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Class Information
Number: 257/778
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Flip chip
Description: Subject matter wherein a semiconductor substrate which contains an active solid-state electronic device has electric contacts on the top side thereof, the top side being that which contains an active solid-state electronic device, and which is flipped so that the contact side becomes the bottom side for connection with a substrate which has matching electrical contacts.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459777 |
Semiconductor package containing multi-layered semiconductor chips |
Dec. 2, 2008 |
| 7456503 |
Integrated circuit package |
Nov. 25, 2008 |
| 7456502 |
Wiring board with connection electrode formed in opening and semiconductor device using the same |
Nov. 25, 2008 |
| 7453155 |
Method for fabricating a flip chip package |
Nov. 18, 2008 |
| 7452803 |
Method for fabricating chip structure |
Nov. 18, 2008 |
| 7449787 |
Liquid crystal display |
Nov. 11, 2008 |
| 7449779 |
Wire bonded wafer level cavity package |
Nov. 11, 2008 |
| 7449770 |
Substrate with slot |
Nov. 11, 2008 |
| 7449716 |
Bond quality indication by bump structure on substrate |
Nov. 11, 2008 |
| 7449364 |
Device and method for including passive components in a chip scale package |
Nov. 11, 2008 |
| 7447041 |
Compression connection for vertical IC packages |
Nov. 4, 2008 |
| 7446421 |
Bonding structure with buffer layer and method of forming the same |
Nov. 4, 2008 |
| 7446414 |
Semiconductor device |
Nov. 4, 2008 |
| 7446405 |
Wafer level chip scale package (WLCSP) with high reliability against thermal stress |
Nov. 4, 2008 |
| 7446404 |
Three-dimensional package and method of making the same |
Nov. 4, 2008 |
| 7446384 |
CMOS image sensor module with wafers |
Nov. 4, 2008 |
| 7445959 |
Sensor module and method of manufacturing same |
Nov. 4, 2008 |
| 7443040 |
Aluminum cap with electroless nickel/immersion gold |
Oct. 28, 2008 |
| 7443038 |
Flip-chip image sensor packages |
Oct. 28, 2008 |
| 7443036 |
Manufacturing method of semiconductor device |
Oct. 28, 2008 |
| 7443025 |
Thermally improved placement of power-dissipating components onto a circuit board |
Oct. 28, 2008 |
| 7436072 |
Protected chip stack |
Oct. 14, 2008 |
| 7436063 |
Packaging substrate and semiconductor device |
Oct. 14, 2008 |
| 7436062 |
Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method |
Oct. 14, 2008 |
| 7432601 |
Semiconductor package and fabrication process thereof |
Oct. 7, 2008 |
| 7432600 |
System having semiconductor component with multiple stacked dice |
Oct. 7, 2008 |
| 7432595 |
System and method to reduce metal series resistance of bumped chip |
Oct. 7, 2008 |
| 7432585 |
Semiconductor device electronic component, circuit board, and electronic device |
Oct. 7, 2008 |
| 7432130 |
Method of packaging semiconductor die without lead frame or substrate |
Oct. 7, 2008 |
| 7429798 |
Integrated circuit package-in-package system |
Sep. 30, 2008 |
| 7429797 |
Electronic device and carrier substrate |
Sep. 30, 2008 |
| 7429796 |
Semiconductor device and fabrication process thereof |
Sep. 30, 2008 |
| 7429793 |
Semiconductor device having an electronic circuit disposed therein |
Sep. 30, 2008 |
| 7427809 |
Repairable three-dimensional semiconductor subsystem |
Sep. 23, 2008 |
| 7427805 |
Light-emitting diode chip package body and packaging method thereof |
Sep. 23, 2008 |
| 7425758 |
Metal core foldover package structures |
Sep. 16, 2008 |
| 7425745 |
Semiconductor device and method for manufacturing the same |
Sep. 16, 2008 |
| 7423337 |
Integrated circuit device package having a support coating for improved reliability during temperature cycling |
Sep. 9, 2008 |
| 7420817 |
MEMS device seal using liquid crystal polymer |
Sep. 2, 2008 |
| 7420282 |
Connection structure for connecting semiconductor element and wiring board, and semiconductor device |
Sep. 2, 2008 |
| 7420265 |
Integrated circuit package system with integrated circuit support |
Sep. 2, 2008 |
| 7419852 |
Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies |
Sep. 2, 2008 |
| 7417323 |
Neo-wafer device and method |
Aug. 26, 2008 |
| 7417309 |
Circuit device and portable device with symmetrical arrangement |
Aug. 26, 2008 |
| 7417293 |
Image sensor packaging structure |
Aug. 26, 2008 |
| 7414318 |
Etched leadframe flipchip package system |
Aug. 19, 2008 |
| 7413928 |
Die-wafer package and method of fabricating same |
Aug. 19, 2008 |
| 7411306 |
Packaging structure and method of an image sensor module |
Aug. 12, 2008 |
| 7411297 |
Microfeature devices and methods for manufacturing microfeature devices |
Aug. 12, 2008 |
| 7411285 |
Low profile stacked semiconductor chip package |
Aug. 12, 2008 |
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