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Class Information
Number: 257/777
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Chip mounted on chip
Description: Subject matter wherein a semiconductor substrate of an active solid-state device is electrically connected to, and positioned on, another semiconductor substrate.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459777 |
Semiconductor package containing multi-layered semiconductor chips |
Dec. 2, 2008 |
| 7459776 |
Stacked die assembly having semiconductor die projecting beyond support |
Dec. 2, 2008 |
| 7459774 |
Stacked chip package using photosensitive polymer and manufacturing method thereof |
Dec. 2, 2008 |
| 7459773 |
Stackable ball grid array |
Dec. 2, 2008 |
| 7456495 |
Semiconductor module with a semiconductor stack, and methods for its production |
Nov. 25, 2008 |
| 7453159 |
Semiconductor chip having bond pads |
Nov. 18, 2008 |
| 7453154 |
Carbon nanotube via interconnect |
Nov. 18, 2008 |
| 7453153 |
Circuit device |
Nov. 18, 2008 |
| 7453150 |
Three-dimensional face-to-face integration assembly |
Nov. 18, 2008 |
| 7453092 |
Light emitting device and light emitting element having predetermined optical form |
Nov. 18, 2008 |
| 7452786 |
Method for manufacturing thin film integrated circuit, and element substrate |
Nov. 18, 2008 |
| 7449787 |
Liquid crystal display |
Nov. 11, 2008 |
| 7446420 |
Through silicon via chip stack package capable of facilitating chip selection during device operation |
Nov. 4, 2008 |
| 7446419 |
Semiconductor chip assembly with welded metal pillar of stacked metal balls |
Nov. 4, 2008 |
| 7446404 |
Three-dimensional package and method of making the same |
Nov. 4, 2008 |
| 7443037 |
Stacked integrated circuit package system with connection protection |
Oct. 28, 2008 |
| 7443036 |
Manufacturing method of semiconductor device |
Oct. 28, 2008 |
| 7443025 |
Thermally improved placement of power-dissipating components onto a circuit board |
Oct. 28, 2008 |
| 7439487 |
Optical encoder apparatus for removable connection with a printed circuit board and methods of assembling optical encoder apparatus. |
Oct. 21, 2008 |
| 7436071 |
Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
Oct. 14, 2008 |
| 7436070 |
Semiconductor device |
Oct. 14, 2008 |
| 7436053 |
Optical device and method for fabricating the same |
Oct. 14, 2008 |
| 7435626 |
Rearrangement sheet, semiconductor device and method of manufacturing thereof |
Oct. 14, 2008 |
| 7432600 |
System having semiconductor component with multiple stacked dice |
Oct. 7, 2008 |
| 7432599 |
Memory module having interconnected and stacked integrated circuits |
Oct. 7, 2008 |
| 7432588 |
Semiconductor device and method of fabricating the same |
Oct. 7, 2008 |
| 7432587 |
Integrated device including connections on a separate wafer |
Oct. 7, 2008 |
| 7432586 |
Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages |
Oct. 7, 2008 |
| 7432583 |
Leadless leadframe package substitute and stack package |
Oct. 7, 2008 |
| 7432127 |
Chip package and package process thereof |
Oct. 7, 2008 |
| 7429798 |
Integrated circuit package-in-package system |
Sep. 30, 2008 |
| 7429782 |
Semiconductor stack block comprising semiconductor chips and methods for producing the same |
Sep. 30, 2008 |
| 7429781 |
Memory package |
Sep. 30, 2008 |
| 7427810 |
Semiconductor device including semiconductor element mounted on another semiconductor element |
Sep. 23, 2008 |
| 7427517 |
Stacking apparatus and method for stacking integrated circuit elements |
Sep. 23, 2008 |
| 7425758 |
Metal core foldover package structures |
Sep. 16, 2008 |
| 7423335 |
Sensor module package structure and method of the same |
Sep. 9, 2008 |
| 7420817 |
MEMS device seal using liquid crystal polymer |
Sep. 2, 2008 |
| 7420281 |
Stacked chip semiconductor device |
Sep. 2, 2008 |
| 7420269 |
Stacked integrated circuit package-in-package system |
Sep. 2, 2008 |
| 7420129 |
Semiconductor package including a semiconductor device, and method of manufacturing the same |
Sep. 2, 2008 |
| 7417322 |
Multi-chip module with embedded package and method for manufacturing the same |
Aug. 26, 2008 |
| 7417293 |
Image sensor packaging structure |
Aug. 26, 2008 |
| 7413928 |
Die-wafer package and method of fabricating same |
Aug. 19, 2008 |
| 7411293 |
Flash memory card |
Aug. 12, 2008 |
| 7411292 |
Flash memory card |
Aug. 12, 2008 |
| 7411285 |
Low profile stacked semiconductor chip package |
Aug. 12, 2008 |
| 7408262 |
Semiconductor integrated circuit device |
Aug. 5, 2008 |
| 7408260 |
Microelectronic assemblies having compliant layers |
Aug. 5, 2008 |
| 7408255 |
Assembly for stacked BGA packages |
Aug. 5, 2008 |
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