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Browse by Category: Main > Physics
Class Information
Number: 257/777
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Chip mounted on chip
Description: Subject matter wherein a semiconductor substrate of an active solid-state device is electrically connected to, and positioned on, another semiconductor substrate.


Patents under this class:

Patent Number Title Of Patent Date Issued
7459777 Semiconductor package containing multi-layered semiconductor chips Dec. 2, 2008
7459776 Stacked die assembly having semiconductor die projecting beyond support Dec. 2, 2008
7459774 Stacked chip package using photosensitive polymer and manufacturing method thereof Dec. 2, 2008
7459773 Stackable ball grid array Dec. 2, 2008
7456495 Semiconductor module with a semiconductor stack, and methods for its production Nov. 25, 2008
7453159 Semiconductor chip having bond pads Nov. 18, 2008
7453154 Carbon nanotube via interconnect Nov. 18, 2008
7453153 Circuit device Nov. 18, 2008
7453150 Three-dimensional face-to-face integration assembly Nov. 18, 2008
7453092 Light emitting device and light emitting element having predetermined optical form Nov. 18, 2008
7452786 Method for manufacturing thin film integrated circuit, and element substrate Nov. 18, 2008
7449787 Liquid crystal display Nov. 11, 2008
7446420 Through silicon via chip stack package capable of facilitating chip selection during device operation Nov. 4, 2008
7446419 Semiconductor chip assembly with welded metal pillar of stacked metal balls Nov. 4, 2008
7446404 Three-dimensional package and method of making the same Nov. 4, 2008
7443037 Stacked integrated circuit package system with connection protection Oct. 28, 2008
7443036 Manufacturing method of semiconductor device Oct. 28, 2008
7443025 Thermally improved placement of power-dissipating components onto a circuit board Oct. 28, 2008
7439487 Optical encoder apparatus for removable connection with a printed circuit board and methods of assembling optical encoder apparatus. Oct. 21, 2008
7436071 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board Oct. 14, 2008
7436070 Semiconductor device Oct. 14, 2008
7436053 Optical device and method for fabricating the same Oct. 14, 2008
7435626 Rearrangement sheet, semiconductor device and method of manufacturing thereof Oct. 14, 2008
7432600 System having semiconductor component with multiple stacked dice Oct. 7, 2008
7432599 Memory module having interconnected and stacked integrated circuits Oct. 7, 2008
7432588 Semiconductor device and method of fabricating the same Oct. 7, 2008
7432587 Integrated device including connections on a separate wafer Oct. 7, 2008
7432586 Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages Oct. 7, 2008
7432583 Leadless leadframe package substitute and stack package Oct. 7, 2008
7432127 Chip package and package process thereof Oct. 7, 2008
7429798 Integrated circuit package-in-package system Sep. 30, 2008
7429782 Semiconductor stack block comprising semiconductor chips and methods for producing the same Sep. 30, 2008
7429781 Memory package Sep. 30, 2008
7427810 Semiconductor device including semiconductor element mounted on another semiconductor element Sep. 23, 2008
7427517 Stacking apparatus and method for stacking integrated circuit elements Sep. 23, 2008
7425758 Metal core foldover package structures Sep. 16, 2008
7423335 Sensor module package structure and method of the same Sep. 9, 2008
7420817 MEMS device seal using liquid crystal polymer Sep. 2, 2008
7420281 Stacked chip semiconductor device Sep. 2, 2008
7420269 Stacked integrated circuit package-in-package system Sep. 2, 2008
7420129 Semiconductor package including a semiconductor device, and method of manufacturing the same Sep. 2, 2008
7417322 Multi-chip module with embedded package and method for manufacturing the same Aug. 26, 2008
7417293 Image sensor packaging structure Aug. 26, 2008
7413928 Die-wafer package and method of fabricating same Aug. 19, 2008
7411293 Flash memory card Aug. 12, 2008
7411292 Flash memory card Aug. 12, 2008
7411285 Low profile stacked semiconductor chip package Aug. 12, 2008
7408262 Semiconductor integrated circuit device Aug. 5, 2008
7408260 Microelectronic assemblies having compliant layers Aug. 5, 2008
7408255 Assembly for stacked BGA packages Aug. 5, 2008



 
 
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