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Class Information
Number: 257/777
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Chip mounted on chip
Description: Subject matter wherein a semiconductor substrate of an active solid-state device is electrically connected to, and positioned on, another semiconductor substrate.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7208822 |
Integrated circuit device, electronic module for chip cards using said device and method for making same |
Apr. 24, 2007 |
| 7208402 |
Method and apparatus for improved power routing |
Apr. 24, 2007 |
| 7205670 |
Semiconductor device and manufacturing method therefor |
Apr. 17, 2007 |
| 7205669 |
Semiconductor device |
Apr. 17, 2007 |
| 7205656 |
Stacked device package for peripheral and center device pad layout device |
Apr. 17, 2007 |
| 7205651 |
Thermally enhanced stacked die package and fabrication method |
Apr. 17, 2007 |
| 7205647 |
Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages |
Apr. 17, 2007 |
| 7205646 |
Electronic device and chip package |
Apr. 17, 2007 |
| 7205645 |
Wiring board, semiconductor device, and method of manufacturing wiring board |
Apr. 17, 2007 |
| 7205644 |
Memory card structure and manufacturing method thereof |
Apr. 17, 2007 |
| 7202556 |
Semiconductor package having substrate with multi-layer metal bumps |
Apr. 10, 2007 |
| 7202555 |
Pitch change and chip scale stacking system and method |
Apr. 10, 2007 |
| 7202554 |
Semiconductor package and its manufacturing method |
Apr. 10, 2007 |
| 7200022 |
Apparatus and method for mounting microelectronic devices on a mirrored board assembly |
Apr. 3, 2007 |
| 7199469 |
Semiconductor device having stacked semiconductor chips sealed with a resin seal member |
Apr. 3, 2007 |
| 7199459 |
Semiconductor package without bonding wires and fabrication method thereof |
Apr. 3, 2007 |
| 7199458 |
Stacked offset semiconductor package and method for fabricating |
Apr. 3, 2007 |
| 7199440 |
Techniques for joining an opto-electronic module to a semiconductor package |
Apr. 3, 2007 |
| 7198979 |
Method for manufacturing a stack arrangement of a memory module |
Apr. 3, 2007 |
| 7196427 |
Structure having an integrated circuit on another integrated circuit with an intervening bent adhesive element |
Mar. 27, 2007 |
| 7196425 |
Copper interposer for reducing warping of integrated circuit packages and method of making IC packages |
Mar. 27, 2007 |
| 7196418 |
Semiconductor device and stacked semiconductor device that can increase flexibility in designing a stacked semiconductor device |
Mar. 27, 2007 |
| 7195952 |
Schottky diode device with aluminum pickup of backside cathode |
Mar. 27, 2007 |
| 7193328 |
Semiconductor device |
Mar. 20, 2007 |
| 7193308 |
Intermediate chip module, semiconductor device, circuit board, and electronic device |
Mar. 20, 2007 |
| 7193297 |
Semiconductor device, method for manufacturing the same, circuit substrate and electronic device |
Mar. 20, 2007 |
| 7192847 |
Ultra-thin wafer level stack packaging method |
Mar. 20, 2007 |
| 7190072 |
RFID-chip having RFID-tag or magnifying electrode |
Mar. 13, 2007 |
| 7190071 |
Semiconductor package and method for fabricating the same |
Mar. 13, 2007 |
| 7190063 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic apparatus |
Mar. 13, 2007 |
| 7190060 |
Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same |
Mar. 13, 2007 |
| 7190059 |
Electronic component with a stack of semiconductor chips and a method for producing the electronic component |
Mar. 13, 2007 |
| 7187070 |
Stacked package module |
Mar. 6, 2007 |
| 7187068 |
Methods and apparatuses for providing stacked-die devices |
Mar. 6, 2007 |
| 7186576 |
Stacked die module and techniques for forming a stacked die module |
Mar. 6, 2007 |
| 7183655 |
Packaged semiconductor device |
Feb. 27, 2007 |
| 7183648 |
Method and apparatus for low temperature copper to copper bonding |
Feb. 27, 2007 |
| 7183638 |
Embedded heat spreader |
Feb. 27, 2007 |
| 7183619 |
Surface acoustic wave apparatus |
Feb. 27, 2007 |
| 7180168 |
Stacked semiconductor chips |
Feb. 20, 2007 |
| 7180167 |
Low profile stacking system and method |
Feb. 20, 2007 |
| 7180165 |
Stackable electronic assembly |
Feb. 20, 2007 |
| 7180164 |
Semiconductor device |
Feb. 20, 2007 |
| 7180149 |
Semiconductor package with through-hole |
Feb. 20, 2007 |
| 7176579 |
Semiconductor module |
Feb. 13, 2007 |
| 7176560 |
Semiconductor device having a chip--chip structure |
Feb. 13, 2007 |
| 7173340 |
Daisy chaining of serial I/O interface on stacking devices |
Feb. 6, 2007 |
| 7173325 |
Expansion constrained die stack |
Feb. 6, 2007 |
| 7170184 |
Treatment of a ground semiconductor die to improve adhesive bonding to a substrate |
Jan. 30, 2007 |
| 7170183 |
Wafer level stacked package |
Jan. 30, 2007 |
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