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Class Information
Number: 257/779
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Solder wettable contact, lead, or bond
Description: Subject matter wherein an electrical contact or lead has a surface to which solder will readily adhere.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459794 |
Substrate for device bonding, device bonded substrate, and method for producing same |
Dec. 2, 2008 |
| 7455915 |
Selective application of conductive material to substrates by pick and place of compliant contact arrays |
Nov. 25, 2008 |
| 7456503 |
Integrated circuit package |
Nov. 25, 2008 |
| 7453155 |
Method for fabricating a flip chip package |
Nov. 18, 2008 |
| 7449364 |
Device and method for including passive components in a chip scale package |
Nov. 11, 2008 |
| 7449785 |
Solder bump on a semiconductor substrate |
Nov. 11, 2008 |
| 7446028 |
Multi-component integrated circuit contacts |
Nov. 4, 2008 |
| 7446422 |
Wafer level chip scale package and manufacturing method for the same |
Nov. 4, 2008 |
| 7443039 |
System for different bond pads in an integrated circuit package |
Oct. 28, 2008 |
| 7443040 |
Aluminum cap with electroless nickel/immersion gold |
Oct. 28, 2008 |
| 7436063 |
Packaging substrate and semiconductor device |
Oct. 14, 2008 |
| 7436073 |
Junction structure for a terminal pad and solder, and semiconductor device having the same |
Oct. 14, 2008 |
| 7427805 |
Light-emitting diode chip package body and packaging method thereof |
Sep. 23, 2008 |
| 7420283 |
Integration type semiconductor device and method for manufacturing the same |
Sep. 2, 2008 |
| 7420284 |
Semiconductor device and manufacturing method thereof |
Sep. 2, 2008 |
| 7420285 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
Sep. 2, 2008 |
| 7417295 |
Insulated gate semiconductor device and manufacturing method thereof |
Aug. 26, 2008 |
| 7414319 |
Semiconductor chip assembly with metal containment wall and solder terminal |
Aug. 19, 2008 |
| 7414301 |
Printed circuit board with soldering lands |
Aug. 19, 2008 |
| 7411294 |
Display device having misalignment detection pattern for detecting misalignment between conductive layer and insulating layer |
Aug. 12, 2008 |
| 7408254 |
Stack land grid array package and method for manufacturing the same |
Aug. 5, 2008 |
| 7405479 |
Wired circuit board |
Jul. 29, 2008 |
| 7397134 |
Semiconductor device mounted on and electrically connected to circuit board |
Jul. 8, 2008 |
| 7397129 |
Interposers with flexible solder pad elements |
Jul. 8, 2008 |
| 7397127 |
Bonding and probing pad structures |
Jul. 8, 2008 |
| 7396751 |
Method for manufacturing semiconductor device |
Jul. 8, 2008 |
| 7394150 |
Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys |
Jul. 1, 2008 |
| 7393771 |
Method for mounting an electronic part on a substrate using a liquid containing metal particles |
Jul. 1, 2008 |
| 7393719 |
Increased stand-off height integrated circuit assemblies, systems, and methods |
Jul. 1, 2008 |
| 7391112 |
Capping copper bumps |
Jun. 24, 2008 |
| 7387910 |
Method of bonding solder pads of flip-chip package |
Jun. 17, 2008 |
| 7388295 |
Multi-chip module |
Jun. 17, 2008 |
| 7388296 |
Wiring substrate and bonding pad composition |
Jun. 17, 2008 |
| 7382057 |
Surface structure of flip chip substrate |
Jun. 3, 2008 |
| 7382005 |
Circuit component with bump formed over chip |
Jun. 3, 2008 |
| 7375429 |
Integrated circuit component and mounting method thereof |
May. 20, 2008 |
| 7375431 |
Solder bump formation in electronics packaging |
May. 20, 2008 |
| 7375434 |
Semiconductor chip with flexible contacts at a face |
May. 20, 2008 |
| 7372153 |
Integrated circuit package bond pad having plurality of conductive members |
May. 13, 2008 |
| 7372167 |
Semiconductor device and method of manufacturing semiconductor device |
May. 13, 2008 |
| 7373033 |
Chip-to-chip optical interconnect |
May. 13, 2008 |
| 7368824 |
Diffusion solder position, and process for producing it |
May. 6, 2008 |
| 7368815 |
Semiconductor device which prevents light from entering therein |
May. 6, 2008 |
| 7364943 |
Method of bonding a microelectronic die to a substrate and arrangement to carry out method |
Apr. 29, 2008 |
| 7365429 |
Semiconductor device and method for manufacturing the same |
Apr. 29, 2008 |
| 7358608 |
Semiconductor device having chip size package with improved strength |
Apr. 15, 2008 |
| 7355280 |
Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument |
Apr. 8, 2008 |
| 7351649 |
Recording head unit and method of producing the same |
Apr. 1, 2008 |
| 7345369 |
Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same |
Mar. 18, 2008 |
| 7335995 |
Microelectronic assembly having array including passive elements and interconnects |
Feb. 26, 2008 |
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