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Class Information
Number: 257/778
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Flip chip
Description: Subject matter wherein a semiconductor substrate which contains an active solid-state electronic device has electric contacts on the top side thereof, the top side being that which contains an active solid-state electronic device, and which is flipped so that the contact side becomes the bottom side for connection with a substrate which has matching electrical contacts.


Patents under this class:

Patent Number Title Of Patent Date Issued
7459777 Semiconductor package containing multi-layered semiconductor chips Dec. 2, 2008
7456503 Integrated circuit package Nov. 25, 2008
7456502 Wiring board with connection electrode formed in opening and semiconductor device using the same Nov. 25, 2008
7453155 Method for fabricating a flip chip package Nov. 18, 2008
7452803 Method for fabricating chip structure Nov. 18, 2008
7449787 Liquid crystal display Nov. 11, 2008
7449779 Wire bonded wafer level cavity package Nov. 11, 2008
7449770 Substrate with slot Nov. 11, 2008
7449716 Bond quality indication by bump structure on substrate Nov. 11, 2008
7449364 Device and method for including passive components in a chip scale package Nov. 11, 2008
7447041 Compression connection for vertical IC packages Nov. 4, 2008
7446421 Bonding structure with buffer layer and method of forming the same Nov. 4, 2008
7446414 Semiconductor device Nov. 4, 2008
7446405 Wafer level chip scale package (WLCSP) with high reliability against thermal stress Nov. 4, 2008
7446404 Three-dimensional package and method of making the same Nov. 4, 2008
7446384 CMOS image sensor module with wafers Nov. 4, 2008
7445959 Sensor module and method of manufacturing same Nov. 4, 2008
7443040 Aluminum cap with electroless nickel/immersion gold Oct. 28, 2008
7443038 Flip-chip image sensor packages Oct. 28, 2008
7443036 Manufacturing method of semiconductor device Oct. 28, 2008
7443025 Thermally improved placement of power-dissipating components onto a circuit board Oct. 28, 2008
7436072 Protected chip stack Oct. 14, 2008
7436063 Packaging substrate and semiconductor device Oct. 14, 2008
7436062 Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method Oct. 14, 2008
7432601 Semiconductor package and fabrication process thereof Oct. 7, 2008
7432600 System having semiconductor component with multiple stacked dice Oct. 7, 2008
7432595 System and method to reduce metal series resistance of bumped chip Oct. 7, 2008
7432585 Semiconductor device electronic component, circuit board, and electronic device Oct. 7, 2008
7432130 Method of packaging semiconductor die without lead frame or substrate Oct. 7, 2008
7429798 Integrated circuit package-in-package system Sep. 30, 2008
7429797 Electronic device and carrier substrate Sep. 30, 2008
7429796 Semiconductor device and fabrication process thereof Sep. 30, 2008
7429793 Semiconductor device having an electronic circuit disposed therein Sep. 30, 2008
7427809 Repairable three-dimensional semiconductor subsystem Sep. 23, 2008
7427805 Light-emitting diode chip package body and packaging method thereof Sep. 23, 2008
7425758 Metal core foldover package structures Sep. 16, 2008
7425745 Semiconductor device and method for manufacturing the same Sep. 16, 2008
7423337 Integrated circuit device package having a support coating for improved reliability during temperature cycling Sep. 9, 2008
7420817 MEMS device seal using liquid crystal polymer Sep. 2, 2008
7420282 Connection structure for connecting semiconductor element and wiring board, and semiconductor device Sep. 2, 2008
7420265 Integrated circuit package system with integrated circuit support Sep. 2, 2008
7419852 Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies Sep. 2, 2008
7417323 Neo-wafer device and method Aug. 26, 2008
7417309 Circuit device and portable device with symmetrical arrangement Aug. 26, 2008
7417293 Image sensor packaging structure Aug. 26, 2008
7414318 Etched leadframe flipchip package system Aug. 19, 2008
7413928 Die-wafer package and method of fabricating same Aug. 19, 2008
7411306 Packaging structure and method of an image sensor module Aug. 12, 2008
7411297 Microfeature devices and methods for manufacturing microfeature devices Aug. 12, 2008
7411285 Low profile stacked semiconductor chip package Aug. 12, 2008



 
 
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