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Class Information
Number: 257/776
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Cross-over arrangement, component or structure
Description: Subject matter wherein means are provided for electrically insulating electrical contact elements or leads which cross each other to do so without a short circuit therebetween.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6140704 |
Integrated circuit memory devices with improved twisted bit-line structures |
Oct. 31, 2000 |
| 6140701 |
Suppression of hillock formation in thin aluminum films |
Oct. 31, 2000 |
| 6137182 |
Method of reducing via and contact dimensions beyond photolithography equipment limits |
Oct. 24, 2000 |
| 6133144 |
Self aligned dual damascene process and structure with low parasitic capacitance |
Oct. 17, 2000 |
| 6117722 |
SRAM layout for relaxing mechanical stress in shallow trench isolation technology and method of manufacture thereof |
Sep. 12, 2000 |
| RE36837 |
Structure of contact between wiring layers in semiconductor integrated circuit device |
Aug. 29, 2000 |
| 6097098 |
Die interconnections using intermediate connection elements secured to the die face |
Aug. 1, 2000 |
| 6097103 |
Semiconductor device having an improved interconnection and method for fabricating the same |
Aug. 1, 2000 |
| 6097073 |
Triangular semiconductor or gate |
Aug. 1, 2000 |
| 6087721 |
Semiconductor device with a high-frequency bipolar transistor on an insulating substrate |
Jul. 11, 2000 |
| 6084307 |
Bi-level digit line architecture for high density DRAMS |
Jul. 4, 2000 |
| 6084303 |
Integrated circuit comprising connection pads emerging on one surface |
Jul. 4, 2000 |
| 6084306 |
Bridging method of interconnects for integrated circuit packages |
Jul. 4, 2000 |
| 6076726 |
Pad-on-via assembly technique |
Jun. 20, 2000 |
| 6078100 |
Utilization of die repattern layers for die internal connections |
Jun. 20, 2000 |
| 6072213 |
Transistor having an etchant-scalable channel length and method of making same |
Jun. 6, 2000 |
| 6051889 |
Semiconductor device having a flip-chip structure |
Apr. 18, 2000 |
| 6049120 |
Thermal-stress-resistant semiconductor sensor |
Apr. 11, 2000 |
| 6046505 |
Method for forming a contact during the formation of a semiconductor device |
Apr. 4, 2000 |
| 6043562 |
Digit line architecture for dynamic memory |
Mar. 28, 2000 |
| 6040621 |
Semiconductor device and wiring body |
Mar. 21, 2000 |
| 6037665 |
Mounting assembly of integrated circuit device and method for production thereof |
Mar. 14, 2000 |
| 6034436 |
Semiconductor device having an improved through-hole structure |
Mar. 7, 2000 |
| 6031289 |
Integrated circuit which uses a recessed local conductor for producing staggered interconnect lines |
Feb. 29, 2000 |
| 6011309 |
Wiring structure of thin film transistor array and method of manufacturing the same |
Jan. 4, 2000 |
| 6005265 |
Semiconductor integrated circuit device having wiring layout for small amplitude signals |
Dec. 21, 1999 |
| 5998872 |
Semiconductor device for avoiding cracks in insulating spaces between metal wiring patterns |
Dec. 7, 1999 |
| 5994781 |
Semiconductor chip package with dual layer terminal and lead structure |
Nov. 30, 1999 |
| 5990561 |
Tungsten plugs for integrated circuits and methods for making same |
Nov. 23, 1999 |
| 5982039 |
Completely buried contact holes |
Nov. 9, 1999 |
| 5982040 |
Semiconductor device and method for manufacturing the same |
Nov. 9, 1999 |
| 5977639 |
Metal staples to prevent interlayer delamination |
Nov. 2, 1999 |
| 5973376 |
Architecture having diamond shaped or parallelogram shaped cells |
Oct. 26, 1999 |
| 5955788 |
Semiconductor device having multilevel wiring with improved planarity |
Sep. 21, 1999 |
| 5955778 |
Lead frame with notched lead ends |
Sep. 21, 1999 |
| 5955704 |
Optimal PWA high density routing to minimize EMI substrate coupling in a computer system |
Sep. 21, 1999 |
| 5949144 |
Pre-bond cavity air bridge |
Sep. 7, 1999 |
| 5945740 |
Semiconductor device |
Aug. 31, 1999 |
| 5945709 |
Integrated circuit die having thick bus to reduce distributed resistance |
Aug. 31, 1999 |
| 5939791 |
Electrically conductive interconnects for integrated circuits |
Aug. 17, 1999 |
| 5936289 |
Semiconductor device |
Aug. 10, 1999 |
| 5929468 |
Compound semiconductor device |
Jul. 27, 1999 |
| 5929528 |
Semiconductor device and method of manufacturing the same |
Jul. 27, 1999 |
| 5905307 |
Semiconductor device incorporating multilayer wiring structure |
May. 18, 1999 |
| 5903057 |
Semiconductor device that compensates for package induced delay |
May. 11, 1999 |
| 5894170 |
Wiring layer in semiconductor device |
Apr. 13, 1999 |
| 5892276 |
Semiconductor integrated circuit |
Apr. 6, 1999 |
| 5889329 |
Tri-directional interconnect architecture for SRAM |
Mar. 30, 1999 |
| 5886410 |
Interconnect structure with hard mask and low dielectric constant materials |
Mar. 23, 1999 |
| 5883416 |
Gate-contact structure to prevent contact metal penetration through gate layer without affecting breakdown voltage |
Mar. 16, 1999 |
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