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Browse by Category: Main > Physics
Class Information
Number: 257/777
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Chip mounted on chip
Description: Subject matter wherein a semiconductor substrate of an active solid-state device is electrically connected to, and positioned on, another semiconductor substrate.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710859 Method for testing multi-chip stacked packages Apr. 29, 2014
8710677 Multi-chip package with a supporting member and method of manufacturing the same Apr. 29, 2014
8710676 Stacked structure and stacked method for three-dimensional chip Apr. 29, 2014
8710675 Integrated circuit package system with bonding lands Apr. 29, 2014
8710655 Die packages and systems having the die packages Apr. 29, 2014
8710654 Semiconductor device and manufacturing method thereof Apr. 29, 2014
8710653 Chip on chip semiconductor device including an underfill layer having a resin containing an amine-based curing agent Apr. 29, 2014
8710641 Combination for composite layered chip package Apr. 29, 2014
8710639 Semiconductor element-embedded wiring substrate Apr. 29, 2014
8710591 Semiconductor chip, stack module, and memory card Apr. 29, 2014
8709938 3D IC method and device Apr. 29, 2014
8704384 Stacked die assembly Apr. 22, 2014
8704381 Very extremely thin semiconductor package Apr. 22, 2014
8704380 Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods Apr. 22, 2014
8704379 Semiconductor die mount by conformal die coating Apr. 22, 2014
8704378 Semiconductor device Apr. 22, 2014
8704350 Stacked wafer level package and method of manufacturing the same Apr. 22, 2014
8703541 Electronic system with expansion feature Apr. 22, 2014
8703537 System and method to manufacture an implantable electrode Apr. 22, 2014
8692388 Integrated circuit package system with waferscale spacer Apr. 8, 2014
8692387 Stacked die semiconductor package Apr. 8, 2014
8692386 Semiconductor device, method of manufacturing semiconductor device, and electronic device Apr. 8, 2014
8692384 Semiconductor device with through silicon via and alignment mark Apr. 8, 2014
8692134 Brace for long wire bond Apr. 8, 2014
8691707 Voltage switchable dielectric for die-level electrostatic discharge (ESD) protection Apr. 8, 2014
8687370 Housing for a chip arrangement and a method for forming a housing Apr. 1, 2014
8686572 Apparatus for stacking integrated circuits Apr. 1, 2014
8686571 Bonding layer structure and method for wafer to wafer bonding Apr. 1, 2014
8686570 Multi-dimensional integrated circuit structures and methods of forming the same Apr. 1, 2014
8686569 Die arrangement and method of forming a die arrangement Apr. 1, 2014
8686565 Stacked chip assembly having vertical vias Apr. 1, 2014
8686551 Substrate for a microelectronic package and method of fabricating thereof Apr. 1, 2014
8686549 Reconfigurable elements Apr. 1, 2014
8686547 Stack die structure for stress reduction and facilitation of electromagnetic shielding Apr. 1, 2014
8686537 Apparatus and methods for reducing impact of high RF loss plating Apr. 1, 2014
8686475 Reconfigurable elements Apr. 1, 2014
8686428 Semiconductor device and structure Apr. 1, 2014
8685797 Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof Apr. 1, 2014
8681509 Printed circuit board Mar. 25, 2014
8680688 Stack package having flexible conductors Mar. 25, 2014
8680687 Electrical interconnect for die stacked in zig-zag configuration Mar. 25, 2014
8680686 Method and system for thin multi chip stack package with film on wire and copper wire Mar. 25, 2014
8680684 Stackable microelectronic package structures Mar. 25, 2014
8680677 Carbon nanotube-based conductive connections for integrated circuit devices Mar. 25, 2014
8680652 Stack package Mar. 25, 2014
8680605 Stacked memory devices and method of manufacturing the same Mar. 25, 2014
8680582 Circuit and method for interconnecting stacked integrated circuit dies Mar. 25, 2014
8679896 DC/DC converter power module package incorporating a stacked controller and construction methodology Mar. 25, 2014
8674520 Semiconductor device, method for manufacturing the same, and power supply unit Mar. 18, 2014
8674518 Chip package and method for forming the same Mar. 18, 2014











 
 
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