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Class Information
Number: 257/778
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Flip chip
Description: Subject matter wherein a semiconductor substrate which contains an active solid-state electronic device has electric contacts on the top side thereof, the top side being that which contains an active solid-state electronic device, and which is flipped so that the contact side becomes the bottom side for connection with a substrate which has matching electrical contacts.


Patents under this class:

Patent Number Title Of Patent Date Issued
7615851 Integrated circuit package system Nov. 10, 2009
7615850 Method and device including reworkable alpha particle barrier and corrosion barrier Nov. 10, 2009
7615842 Inductor integrated chip Nov. 10, 2009
7615413 Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component Nov. 10, 2009
7615410 Chip-sized flip-chip semiconductor package and method for making the same Nov. 10, 2009
7614888 Flip chip package process Nov. 10, 2009
7612444 Semiconductor package with flow controller Nov. 3, 2009
7608921 Multi-layer semiconductor package Oct. 27, 2009
7608920 Memory card and method for devising Oct. 27, 2009
7608789 Component arrangement provided with a carrier substrate Oct. 27, 2009
7605480 Flip chip interconnection pad layout Oct. 20, 2009
7605479 Stacked chip assembly with encapsulant layer Oct. 20, 2009
7605477 Stacked integrated circuit assembly Oct. 20, 2009
7605459 Coreless substrate and manufacturing thereof Oct. 20, 2009
7605454 Memory card and method for devising Oct. 20, 2009
7604152 Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same Oct. 20, 2009
7603769 Method of coupling a surface mount device Oct. 20, 2009
7602060 Heat spreader in a flip chip package Oct. 13, 2009
7602058 Flip-chip semiconductor device with improved power pad arrangement Oct. 13, 2009
7598617 Stack package utilizing through vias and re-distribution lines Oct. 6, 2009
7598613 Flip chip bonding structure Oct. 6, 2009
7598610 Plate structure having chip embedded therein and the manufacturing method of the same Oct. 6, 2009
7598603 Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink Oct. 6, 2009
7595997 Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component Sep. 29, 2009
7592707 Method and apparatus for facilitating proximity communication and power delivery Sep. 22, 2009
7592702 Via heat sink material Sep. 22, 2009
7592689 Semiconductor module comprising semiconductor chips and method for producing the same Sep. 22, 2009
7589414 I/O Architecture for integrated circuit package Sep. 15, 2009
7586188 Chip package and coreless package substrate thereof Sep. 8, 2009
7586181 Semiconductor device and method for manufacturing Sep. 8, 2009
7582973 Flip-chip type assembly Sep. 1, 2009
7582972 Semiconductor device and fabrication method thereof Sep. 1, 2009
7579694 Electronic devices including offset conductive bumps Aug. 25, 2009
7576436 Structure of wafer level package with area bump Aug. 18, 2009
7576435 Low-cost and ultra-fine integrated circuit packaging technique Aug. 18, 2009
7576434 Wafer-level solder bumps Aug. 18, 2009
7573720 Active socket for facilitating proximity communication Aug. 11, 2009
7573139 Packed system of semiconductor chips having a semiconductor interposer Aug. 11, 2009
7573138 Stress decoupling structures for flip-chip assembly Aug. 11, 2009
7569939 Self alignment features for an electronic assembly Aug. 4, 2009
7569935 Pillar-to-pillar flip-chip assembly Aug. 4, 2009
7569924 Semiconductor device and manufacturing method thereof Aug. 4, 2009
7569922 Semiconductor device having a bonding wire and method for manufacturing the same Aug. 4, 2009
7569920 Electronic component having at least one vertical semiconductor power transistor Aug. 4, 2009
7566961 Multi-stacked package and method of manufacturing the same Jul. 28, 2009
7566649 Compressible films surrounding solder connectors Jul. 28, 2009
7566575 Mounting circuit and method for producing semiconductor-chip-mounting circuit Jul. 28, 2009
7564140 Semiconductor package and substrate structure thereof Jul. 21, 2009
7564139 Semiconductor device and method for manufacturing the same Jul. 21, 2009
7564131 Semiconductor package and method of making a semiconductor package Jul. 21, 2009



 
 
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