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Class Information
Number: 257/777
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Chip mounted on chip
Description: Subject matter wherein a semiconductor substrate of an active solid-state device is electrically connected to, and positioned on, another semiconductor substrate.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6933605 |
Semiconductor package |
Aug. 23, 2005 |
| 6933613 |
Flip chip ball grid array package |
Aug. 23, 2005 |
| 6934065 |
Microelectronic devices and methods for packaging microelectronic devices |
Aug. 23, 2005 |
| 6930378 |
Stacked semiconductor die assembly having at least one support |
Aug. 16, 2005 |
| 6930382 |
Semiconductor device and method of manufacturing the same |
Aug. 16, 2005 |
| 6930396 |
Semiconductor device and method for manufacturing the same |
Aug. 16, 2005 |
| 6927478 |
Reduced size semiconductor package with stacked dies |
Aug. 9, 2005 |
| 6927497 |
Multi-die semiconductor package |
Aug. 9, 2005 |
| 6924556 |
Stack package and manufacturing method thereof |
Aug. 2, 2005 |
| 6921968 |
Stacked flip chip package |
Jul. 26, 2005 |
| 6921975 |
Circuit device with at least partial packaging, exposed active surface and a voltage reference plane |
Jul. 26, 2005 |
| 6921980 |
Integrated semiconductor circuit including electronic component connected between different component connection portions |
Jul. 26, 2005 |
| 6922499 |
MEMS driver circuit arrangement |
Jul. 26, 2005 |
| 6919616 |
Chip with passive electrical contacts |
Jul. 19, 2005 |
| 6919627 |
Multichip module |
Jul. 19, 2005 |
| 6919641 |
Semiconductor device and method for fabricating the same |
Jul. 19, 2005 |
| 6917107 |
Board-on-chip packages |
Jul. 12, 2005 |
| 6913948 |
Partially captured oriented interconnections for BGA packages and a method of forming the interconnections |
Jul. 5, 2005 |
| 6914259 |
Multi-chip module, semiconductor chip, and interchip connection test method for multi-chip module |
Jul. 5, 2005 |
| 6910812 |
Small-scale optoelectronic package |
Jun. 28, 2005 |
| 6911721 |
Semiconductor device, method for manufacturing semiconductor device and electronic equipment |
Jun. 28, 2005 |
| 6911723 |
Multiple die stack apparatus employing T-shaped interposer elements |
Jun. 28, 2005 |
| 6911724 |
Integrated chip package having intermediate substrate with capacitor |
Jun. 28, 2005 |
| 6911730 |
Multi-chip module including embedded transistors within the substrate |
Jun. 28, 2005 |
| 6909172 |
Semiconductor device with conduction test terminals |
Jun. 21, 2005 |
| 6905913 |
Semiconductor device and method of manufacturing same |
Jun. 14, 2005 |
| 6906403 |
Sealed electronic device packages with transparent coverings |
Jun. 14, 2005 |
| 6906407 |
Field programmable gate array assembly |
Jun. 14, 2005 |
| 6906408 |
Assemblies and packages including die-to-die connections |
Jun. 14, 2005 |
| 6906424 |
Semiconductor package and method producing same |
Jun. 14, 2005 |
| 6903453 |
Semiconductor integrated circuit device and debugger device for the same |
Jun. 7, 2005 |
| 6903455 |
Side braze packages |
Jun. 7, 2005 |
| 6903458 |
Embedded carrier for an integrated circuit chip |
Jun. 7, 2005 |
| 6900525 |
Semiconductor package having filler metal of gold/silver/copper alloy |
May. 31, 2005 |
| 6900528 |
Stacked mass storage flash memory package |
May. 31, 2005 |
| 6900530 |
Stacked IC |
May. 31, 2005 |
| 6900547 |
Thermoplastic molding process and apparatus |
May. 31, 2005 |
| 6900549 |
Semiconductor assembly without adhesive fillets |
May. 31, 2005 |
| 6897088 |
Method for connecting circuit devices |
May. 24, 2005 |
| 6897552 |
Semiconductor device wherein chips are stacked to have a fine pitch structure |
May. 24, 2005 |
| 6897565 |
Stacked packages |
May. 24, 2005 |
| 6894379 |
Sharing of multiple-access signal line in a printed circuit board |
May. 17, 2005 |
| 6894381 |
Electronic device having a stack of semiconductor chips and method for the production thereof |
May. 17, 2005 |
| 6894385 |
Integrated circuit package having bypass capacitors coupled to bottom of package substrate and supporting surface mounting technology |
May. 17, 2005 |
| 6894392 |
Scaleable integrated data processing device |
May. 17, 2005 |
| 6894395 |
System on a chip device including a re-wiring layer formed between groups of electronic devices |
May. 17, 2005 |
| 6894396 |
Semiconductor device with capacitor |
May. 17, 2005 |
| 6894398 |
Insulated bond wire assembly for integrated circuits |
May. 17, 2005 |
| 6891258 |
Interposer providing low-inductance decoupling capacitance for a packaged integrated circuit |
May. 10, 2005 |
| 6888240 |
High performance, low cost microelectronic circuit package with interposer |
May. 3, 2005 |
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