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Class Information
Number: 257/776
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Cross-over arrangement, component or structure
Description: Subject matter wherein means are provided for electrically insulating electrical contact elements or leads which cross each other to do so without a short circuit therebetween.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5111271 |
Semiconductor device using standard cell system |
May. 5, 1992 |
| 5101262 |
Semiconductor memory device and method of manufacturing it |
Mar. 31, 1992 |
| 5084905 |
Thin film transistor panel and manufacturing method thereof |
Jan. 28, 1992 |
| 5075753 |
Semiconductor integrated circuit device |
Dec. 24, 1991 |
| 5049969 |
Customizable semiconductor devices |
Sep. 17, 1991 |
| 5034802 |
Mechanical simultaneous registration of multi-pin surface-mount components to sites on substrates |
Jul. 23, 1991 |
| 5023701 |
Gate array structure and process to allow optioning at second metal mask only |
Jun. 11, 1991 |
| 5019877 |
Field effect transistor |
May. 28, 1991 |
| 5014110 |
Wiring structures for semiconductor memory device |
May. 7, 1991 |
| 4993954 |
Device for interconnection between and integrated circuit and an electrical circuit |
Feb. 19, 1991 |
| 4990462 |
Method for coplanar integration of semiconductor ic devices |
Feb. 5, 1991 |
| 4984061 |
Semiconductor device in which wiring layer is formed below bonding pad |
Jan. 8, 1991 |
| 4984197 |
Semiconductor memory device having transfer gates coupled between bit line pairs and sense amplifier circuits |
Jan. 8, 1991 |
| 4974060 |
Semiconductor integrated circuit device and method of manufacturing the same |
Nov. 27, 1990 |
| 4972250 |
Protective coating useful as passivation layer for semiconductor devices |
Nov. 20, 1990 |
| 4970572 |
Semiconductor integrated circuit device of multilayer interconnection structure |
Nov. 13, 1990 |
| 4965646 |
Thin film transistor and crossover structure for liquid crystal displays |
Oct. 23, 1990 |
| 4960489 |
Method for self-aligned manufacture of contacts between interconnects contained in wiring levels arranged above one another in an integrated circuit |
Oct. 2, 1990 |
| 4947229 |
Semiconductor integrated circuit |
Aug. 7, 1990 |
| 4942453 |
IC package |
Jul. 17, 1990 |
| 4941031 |
Dynamic memory device with improved wiring layer layout |
Jul. 10, 1990 |
| 4939592 |
Contact photoelectric conversion device |
Jul. 3, 1990 |
| 4933743 |
High performance interconnect system for an integrated circuit |
Jun. 12, 1990 |
| 4926234 |
Semiconductor device operating in high frequency range |
May. 15, 1990 |
| 4924290 |
Semiconductor device having improved multilayered wirings |
May. 8, 1990 |
| 4924289 |
Air bridge wiring for semiconductor devices |
May. 8, 1990 |
| 4918504 |
Active matrix cell |
Apr. 17, 1990 |
| 4916520 |
Semiconductor device with airbridge interconnection |
Apr. 10, 1990 |
| 4914502 |
Laterally marching interconnecting lines in semiconductor intergrated circuits |
Apr. 3, 1990 |
| 4914056 |
Method of manufacturing a semiconductor device having tapered pillars |
Apr. 3, 1990 |
| 4908680 |
Semiconductor integrated circuit |
Mar. 13, 1990 |
| 4905068 |
Semiconductor device having interconnection layers of T-shape cross section |
Feb. 27, 1990 |
| 4885627 |
Method and structure for reducing resistance in integrated circuits |
Dec. 5, 1989 |
| 4853755 |
Method for manufacturing a thin-film transistor array and a thin-film transistor array manufactured by the method |
Aug. 1, 1989 |
| 4843034 |
Fabrication of interlayer conductive paths in integrated circuits |
Jun. 27, 1989 |
| 4808947 |
Integrated active filter without external components |
Feb. 28, 1989 |
| 4807002 |
Mesfet transistor with gate spaced above source electrode by layer of air or the like method of fabricating same |
Feb. 21, 1989 |
| 4807017 |
Semiconductor memory device with wirings having ensured cross-sections |
Feb. 21, 1989 |
| 4801999 |
Integrated circuit lead frame assembly containing voltage bussing and distribution to an integrated circuit die using tape automated bonding with two metal layers |
Jan. 31, 1989 |
| 4731700 |
Semiconductor connection and crossover apparatus |
Mar. 15, 1988 |
| 4724223 |
Method of making electrical contacts |
Feb. 9, 1988 |
| 4716452 |
Semiconductor integrated circuit device constructed by polycell technique |
Dec. 29, 1987 |
| 4712126 |
Low resistance tunnel |
Dec. 8, 1987 |
| 4673969 |
Semiconductor device having multiple conductive layers and the method of manufacturing the semiconductor device |
Jun. 16, 1987 |
| 4673966 |
Semiconductor integrated circuit |
Jun. 16, 1987 |
| 4658278 |
High density charge-coupled device imager and method of making the same |
Apr. 14, 1987 |
| 4613888 |
Semiconductor device of multilayer wiring structure |
Sep. 23, 1986 |
| 4611237 |
Semiconductor integrated circuit device |
Sep. 9, 1986 |
| 4605949 |
Semiconductor device with interdigitated electrodes |
Aug. 12, 1986 |
| 4594606 |
Semiconductor device having multilayer wiring structure |
Jun. 10, 1986 |
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