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Class Information
Number: 257/776
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Cross-over arrangement, component or structure
Description: Subject matter wherein means are provided for electrically insulating electrical contact elements or leads which cross each other to do so without a short circuit therebetween.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

Patent Number Title Of Patent Date Issued
5945709 Integrated circuit die having thick bus to reduce distributed resistance Aug. 31, 1999
5939791 Electrically conductive interconnects for integrated circuits Aug. 17, 1999
5936289 Semiconductor device Aug. 10, 1999
5929468 Compound semiconductor device Jul. 27, 1999
5929528 Semiconductor device and method of manufacturing the same Jul. 27, 1999
5905307 Semiconductor device incorporating multilayer wiring structure May. 18, 1999
5903057 Semiconductor device that compensates for package induced delay May. 11, 1999
5894170 Wiring layer in semiconductor device Apr. 13, 1999
5892276 Semiconductor integrated circuit Apr. 6, 1999
5889329 Tri-directional interconnect architecture for SRAM Mar. 30, 1999
5886410 Interconnect structure with hard mask and low dielectric constant materials Mar. 23, 1999
5883416 Gate-contact structure to prevent contact metal penetration through gate layer without affecting breakdown voltage Mar. 16, 1999
5880528 Energy absorbing structures to prevent damage to an integrated circuit Mar. 9, 1999
5874778 Embedded power and ground plane structure Feb. 23, 1999
5869867 FET semiconductor integrated circuit device having a planar element structure Feb. 9, 1999
5866924 Method and apparatus for routing a clock tree in an integrated circuit package Feb. 2, 1999
5864181 Bi-level digit line architecture for high density DRAMs Jan. 26, 1999
5861676 Method of forming robust interconnect and contact structures in a semiconductor and/or integrated circuit Jan. 19, 1999
5838546 Mounting structure for a semiconductor circuit Nov. 17, 1998
5838072 Intrachip power distribution package and method for semiconductors having a supply node electrically interconnected with one or more intermediate nodes Nov. 17, 1998
5828121 Multi-level conduction structure for VLSI circuits Oct. 27, 1998
5821624 Semiconductor device assembly techniques using preformed planar structures Oct. 13, 1998
5818110 Integrated circuit chip wiring structure with crossover capability and method of manufacturing the same Oct. 6, 1998
5818111 Low capacitance interconnect structures in integrated circuits using a stack of low dielectric materials Oct. 6, 1998
5814884 Commonly housed diverse semiconductor die Sep. 29, 1998
5812031 Ring oscillator having logic gates interconnected by spiral signal lines Sep. 22, 1998
5811882 On-chip shielding coaxial conductors for mixed-signal IC Sep. 22, 1998
5804854 Memory cell array Sep. 8, 1998
5804871 Lead on chip semiconductor device having bus bars and crossing leads Sep. 8, 1998
5801394 Structure for wiring reliability evaluation test and semiconductor device having the same Sep. 1, 1998
5793099 Semiconductor device Aug. 11, 1998
5793114 Self-aligned method for forming contact with zero offset to gate Aug. 11, 1998
5789797 Semiconductor device that suppresses electromagnetic noise Aug. 4, 1998
5783864 Multilevel interconnect structure of an integrated circuit having air gaps and pillars separating levels of interconnect Jul. 21, 1998
5767546 Laternal power mosfet having metal strap layer to reduce distributed resistance Jun. 16, 1998
5764497 Circuit board connection method and connection structure Jun. 9, 1998
5761028 Transistor connection assembly having IGBT (X) cross ties Jun. 2, 1998
5757079 Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structure May. 26, 1998
5753970 System having semiconductor die mounted in die-receiving area having different shape than die May. 19, 1998
5751057 Lead on chip lead frame design without jumpover wiring May. 12, 1998
5748550 Multiple power line arrangement for a semiconductor memory device May. 5, 1998
5747867 Integrated circuit structure with interconnect formed along walls of silicon island May. 5, 1998
5736774 High voltage integrated circuit, and high voltage level shift unit used for the same Apr. 7, 1998
5734187 Memory cell design with vertically stacked crossovers Mar. 31, 1998
5731620 Semiconductor device with reduced parasitic substrate capacitance Mar. 24, 1998
5726499 Semiconductor device having a minute contact hole Mar. 10, 1998
5723910 Semiconductor device having a MOS structure Mar. 3, 1998
5723908 Multilayer wiring structure Mar. 3, 1998
5723906 High-density wirebond chip interconnect for multi-chip modules Mar. 3, 1998
5719449 Flip-chip integrated circuit with improved testability Feb. 17, 1998

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