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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/779
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Solder wettable contact, lead, or bond
Description: Subject matter wherein an electrical contact or lead has a surface to which solder will readily adhere.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710678 Device and method including a soldering process Apr. 29, 2014
8709870 Method of forming solderable side-surface terminals of quad no-lead frame (QFN) integrated circuit packages Apr. 29, 2014
8691377 Semiconductor device Apr. 8, 2014
8679591 Method for reducing voids in a copper-tin interface and structure formed thereby Mar. 25, 2014
8674503 Circuit board, fabricating method thereof and package structure Mar. 18, 2014
8664773 Mounting structure of semiconductor package component and manufacturing method therefor Mar. 4, 2014
8659172 Semiconductor device and method of confining conductive bump material with solder mask patch Feb. 25, 2014
8652960 Active area bonding compatible high current structures Feb. 18, 2014
8643195 Nickel tin bonding system for semiconductor wafers and devices Feb. 4, 2014
8643185 Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material Feb. 4, 2014
8643180 Semiconductor device Feb. 4, 2014
8637983 Face-to-face (F2F) hybrid structure for an integrated circuit Jan. 28, 2014
8637975 Semiconductor device having lead wires connecting bonding pads formed on opposite sides of a core region forming a shield area Jan. 28, 2014
8633592 Hybrid interconnect technology Jan. 21, 2014
8633101 Semiconductor device and manufacturing method of semiconductor device Jan. 21, 2014
8629557 Structures and methods for detecting solder wetting of pedestal sidewalls Jan. 14, 2014
8629556 Semiconductor device Jan. 14, 2014
8623753 Stackable protruding via package and method Jan. 7, 2014
8614512 Solder ball contact susceptible to lower stress Dec. 24, 2013
8610289 Semiconductor component and method for producing a metal-semiconductor contact Dec. 17, 2013
8610270 Semiconductor device and semiconductor assembly with lead-free solder Dec. 17, 2013
8610264 Compliant interconnects in wafers Dec. 17, 2013
8604626 Reduced susceptibility to electrostatic discharge during 3D semiconductor device bonding and assembly Dec. 10, 2013
8604625 Semiconductor device having conductive pads to prevent solder reflow Dec. 10, 2013
8598715 Bump-on-trace structures in packaging Dec. 3, 2013
8598707 Solder alloy and semiconductor device Dec. 3, 2013
8592986 High melting point soldering layer alloyed by transient liquid phase and fabrication method for the same, and semiconductor device Nov. 26, 2013
8587133 Semiconductor device Nov. 19, 2013
8587122 Semiconductor flip-chip system having three-dimensional solder joints Nov. 19, 2013
8587107 Silicon carbide semiconductor Nov. 19, 2013
8586857 Combined diode, lead assembly incorporating an expansion joint Nov. 19, 2013
8575018 Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area Nov. 5, 2013
8569896 Active area bonding compatible high current structures Oct. 29, 2013
8564140 Mono-acid hybrid conductive composition and method Oct. 22, 2013
8558381 Semiconductor device Oct. 15, 2013
8558380 Stack package and method for manufacturing the same Oct. 15, 2013
8558379 Flip chip interconnection with double post Oct. 15, 2013
8541872 Integrated circuit package system with package stacking and method of manufacture thereof Sep. 24, 2013
8536512 Opto-electronic circuit board and manufacturing method for the same Sep. 17, 2013
8531041 Semiconductor component having a plated through-hole and method for the production thereof Sep. 10, 2013
8531040 Controlled area solder bonding for dies Sep. 10, 2013
8531031 Integrated circuit packages Sep. 10, 2013
8524593 Arrangement for solder bump formation on wafers Sep. 3, 2013
8524537 Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue Sep. 3, 2013
8519277 Surface mounted electronic component Aug. 27, 2013
8513819 Low loop wire bonding Aug. 20, 2013
8513806 Laminated high melting point soldering layer formed by TLP bonding and fabrication method for the same, and semiconductor device Aug. 20, 2013
8513109 Method of manufacturing an interconnect structure for a semiconductor device Aug. 20, 2013
8497200 Method to form solder alloy deposits on substrates Jul. 30, 2013
8492898 Printed circuit boards Jul. 23, 2013











 
 
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