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Browse by Category: Main > Physics
Class Information
Number: 257/778
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Flip chip
Description: Subject matter wherein a semiconductor substrate which contains an active solid-state electronic device has electric contacts on the top side thereof, the top side being that which contains an active solid-state electronic device, and which is flipped so that the contact side becomes the bottom side for connection with a substrate which has matching electrical contacts.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710681 Isolation rings for blocking the interface between package components and the respective molding compound Apr. 29, 2014
8710678 Device and method including a soldering process Apr. 29, 2014
8710671 Multi-level integrated circuit, device and method for modeling multi-level integrated circuits Apr. 29, 2014
8710664 Wafer-level chip scale package Apr. 29, 2014
8710663 Method of manufacturing semiconductor device and semiconductor device Apr. 29, 2014
8710658 Under bump passive components in wafer level packaging Apr. 29, 2014
8710657 Semiconductor assembly and semiconductor package including a solder channel Apr. 29, 2014
8710653 Chip on chip semiconductor device including an underfill layer having a resin containing an amine-based curing agent Apr. 29, 2014
8710650 Semiconductor devices having through electrodes and methods of fabricating the same Apr. 29, 2014
8704383 Silicon-based thin substrate and packaging schemes Apr. 22, 2014
8704382 Film for flip chip type semiconductor back surface Apr. 22, 2014
8704380 Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods Apr. 22, 2014
8704369 Flip chip bump structure and fabrication method Apr. 22, 2014
8704364 Reducing stress in multi-die integrated circuit structures Apr. 22, 2014
8704353 Thermal management of stacked semiconductor chips with electrically non-functional interconnects Apr. 22, 2014
8704352 Semiconductor device having a liquid cooling module Apr. 22, 2014
8704345 Semiconductor package and lead frame thereof Apr. 22, 2014
8703541 Electronic system with expansion feature Apr. 22, 2014
8703539 Multiple die packaging interposer structure and method Apr. 22, 2014
8693203 Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices Apr. 8, 2014
8692390 Pyramid bump structure Apr. 8, 2014
8692389 Dicing tape-integrated film for semiconductor back surface Apr. 8, 2014
8692386 Semiconductor device, method of manufacturing semiconductor device, and electronic device Apr. 8, 2014
8691626 Semiconductor chip device with underfill Apr. 8, 2014
8686544 Semiconductor device Apr. 1, 2014
8685797 Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof Apr. 1, 2014
8681509 Printed circuit board Mar. 25, 2014
8680689 Coplanar waveguide for stacked multi-chip systems Mar. 25, 2014
8680661 Direct contact package for power transistors Mar. 25, 2014
8680652 Stack package Mar. 25, 2014
8674519 Microelectronic package and method of manufacturing same Mar. 18, 2014
8674505 Integrated circuit packaging with ball grid array having differential pitch to enhance thermal performance Mar. 18, 2014
8674503 Circuit board, fabricating method thereof and package structure Mar. 18, 2014
8669665 Flip-chip mounting substrate and flip-chip mounting method Mar. 11, 2014
8669138 Semiconductor device and method for manufacturing the same Mar. 11, 2014
8664780 Semiconductor package having plural semiconductor chips and method of forming the same Mar. 4, 2014
8664772 Interface substrate with interposer Mar. 4, 2014
8664771 Apparatuses and methods to enhance passivation and ILD reliability Mar. 4, 2014
8664759 Integrated circuit with heat conducting structures for localized thermal control Mar. 4, 2014
8664756 Reconstituted wafer package with high voltage discrete active dice and integrated field plate for high temperature leakage current stability Mar. 4, 2014
8664749 Component stacking using pre-formed adhesive films Mar. 4, 2014
8659174 Semiconductor device Feb. 25, 2014
8659171 Patch on interposer assembly and structures formed thereby Feb. 25, 2014
8659170 Semiconductor device having conductive pads and a method of manufacturing the same Feb. 25, 2014
8659169 Corner structure for IC die Feb. 25, 2014
8659168 Wiring board for flip-chip mounting, mounting structure of electronic components on wiring board, and semiconductor device including wiring board Feb. 25, 2014
8659153 Pillar on pad interconnect structures, semiconductor dice and die assemblies including such interconnect structures, and related methods Feb. 25, 2014
8659143 Stub minimization for wirebond assemblies without windows Feb. 25, 2014
8659142 Stub minimization for wirebond assemblies without windows Feb. 25, 2014
8659141 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows Feb. 25, 2014











 
 
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