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Class Information
Number: 257/777
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Chip mounted on chip
Description: Subject matter wherein a semiconductor substrate of an active solid-state device is electrically connected to, and positioned on, another semiconductor substrate.


Patents under this class:

Patent Number Title Of Patent Date Issued
7619316 Semiconductor package and method for manufacturing the same Nov. 17, 2009
7619315 Stack type semiconductor chip package having different type of chips and fabrication method thereof Nov. 17, 2009
7619314 Integrated circuit package system including die stacking Nov. 17, 2009
7619313 Multi-chip module and methods Nov. 17, 2009
7619312 Method and apparatus for precisely aligning integrated circuit chips Nov. 17, 2009
7619303 Integrated circuit package Nov. 17, 2009
7619282 Hybrid circuit and electronic device using same Nov. 17, 2009
7615871 Method and apparatus for attaching microelectronic substrates and support members Nov. 10, 2009
7615870 Semiconductor device, manufacturing method thereof, and connection method of circuit board Nov. 10, 2009
7615869 Memory module with stacked semiconductor devices Nov. 10, 2009
7615856 Integrated antenna type circuit apparatus Nov. 10, 2009
7615853 Chip-stacked package structure having leadframe with multi-piece bus bar Nov. 10, 2009
7612444 Semiconductor package with flow controller Nov. 3, 2009
7608925 Relay board with bonding pads connected by wirings Oct. 27, 2009
7608924 Liquid cooled power electronic circuit comprising stacked direct die cooled packages Oct. 27, 2009
7608921 Multi-layer semiconductor package Oct. 27, 2009
7608920 Memory card and method for devising Oct. 27, 2009
7608919 Interconnect packaging systems Oct. 27, 2009
7608918 Semiconductor device Oct. 27, 2009
7605479 Stacked chip assembly with encapsulant layer Oct. 20, 2009
7605478 Semiconductor package and method of manufacturing the same Oct. 20, 2009
7605477 Stacked integrated circuit assembly Oct. 20, 2009
7605476 Stacked die semiconductor package Oct. 20, 2009
7605459 Coreless substrate and manufacturing thereof Oct. 20, 2009
7605457 Semiconductor device and method of manufacturing the same Oct. 20, 2009
7605454 Memory card and method for devising Oct. 20, 2009
7604152 Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same Oct. 20, 2009
7602070 Room temperature metal direct bonding Oct. 13, 2009
7602066 Method of filling structures for forming via-first dual damascene interconnects Oct. 13, 2009
7602028 NAND flash memory devices having 3-dimensionally arranged memory cells and methods of fabricating the same Oct. 13, 2009
7601561 Heat-radiating tape carrier package and method for manufacturing the same Oct. 13, 2009
7598619 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board Oct. 6, 2009
7598618 Semiconductor device Oct. 6, 2009
7598617 Stack package utilizing through vias and re-distribution lines Oct. 6, 2009
7598607 Semiconductor packages with enhanced joint reliability and methods of fabricating the same Oct. 6, 2009
7598606 Integrated circuit package system with die and package combination Oct. 6, 2009
7598605 Semiconductor device having capacitive insulation means and communication terminal using the device Oct. 6, 2009
7598604 Low profile semiconductor package Oct. 6, 2009
7598123 Semiconductor component and method of manufacture Oct. 6, 2009
7595559 Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip Sep. 29, 2009
7595552 Stacked semiconductor package in which semiconductor packages are connected using a connector Sep. 29, 2009
7595551 Semiconductor package for a large die Sep. 29, 2009
7595468 Passive thermal solution for hand-held devices Sep. 29, 2009
7592707 Method and apparatus for facilitating proximity communication and power delivery Sep. 22, 2009
7592706 Multi-layer circuit board with fine pitches and fabricating method thereof Sep. 22, 2009
7592700 Semiconductor chip and method of manufacturing semiconductor chip Sep. 22, 2009
7592692 Semiconductor device with a dummy electrode Sep. 22, 2009
7592691 High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies Sep. 22, 2009
7592690 Semiconductor device including semiconductor elements mounted on base plate Sep. 22, 2009
7589410 Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package Sep. 15, 2009



 
 
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