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Class Information
Number: 257/776
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Cross-over arrangement, component or structure
Description: Subject matter wherein means are provided for electrically insulating electrical contact elements or leads which cross each other to do so without a short circuit therebetween.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6936916 |
Microelectronic assemblies and electronic devices including connection structures with multiple elongated members |
Aug. 30, 2005 |
| 6933599 |
Electromagnetic noise shielding in semiconductor packages using caged interconnect structures |
Aug. 23, 2005 |
| 6930377 |
Using adhesive materials as insulation coatings for leadless lead frame semiconductor packages |
Aug. 16, 2005 |
| 6921575 |
Carbon nanotube structures, carbon nanotube devices using the same and method for manufacturing carbon nanotube structures |
Jul. 26, 2005 |
| 6919637 |
Interconnect structure for an integrated circuit and method of fabrication |
Jul. 19, 2005 |
| 6919635 |
High density microvia substrate with high wireability |
Jul. 19, 2005 |
| 6919625 |
Surface mount multichip devices |
Jul. 19, 2005 |
| 6919644 |
Semiconductor device manufacturing method and semiconductor device manufactured thereby |
Jul. 19, 2005 |
| 6911721 |
Semiconductor device, method for manufacturing semiconductor device and electronic equipment |
Jun. 28, 2005 |
| 6909127 |
Low loss interconnect structure for use in microelectronic circuits |
Jun. 21, 2005 |
| 6909187 |
Conductive wiring layer structure |
Jun. 21, 2005 |
| 6909189 |
Semiconductor device with dummy structure |
Jun. 21, 2005 |
| 6900540 |
Simulating diagonal wiring directions using Manhattan directional wires |
May. 31, 2005 |
| 6897561 |
Semiconductor power device having a diamond shaped metal interconnect scheme |
May. 24, 2005 |
| 6897479 |
ITO film contact structure, TFT substrate and manufacture thereof |
May. 24, 2005 |
| 6897569 |
Apparatus for implementing selected functionality on an integrated circuit device in an electronic device |
May. 24, 2005 |
| 6894376 |
Leadless microelectronic package and a method to maximize the die size in the package |
May. 17, 2005 |
| 6894394 |
Semiconductor device, circuit board, electronic apparatus, and method for manufacturing semiconductor device |
May. 17, 2005 |
| 6888250 |
Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium |
May. 3, 2005 |
| 6885046 |
Semiconductor integrated circuit configured to supply sufficient internal current |
Apr. 26, 2005 |
| 6885068 |
Storage element and SRAM cell structures using vertical FETs controlled by adjacent junction bias through shallow trench isolation |
Apr. 26, 2005 |
| 6876085 |
Signal layer interconnect using tapered traces |
Apr. 5, 2005 |
| 6873055 |
Integrated circuit arrangement with field-shaping electrical conductor |
Mar. 29, 2005 |
| 6870255 |
Integrated circuit wiring architectures to support independent designs |
Mar. 22, 2005 |
| 6864171 |
Via density rules |
Mar. 8, 2005 |
| 6861758 |
Structure and manufacturing process of localized shunt to reduce electromigration failure of copper dual damascene process |
Mar. 1, 2005 |
| 6858945 |
Multi-concentric pad arrangements for integrated circuit pads |
Feb. 22, 2005 |
| 6858935 |
Simulating euclidean wiring directions using manhattan and diagonal directional wires |
Feb. 22, 2005 |
| 6858928 |
Multi-directional wiring on a single metal layer |
Feb. 22, 2005 |
| 6853080 |
Electronic device and method of manufacturing the same, and electronic instrument |
Feb. 8, 2005 |
| 6844629 |
Display panel with bypassing lines |
Jan. 18, 2005 |
| 6844214 |
Microelectromechanical system based sensors, sensor arrays, sensing systems, sensing methods and methods of fabrication |
Jan. 18, 2005 |
| 6844630 |
Semiconductor integrated circuit device and wiring arranging method thereof |
Jan. 18, 2005 |
| 6845028 |
Semiconductor memory device using open data line arrangement |
Jan. 18, 2005 |
| 6841847 |
3-D spiral stacked inductor on semiconductor material |
Jan. 11, 2005 |
| 6841408 |
Method of alignment for buried structures formed by surface transformation of empty spaces in solid state materials |
Jan. 11, 2005 |
| 6833622 |
Semiconductor topography having an inactive region formed from a dummy structure pattern |
Dec. 21, 2004 |
| 6833611 |
Semiconductor device |
Dec. 21, 2004 |
| 6822322 |
Substrate for mounting a semiconductor chip and method for manufacturing a semiconductor device |
Nov. 23, 2004 |
| 6822330 |
Semiconductor integrated circuit device with test element group circuit |
Nov. 23, 2004 |
| 6822316 |
Integrated circuit with improved interconnect structure and process for making same |
Nov. 23, 2004 |
| 6822335 |
Method for arranging wiring line including power reinforcing line and semiconductor device having power reinforcing line |
Nov. 23, 2004 |
| 6815826 |
Alignment for buried structures formed by surface transformation of empty spaces in solid state materials |
Nov. 9, 2004 |
| 6815820 |
Method for forming a semiconductor interconnect with multiple thickness |
Nov. 9, 2004 |
| 6812555 |
Memory card substrate with alternating contacts |
Nov. 2, 2004 |
| 6812575 |
Semiconductor device |
Nov. 2, 2004 |
| 6812576 |
Fanned out interconnect via structure for electronic package substrates |
Nov. 2, 2004 |
| 6803666 |
Semiconductor chip mounting substrate and semiconductor device using the same |
Oct. 12, 2004 |
| 6794724 |
Module for optical communications for converting light and differential signals |
Sep. 21, 2004 |
| 6787901 |
Stacked dies utilizing cross connection bonding wire |
Sep. 7, 2004 |
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