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Class Information
Number: 257/778
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Flip chip
Description: Subject matter wherein a semiconductor substrate which contains an active solid-state electronic device has electric contacts on the top side thereof, the top side being that which contains an active solid-state electronic device, and which is flipped so that the contact side becomes the bottom side for connection with a substrate which has matching electrical contacts.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6958259 |
Method of stacking semiconductor element in a semiconductor device |
Oct. 25, 2005 |
| 6958532 |
Semiconductor storage device |
Oct. 25, 2005 |
| 6955948 |
Method of manufacturing a component built-in module |
Oct. 18, 2005 |
| 6956283 |
Encapsulants for protecting MEMS devices during post-packaging release etch |
Oct. 18, 2005 |
| 6956285 |
EMI grounding pins for CPU/ASIC chips |
Oct. 18, 2005 |
| 6956291 |
Apparatus and method for forming solder seals for semiconductor flip chip packages |
Oct. 18, 2005 |
| 6956295 |
Flip-chip image sensor packages |
Oct. 18, 2005 |
| 6956296 |
Transfer molding of integrated circuit packages |
Oct. 18, 2005 |
| 6953891 |
Moisture-resistant electronic device package and methods of assembly |
Oct. 11, 2005 |
| 6953893 |
Circuit board for connecting an integrated circuit to a support and IC BGA package using same |
Oct. 11, 2005 |
| 6953988 |
Semiconductor package |
Oct. 11, 2005 |
| 6953990 |
Wafer-level packaging of optoelectronic devices |
Oct. 11, 2005 |
| 6953998 |
Unmolded package for a semiconductor device |
Oct. 11, 2005 |
| 6953999 |
High density chip level package for the packaging of integrated circuits and method to manufacture same |
Oct. 11, 2005 |
| 6954000 |
Semiconductor component with redistribution circuit having conductors and test contacts |
Oct. 11, 2005 |
| 6954117 |
Electronic component including piezo-electric resonator mounted by face-down bonding with a required die shear strength |
Oct. 11, 2005 |
| 6951125 |
System and method for aligning an integrated circuit die on an integrated circuit substrate |
Oct. 4, 2005 |
| 6952054 |
Semiconductor package having interconnect with conductive members |
Oct. 4, 2005 |
| 6949773 |
GaN LED for flip-chip bonding and method of fabricating the same |
Sep. 27, 2005 |
| 6949815 |
Semiconductor device with decoupling capacitors mounted on conductors |
Sep. 27, 2005 |
| 6949822 |
Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance |
Sep. 27, 2005 |
| 6949835 |
Semiconductor device |
Sep. 27, 2005 |
| 6949836 |
Printed circuit board multi-layer structure with embedded device |
Sep. 27, 2005 |
| 6946728 |
System and methods for hermetic sealing of post media-filled MEMS package |
Sep. 20, 2005 |
| 6946734 |
Integrated passive components and package with posts |
Sep. 20, 2005 |
| 6946740 |
High power MCM package |
Sep. 20, 2005 |
| 6946741 |
Semiconductor device and manufacturing method thereof |
Sep. 20, 2005 |
| 6946742 |
Packaged microchip with isolator having selected modulus of elasticity |
Sep. 20, 2005 |
| 6946743 |
Flexibility enhanced integrated circuit carrier |
Sep. 20, 2005 |
| 6946745 |
Method and components for flip-chip bonding |
Sep. 20, 2005 |
| 6946747 |
Semiconductor device and its manufacturing method |
Sep. 20, 2005 |
| 6943424 |
Electronic package having a patterned layer on backside of its substrate, and the fabrication thereof |
Sep. 13, 2005 |
| 6943442 |
Electronic parts packaging structure having mutually connected electronic parts that are buried in a insulating film |
Sep. 13, 2005 |
| 6943443 |
Electronic circuit device including metallic member having installation members |
Sep. 13, 2005 |
| 6943446 |
Via construction for structural support |
Sep. 13, 2005 |
| 6940158 |
Assemblies having stacked semiconductor chips and methods of making same |
Sep. 6, 2005 |
| 6940167 |
Variable cross-section plated mushroom with stud for bumping |
Sep. 6, 2005 |
| 6940168 |
Enhanced pad design for substrate |
Sep. 6, 2005 |
| 6940175 |
Semiconductor device in which a plurality of electronic components are combined with each other |
Sep. 6, 2005 |
| 6940176 |
Solder pads for improving reliability of a package |
Sep. 6, 2005 |
| 6940177 |
Semiconductor package and method of preparing same |
Sep. 6, 2005 |
| 6940178 |
Self-coplanarity bumping shape for flip chip |
Sep. 6, 2005 |
| 6940183 |
Compound filled in lead IC packaging product |
Sep. 6, 2005 |
| 6936859 |
Light-emitting semiconductor device using group III nitride compound |
Aug. 30, 2005 |
| 6936928 |
Semiconductor component and method for its production |
Aug. 30, 2005 |
| 6936929 |
Multichip packages with exposed dice |
Aug. 30, 2005 |
| 6936930 |
Thermal enhance MCM package |
Aug. 30, 2005 |
| 6933171 |
Large bumps for optical flip chips |
Aug. 23, 2005 |
| 6933176 |
Ball grid array package and process for manufacturing same |
Aug. 23, 2005 |
| 6933592 |
Substrate structure capable of reducing package singular stress |
Aug. 23, 2005 |
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