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Class Information
Number: 257/776
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Cross-over arrangement, component or structure
Description: Subject matter wherein means are provided for electrically insulating electrical contact elements or leads which cross each other to do so without a short circuit therebetween.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7180011 |
Device for minimizing differential pair length mismatch and impedance discontinuities in an integrated circuit package design |
Feb. 20, 2007 |
| 7180168 |
Stacked semiconductor chips |
Feb. 20, 2007 |
| 7166923 |
Semiconductor device, electro-optical unit, and electronic apparatus |
Jan. 23, 2007 |
| 7157789 |
Semiconductor device and method for manufacturing the same |
Jan. 2, 2007 |
| 7154188 |
Semiconductor chip, semiconductor device, circuit board, and electronic instrument |
Dec. 26, 2006 |
| 7151311 |
Mold resin-sealed power semiconductor device having insulating resin layer fixed on bottom surface of heat sink and metal layer on the resin layer |
Dec. 19, 2006 |
| 7148564 |
Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness |
Dec. 12, 2006 |
| 7145252 |
Configuration for testing the bonding positions of conductive drops and test method for using the same |
Dec. 5, 2006 |
| 7141821 |
Semiconductor device having an impurity gradient in the impurity regions and method of manufacture |
Nov. 28, 2006 |
| 7139993 |
Method and apparatus for routing differential signals across a semiconductor chip |
Nov. 21, 2006 |
| 7132736 |
Devices having compliant wafer-level packages with pillars and methods of fabrication |
Nov. 7, 2006 |
| 7126222 |
Semiconductor device |
Oct. 24, 2006 |
| 7126223 |
Semiconductor device formed with an air gap using etch back of inter layer dielectric (ILD) |
Oct. 24, 2006 |
| 7122901 |
Semiconductor device |
Oct. 17, 2006 |
| 7105923 |
Device and method for including passive components in a chip scale package |
Sep. 12, 2006 |
| 7105858 |
Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density |
Sep. 12, 2006 |
| 7098524 |
Electroplated wire layout for package sawing |
Aug. 29, 2006 |
| 7095621 |
Leadless leadframe electronic package and sensor module incorporating same |
Aug. 22, 2006 |
| 7091085 |
Reduced cell-to-cell shorting for memory arrays |
Aug. 15, 2006 |
| 7088002 |
Interconnect |
Aug. 8, 2006 |
| 7078812 |
Routing differential signal lines in a substrate |
Jul. 18, 2006 |
| 7078823 |
Semiconductor die configured for use with interposer substrates having reinforced interconnect slots |
Jul. 18, 2006 |
| 7071565 |
Patterning three dimensional structures |
Jul. 4, 2006 |
| 7067796 |
Integrated circuit for optical encoder |
Jun. 27, 2006 |
| 7049701 |
Semiconductor device using insulating film of low dielectric constant as interlayer insulating film |
May. 23, 2006 |
| 7049705 |
Chip structure |
May. 23, 2006 |
| 7042099 |
Semiconductor device containing a dummy wire |
May. 9, 2006 |
| 7034810 |
Liquid crystal display device |
Apr. 25, 2006 |
| 7034335 |
ITO film contact structure, TFT substrate and manufacture thereof |
Apr. 25, 2006 |
| 7030508 |
Substrate for semiconductor package and wire bonding method using thereof |
Apr. 18, 2006 |
| 7030466 |
Intermediate structure for making integrated circuit device and wafer |
Apr. 18, 2006 |
| 7023090 |
Bonding pad and via structure design |
Apr. 4, 2006 |
| 7015585 |
Packaged integrated circuit having wire bonds and method therefor |
Mar. 21, 2006 |
| 7002215 |
Floating entrance guard for preventing electrical short circuits |
Feb. 21, 2006 |
| 7002225 |
Compliant component for supporting electrical interface component |
Feb. 21, 2006 |
| 6998713 |
Wiring board and method for producing same |
Feb. 14, 2006 |
| 6998716 |
Diamond metal-filled patterns achieving low parasitic coupling capacitance |
Feb. 14, 2006 |
| 6982494 |
Semiconductor device with signal line having decreased characteristic impedance |
Jan. 3, 2006 |
| 6977441 |
Interconnect substrate and method of manufacture thereof, electronic component and method of manufacturing thereof, circuit board and electronic instrument |
Dec. 20, 2005 |
| 6977431 |
Stackable semiconductor package and manufacturing method thereof |
Dec. 20, 2005 |
| 6962844 |
Memory device having a semiconducting polymer film |
Nov. 8, 2005 |
| 6949837 |
Bonding pad arrangement method for semiconductor devices |
Sep. 27, 2005 |
| 6949839 |
Aligned buried structures formed by surface transformation of empty spaces in solid state materials |
Sep. 27, 2005 |
| 6949816 |
Semiconductor component having first surface area for electrically coupling to a semiconductor chip and second surface area for electrically coupling to a substrate, and method of manufacturin |
Sep. 27, 2005 |
| 6949835 |
Semiconductor device |
Sep. 27, 2005 |
| 6946692 |
Interconnection utilizing diagonal routing |
Sep. 20, 2005 |
| 6943453 |
Superconductor device and method of manufacturing the same |
Sep. 13, 2005 |
| 6943447 |
Thin film multi-layer wiring substrate having a coaxial wiring structure in at least one layer |
Sep. 13, 2005 |
| 6936916 |
Microelectronic assemblies and electronic devices including connection structures with multiple elongated members |
Aug. 30, 2005 |
| 6933599 |
Electromagnetic noise shielding in semiconductor packages using caged interconnect structures |
Aug. 23, 2005 |
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