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Class Information
Number: 257/777
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Chip mounted on chip
Description: Subject matter wherein a semiconductor substrate of an active solid-state device is electrically connected to, and positioned on, another semiconductor substrate.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7067926 |
Semiconductor chip and method for manufacturing the same |
Jun. 27, 2006 |
| 7067927 |
Die with integral pedestal having insulated walls |
Jun. 27, 2006 |
| 7064425 |
Semiconductor device circuit board, and electronic equipment |
Jun. 20, 2006 |
| 7064426 |
Semiconductor multi-package module having wire bond interconnect between stacked packages |
Jun. 20, 2006 |
| 7064430 |
Stacked die packaging and fabrication method |
Jun. 20, 2006 |
| 7064443 |
Semiconductor device having a plurality of stacked semiconductor chips with positions of chip-selecting terminals being different from each other |
Jun. 20, 2006 |
| 7064444 |
Multi-chip ball grid array package |
Jun. 20, 2006 |
| 7061083 |
Semiconductor devices |
Jun. 13, 2006 |
| 7061089 |
Memory module having space-saving arrangement of memory chips and memory chip therefore |
Jun. 13, 2006 |
| 7061103 |
Chip package structure |
Jun. 13, 2006 |
| 7061119 |
Tape attachment chip-on-board assemblies |
Jun. 13, 2006 |
| 7061120 |
Stackable semiconductor package having semiconductor chip within central through hole of substrate |
Jun. 13, 2006 |
| 7061121 |
Stacked microelectronic assemblies with central contacts |
Jun. 13, 2006 |
| 7061123 |
Wafer level ball grid array |
Jun. 13, 2006 |
| 7061785 |
Stacked large-scale integrated circuit (LSI) semiconductor device with miniaturization and thinning of package |
Jun. 13, 2006 |
| 7057270 |
Systems and methods for stacking chip components |
Jun. 6, 2006 |
| 7057281 |
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths |
Jun. 6, 2006 |
| 7057290 |
Electronic parts packaging structure and method of manufacturing the same |
Jun. 6, 2006 |
| 7057291 |
Methods for securing vertically mountable semiconductor devices in back-to back relation |
Jun. 6, 2006 |
| 7057295 |
IC module assembly |
Jun. 6, 2006 |
| 7053475 |
Semiconductor device and manufacturing method therefor |
May. 30, 2006 |
| 7053478 |
Pitch change and chip scale stacking system |
May. 30, 2006 |
| 7053491 |
Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board |
May. 30, 2006 |
| 7049684 |
Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same |
May. 23, 2006 |
| 7049687 |
Tape carrier package having stacked semiconductor elements, and short and long leads |
May. 23, 2006 |
| 7049689 |
Chip on glass package |
May. 23, 2006 |
| 7045386 |
Semiconductor device and semiconductor chip for use therein |
May. 16, 2006 |
| 7045396 |
Stackable semiconductor package and method for manufacturing same |
May. 16, 2006 |
| 7045886 |
Semiconductor device and method of fabricating the same |
May. 16, 2006 |
| 7045888 |
Ultra thin dual chip image sensor package structure and method for fabrication |
May. 16, 2006 |
| 7045892 |
Stack package of semiconductor device |
May. 16, 2006 |
| 7045894 |
Semiconductor device and manufacturing method thereof |
May. 16, 2006 |
| 7045899 |
Semiconductor device and fabrication method of the same |
May. 16, 2006 |
| 7045900 |
Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device |
May. 16, 2006 |
| 7045901 |
Chip-on-chip connection with second chip located in rectangular open window hole in printed circuit board |
May. 16, 2006 |
| 7046522 |
Method for scalable architectures in stackable three-dimensional integrated circuits and electronics |
May. 16, 2006 |
| 7042073 |
Semiconductor device and manufacturing method thereof |
May. 9, 2006 |
| 7037755 |
Three dimensional device integration method and integrated device |
May. 2, 2006 |
| 7034393 |
Semiconductor assembly with conductive rim and method of producing the same |
Apr. 25, 2006 |
| 7030317 |
Electronic assembly with stacked integrated circuit die |
Apr. 18, 2006 |
| 7030432 |
Method of fabricating an integrated circuit that seals a MEMS device within a cavity |
Apr. 18, 2006 |
| 7030470 |
Using chip lamination to couple an integrated circuit with a microstrip transmission line |
Apr. 18, 2006 |
| 7030486 |
High density integrated circuit package architecture |
Apr. 18, 2006 |
| 7030489 |
Multi-chip module having bonding wires and method of fabricating the same |
Apr. 18, 2006 |
| 7030501 |
Semiconductor device and switching element |
Apr. 18, 2006 |
| 7026708 |
Low profile chip scale stacking system and method |
Apr. 11, 2006 |
| 7026709 |
Stacked chip-packaging structure |
Apr. 11, 2006 |
| 7026718 |
Stacked multi-component integrated circuit microprocessor |
Apr. 11, 2006 |
| 7026719 |
Semiconductor package with a heat spreader |
Apr. 11, 2006 |
| 7021520 |
Stacked chip connection using stand off stitch bonding |
Apr. 4, 2006 |
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