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Class Information
Number: 257/776
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Cross-over arrangement, component or structure
Description: Subject matter wherein means are provided for electrically insulating electrical contact elements or leads which cross each other to do so without a short circuit therebetween.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6617692 |
Apparatus for implementing selected functionality on an integrated circuit device |
Sep. 9, 2003 |
| 6614049 |
System LSI chip having a logic part and a memory part |
Sep. 2, 2003 |
| 6611062 |
Twisted wordline strapping arrangement |
Aug. 26, 2003 |
| 6611039 |
Vertically oriented nano-fuse and nano-resistor circuit elements |
Aug. 26, 2003 |
| 6608386 |
Sub-nanoscale electronic devices and processes |
Aug. 19, 2003 |
| 6597068 |
Encapsulated metal structures for semiconductor devices and MIM capacitors including the same |
Jul. 22, 2003 |
| 6594173 |
Method for digit line architecture for dynamic memory |
Jul. 15, 2003 |
| 6586841 |
Mechanical landing pad formed on the underside of a MEMS device |
Jul. 1, 2003 |
| 6579738 |
Method of alignment for buried structures formed by surface transformation of empty spaces in solid state materials |
Jun. 17, 2003 |
| 6580172 |
Lithographic template and method of formation and use |
Jun. 17, 2003 |
| 6570258 |
Method for reducing capacitive coupling between conductive lines |
May. 27, 2003 |
| 6559544 |
Programmable interconnect for semiconductor devices |
May. 6, 2003 |
| 6555922 |
IC bonding pad combined with mark or monitor |
Apr. 29, 2003 |
| 6548907 |
Semiconductor device having a matrix array of contacts and a fabrication process thereof |
Apr. 15, 2003 |
| 6548839 |
LDMOS transistor structure using a drain ring with a checkerboard pattern for improved hot carrier reliability |
Apr. 15, 2003 |
| 6545348 |
Package for a semiconductor device comprising a plurality of interconnection patterns around a semiconductor chip |
Apr. 8, 2003 |
| 6541869 |
Scalable data processing apparatus |
Apr. 1, 2003 |
| 6541868 |
Interconnecting conductive links |
Apr. 1, 2003 |
| 6541867 |
Microelectronic connector with planar elastomer sockets |
Apr. 1, 2003 |
| 6541853 |
Electrically conductive path through a dielectric material |
Apr. 1, 2003 |
| 6541850 |
Utilization of die active surfaces for laterally extending die internal and external connections |
Apr. 1, 2003 |
| 6538912 |
Semiconductor device |
Mar. 25, 2003 |
| 6528871 |
Structure and method for mounting semiconductor devices |
Mar. 4, 2003 |
| 6525427 |
BEOL decoupling capacitor |
Feb. 25, 2003 |
| 6522011 |
Low capacitance wiring layout and method for making same |
Feb. 18, 2003 |
| 6521970 |
Chip scale package with compliant leads |
Feb. 18, 2003 |
| 6515372 |
Wiring board and its production method, semiconductor device and its production method, and electronic apparatus |
Feb. 4, 2003 |
| 6507121 |
Array structure of solder balls able to control collapse |
Jan. 14, 2003 |
| 6504255 |
Digit line architecture for dynamic memory |
Jan. 7, 2003 |
| 6504246 |
Integrated circuit having a balanced twist for differential signal lines |
Jan. 7, 2003 |
| 6504244 |
Semiconductor device and semiconductor module using the same |
Jan. 7, 2003 |
| 6500706 |
Bit-line interconnection scheme for eliminating coupling noise in stack DRAM cell with capacitor under bit-line (CUB) in stand-alone or embedded DRAM |
Dec. 31, 2002 |
| 6486412 |
Wiring board, method for producing same, display device, and electronic device |
Nov. 26, 2002 |
| 6483714 |
Multilayered wiring board |
Nov. 19, 2002 |
| 6483368 |
Addressable diode isolated thin film cell array |
Nov. 19, 2002 |
| 6476506 |
Packaged semiconductor with multiple rows of bond pads and method therefor |
Nov. 5, 2002 |
| 6472763 |
Semiconductor device with bumps for pads |
Oct. 29, 2002 |
| 6472764 |
Method and apparatus for implementing selected functionality on an integrated circuit device |
Oct. 29, 2002 |
| 6465891 |
Integrated-circuit package with a quick-to-count finger layout design on substrate |
Oct. 15, 2002 |
| 6459136 |
Single metal programmability in a customizable integrated circuit device |
Oct. 1, 2002 |
| 6458623 |
Conductive adhesive interconnection with insulating polymer carrier |
Oct. 1, 2002 |
| 6456518 |
Bi-level digit line architecture for high density drams |
Sep. 24, 2002 |
| 6452260 |
Electrical interface to integrated circuit device having high density I/O count |
Sep. 17, 2002 |
| 6448663 |
Semiconductor device, semiconductor device mounting structure, liquid crystal device, and electronic apparatus |
Sep. 10, 2002 |
| 6441501 |
Wire-bonded semiconductor device with improved wire arrangement scheme for minimizing abnormal wire sweep |
Aug. 27, 2002 |
| 6437640 |
Addressable diode isolated thin film array |
Aug. 20, 2002 |
| 6433438 |
Semiconductor integrated circuit device |
Aug. 13, 2002 |
| 6433437 |
Manufacturing process for semiconductor device, photomask, and manufacturing apparatus for semiconductor device |
Aug. 13, 2002 |
| 6429529 |
Bi-level digit line architecture for high density drams |
Aug. 6, 2002 |
| 6427324 |
Inherently robust repair process for thin film circuitry using UV laser |
Aug. 6, 2002 |
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