |
Feb. 3, 2009 |
| 7485970 |
Semiconductor package substrate having contact pad protective layer formed thereon |
Feb. 3, 2009 |
| 7485948 |
Front-end processing of nickel plated bond pads |
Feb. 3, 2009 |
| 7482698 |
Semiconducting device with folded interposer |
Jan. 27, 2009 |
| 7482699 |
Semiconductor device |
Jan. 27, 2009 |
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