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Class Information
Number: 257/777
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Chip mounted on chip
Description: Subject matter wherein a semiconductor substrate of an active solid-state device is electrically connected to, and positioned on, another semiconductor substrate.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619316 |
Semiconductor package and method for manufacturing the same |
Nov. 17, 2009 |
| 7619315 |
Stack type semiconductor chip package having different type of chips and fabrication method thereof |
Nov. 17, 2009 |
| 7619314 |
Integrated circuit package system including die stacking |
Nov. 17, 2009 |
| 7619313 |
Multi-chip module and methods |
Nov. 17, 2009 |
| 7619312 |
Method and apparatus for precisely aligning integrated circuit chips |
Nov. 17, 2009 |
| 7619303 |
Integrated circuit package |
Nov. 17, 2009 |
| 7619282 |
Hybrid circuit and electronic device using same |
Nov. 17, 2009 |
| 7615871 |
Method and apparatus for attaching microelectronic substrates and support members |
Nov. 10, 2009 |
| 7615870 |
Semiconductor device, manufacturing method thereof, and connection method of circuit board |
Nov. 10, 2009 |
| 7615869 |
Memory module with stacked semiconductor devices |
Nov. 10, 2009 |
| 7615856 |
Integrated antenna type circuit apparatus |
Nov. 10, 2009 |
| 7615853 |
Chip-stacked package structure having leadframe with multi-piece bus bar |
Nov. 10, 2009 |
| 7612444 |
Semiconductor package with flow controller |
Nov. 3, 2009 |
| 7608925 |
Relay board with bonding pads connected by wirings |
Oct. 27, 2009 |
| 7608924 |
Liquid cooled power electronic circuit comprising stacked direct die cooled packages |
Oct. 27, 2009 |
| 7608921 |
Multi-layer semiconductor package |
Oct. 27, 2009 |
| 7608920 |
Memory card and method for devising |
Oct. 27, 2009 |
| 7608919 |
Interconnect packaging systems |
Oct. 27, 2009 |
| 7608918 |
Semiconductor device |
Oct. 27, 2009 |
| 7605479 |
Stacked chip assembly with encapsulant layer |
Oct. 20, 2009 |
| 7605478 |
Semiconductor package and method of manufacturing the same |
Oct. 20, 2009 |
| 7605477 |
Stacked integrated circuit assembly |
Oct. 20, 2009 |
| 7605476 |
Stacked die semiconductor package |
Oct. 20, 2009 |
| 7605459 |
Coreless substrate and manufacturing thereof |
Oct. 20, 2009 |
| 7605457 |
Semiconductor device and method of manufacturing the same |
Oct. 20, 2009 |
| 7605454 |
Memory card and method for devising |
Oct. 20, 2009 |
| 7604152 |
Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same |
Oct. 20, 2009 |
| 7602070 |
Room temperature metal direct bonding |
Oct. 13, 2009 |
| 7602066 |
Method of filling structures for forming via-first dual damascene interconnects |
Oct. 13, 2009 |
| 7602028 |
NAND flash memory devices having 3-dimensionally arranged memory cells and methods of fabricating the same |
Oct. 13, 2009 |
| 7601561 |
Heat-radiating tape carrier package and method for manufacturing the same |
Oct. 13, 2009 |
| 7598619 |
Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
Oct. 6, 2009 |
| 7598618 |
Semiconductor device |
Oct. 6, 2009 |
| 7598617 |
Stack package utilizing through vias and re-distribution lines |
Oct. 6, 2009 |
| 7598607 |
Semiconductor packages with enhanced joint reliability and methods of fabricating the same |
Oct. 6, 2009 |
| 7598606 |
Integrated circuit package system with die and package combination |
Oct. 6, 2009 |
| 7598605 |
Semiconductor device having capacitive insulation means and communication terminal using the device |
Oct. 6, 2009 |
| 7598604 |
Low profile semiconductor package |
Oct. 6, 2009 |
| 7598123 |
Semiconductor component and method of manufacture |
Oct. 6, 2009 |
| 7595559 |
Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip |
Sep. 29, 2009 |
| 7595552 |
Stacked semiconductor package in which semiconductor packages are connected using a connector |
Sep. 29, 2009 |
| 7595551 |
Semiconductor package for a large die |
Sep. 29, 2009 |
| 7595468 |
Passive thermal solution for hand-held devices |
Sep. 29, 2009 |
| 7592707 |
Method and apparatus for facilitating proximity communication and power delivery |
Sep. 22, 2009 |
| 7592706 |
Multi-layer circuit board with fine pitches and fabricating method thereof |
Sep. 22, 2009 |
| 7592700 |
Semiconductor chip and method of manufacturing semiconductor chip |
Sep. 22, 2009 |
| 7592692 |
Semiconductor device with a dummy electrode |
Sep. 22, 2009 |
| 7592691 |
High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies |
Sep. 22, 2009 |
| 7592690 |
Semiconductor device including semiconductor elements mounted on base plate |
Sep. 22, 2009 |
| 7589410 |
Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package |
Sep. 15, 2009 |
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