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Class Information
Number: 257/778
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Flip chip
Description: Subject matter wherein a semiconductor substrate which contains an active solid-state electronic device has electric contacts on the top side thereof, the top side being that which contains an active solid-state electronic device, and which is flipped so that the contact side becomes the bottom side for connection with a substrate which has matching electrical contacts.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615851 |
Integrated circuit package system |
Nov. 10, 2009 |
| 7615850 |
Method and device including reworkable alpha particle barrier and corrosion barrier |
Nov. 10, 2009 |
| 7615842 |
Inductor integrated chip |
Nov. 10, 2009 |
| 7615413 |
Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component |
Nov. 10, 2009 |
| 7615410 |
Chip-sized flip-chip semiconductor package and method for making the same |
Nov. 10, 2009 |
| 7614888 |
Flip chip package process |
Nov. 10, 2009 |
| 7612444 |
Semiconductor package with flow controller |
Nov. 3, 2009 |
| 7608921 |
Multi-layer semiconductor package |
Oct. 27, 2009 |
| 7608920 |
Memory card and method for devising |
Oct. 27, 2009 |
| 7608789 |
Component arrangement provided with a carrier substrate |
Oct. 27, 2009 |
| 7605480 |
Flip chip interconnection pad layout |
Oct. 20, 2009 |
| 7605479 |
Stacked chip assembly with encapsulant layer |
Oct. 20, 2009 |
| 7605477 |
Stacked integrated circuit assembly |
Oct. 20, 2009 |
| 7605459 |
Coreless substrate and manufacturing thereof |
Oct. 20, 2009 |
| 7605454 |
Memory card and method for devising |
Oct. 20, 2009 |
| 7604152 |
Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same |
Oct. 20, 2009 |
| 7603769 |
Method of coupling a surface mount device |
Oct. 20, 2009 |
| 7602060 |
Heat spreader in a flip chip package |
Oct. 13, 2009 |
| 7602058 |
Flip-chip semiconductor device with improved power pad arrangement |
Oct. 13, 2009 |
| 7598617 |
Stack package utilizing through vias and re-distribution lines |
Oct. 6, 2009 |
| 7598613 |
Flip chip bonding structure |
Oct. 6, 2009 |
| 7598610 |
Plate structure having chip embedded therein and the manufacturing method of the same |
Oct. 6, 2009 |
| 7598603 |
Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink |
Oct. 6, 2009 |
| 7595997 |
Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component |
Sep. 29, 2009 |
| 7592707 |
Method and apparatus for facilitating proximity communication and power delivery |
Sep. 22, 2009 |
| 7592702 |
Via heat sink material |
Sep. 22, 2009 |
| 7592689 |
Semiconductor module comprising semiconductor chips and method for producing the same |
Sep. 22, 2009 |
| 7589414 |
I/O Architecture for integrated circuit package |
Sep. 15, 2009 |
| 7586188 |
Chip package and coreless package substrate thereof |
Sep. 8, 2009 |
| 7586181 |
Semiconductor device and method for manufacturing |
Sep. 8, 2009 |
| 7582973 |
Flip-chip type assembly |
Sep. 1, 2009 |
| 7582972 |
Semiconductor device and fabrication method thereof |
Sep. 1, 2009 |
| 7579694 |
Electronic devices including offset conductive bumps |
Aug. 25, 2009 |
| 7576436 |
Structure of wafer level package with area bump |
Aug. 18, 2009 |
| 7576435 |
Low-cost and ultra-fine integrated circuit packaging technique |
Aug. 18, 2009 |
| 7576434 |
Wafer-level solder bumps |
Aug. 18, 2009 |
| 7573720 |
Active socket for facilitating proximity communication |
Aug. 11, 2009 |
| 7573139 |
Packed system of semiconductor chips having a semiconductor interposer |
Aug. 11, 2009 |
| 7573138 |
Stress decoupling structures for flip-chip assembly |
Aug. 11, 2009 |
| 7569939 |
Self alignment features for an electronic assembly |
Aug. 4, 2009 |
| 7569935 |
Pillar-to-pillar flip-chip assembly |
Aug. 4, 2009 |
| 7569924 |
Semiconductor device and manufacturing method thereof |
Aug. 4, 2009 |
| 7569922 |
Semiconductor device having a bonding wire and method for manufacturing the same |
Aug. 4, 2009 |
| 7569920 |
Electronic component having at least one vertical semiconductor power transistor |
Aug. 4, 2009 |
| 7566961 |
Multi-stacked package and method of manufacturing the same |
Jul. 28, 2009 |
| 7566649 |
Compressible films surrounding solder connectors |
Jul. 28, 2009 |
| 7566575 |
Mounting circuit and method for producing semiconductor-chip-mounting circuit |
Jul. 28, 2009 |
| 7564140 |
Semiconductor package and substrate structure thereof |
Jul. 21, 2009 |
| 7564139 |
Semiconductor device and method for manufacturing the same |
Jul. 21, 2009 |
| 7564131 |
Semiconductor package and method of making a semiconductor package |
Jul. 21, 2009 |
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