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Class Information
Number: 257/778
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Flip chip
Description: Subject matter wherein a semiconductor substrate which contains an active solid-state electronic device has electric contacts on the top side thereof, the top side being that which contains an active solid-state electronic device, and which is flipped so that the contact side becomes the bottom side for connection with a substrate which has matching electrical contacts.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6784534 |
Thin integrated circuit package having an optically transparent window |
Aug. 31, 2004 |
| 6784547 |
Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers |
Aug. 31, 2004 |
| 6784554 |
Semiconductor device and manufacturing method thereof |
Aug. 31, 2004 |
| 6784765 |
Multilayer ceramic device |
Aug. 31, 2004 |
| 6781221 |
Packaging substrate for electronic elements and electronic device having packaged structure |
Aug. 24, 2004 |
| 6781225 |
Glueless integrated circuit system in a packaging module |
Aug. 24, 2004 |
| 6781228 |
Donut power mesh scheme for flip chip package |
Aug. 24, 2004 |
| 6781240 |
Semiconductor package with semiconductor chips stacked therein and method of making the package |
Aug. 24, 2004 |
| 6781244 |
Electrical die contact structure and fabrication method |
Aug. 24, 2004 |
| 6781245 |
Array structure of solder balls able to control collapse |
Aug. 24, 2004 |
| 6777612 |
Electronic device sealing electronic element therein and manufacturing method thereof, and printed wiring board suitable for such electronic device |
Aug. 17, 2004 |
| 6777794 |
Circuit mounting method, circuit mounted board, and semiconductor device |
Aug. 17, 2004 |
| 6777796 |
Stacked semiconductor chips on a wiring board |
Aug. 17, 2004 |
| 6777799 |
Stacked semiconductor device and method of producing the same |
Aug. 17, 2004 |
| 6777801 |
Semiconductor device and method of manufacturing same |
Aug. 17, 2004 |
| 6777804 |
Flip-chip package substrate |
Aug. 17, 2004 |
| 6777814 |
Semiconductor device |
Aug. 17, 2004 |
| 6777815 |
Configuration of conductive bumps and redistribution layer on a flip chip |
Aug. 17, 2004 |
| 6777816 |
Multi-chip module |
Aug. 17, 2004 |
| 6778403 |
Wiring board having terminal |
Aug. 17, 2004 |
| 6774447 |
Package having an opening in a surface thereof for mounting a solid state image sensor |
Aug. 10, 2004 |
| 6774473 |
Semiconductor chip module |
Aug. 10, 2004 |
| 6774474 |
Partially captured oriented interconnections for BGA packages and a method of forming the interconnections |
Aug. 10, 2004 |
| 6774475 |
Vertically stacked memory chips in FBGA packages |
Aug. 10, 2004 |
| 6774490 |
Electronic device |
Aug. 10, 2004 |
| 6774493 |
Semiconductor flip-chip package and method for the fabrication thereof |
Aug. 10, 2004 |
| 6774495 |
Solder terminal and fabricating method thereof |
Aug. 10, 2004 |
| 6774497 |
Flip-chip assembly with thin underfill and thick solder mask |
Aug. 10, 2004 |
| 6774498 |
Flip-chip package substrate |
Aug. 10, 2004 |
| 6774314 |
Electronic device and coupler |
Aug. 10, 2004 |
| 6770493 |
Integrated circuit package capable of operating in multiple orientations |
Aug. 3, 2004 |
| 6770956 |
Sensor circuit module and electronic device using the same |
Aug. 3, 2004 |
| 6770964 |
Semiconductor device including intermediate wiring element |
Aug. 3, 2004 |
| 6771677 |
Optical device structure and fabrication method thereof |
Aug. 3, 2004 |
| 6768190 |
Stack type flip-chip package |
Jul. 27, 2004 |
| 6768199 |
Flip chip type semiconductor device and method of fabricating the same |
Jul. 27, 2004 |
| 6768206 |
Organic substrate for flip chip bonding |
Jul. 27, 2004 |
| 6768208 |
Multiple chips bonded to packaging structure with low noise and multiple selectable functions |
Jul. 27, 2004 |
| 6768209 |
UNDERFILL COMPOUNDS INCLUDING ELECTRICALLY CHARGED FILLER ELEMENTS, MICROELECTRONIC DEVICES HAVING UNDERFILL COMPOUNDS INCLUDING ELECTRICALLY CHARGED FILLER ELEMENTS, AND METHODS OF UNDERFILLI |
Jul. 27, 2004 |
| 6765152 |
Multichip module having chips on two sides |
Jul. 20, 2004 |
| 6765279 |
Membrane 3D IC fabrication |
Jul. 20, 2004 |
| 6765285 |
Power semiconductor device with high radiating efficiency |
Jul. 20, 2004 |
| 6765288 |
Microelectronic adaptors, assemblies and methods |
Jul. 20, 2004 |
| 6765299 |
Semiconductor device and the method for manufacturing the same |
Jul. 20, 2004 |
| 6762472 |
Signal communication structures |
Jul. 13, 2004 |
| 6762487 |
Stack arrangements of chips and interconnecting members |
Jul. 13, 2004 |
| 6762492 |
Semiconductor device, image scanning unit and image forming apparatus |
Jul. 13, 2004 |
| 6762494 |
Electronic package substrate with an upper dielectric layer covering high speed signal traces |
Jul. 13, 2004 |
| 6762502 |
Semiconductor device packages including a plurality of layers substantially encapsulating leads thereof |
Jul. 13, 2004 |
| 6762505 |
150 degree bump placement layout for an integrated circuit power grid |
Jul. 13, 2004 |
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