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Class Information
Number: 257/776
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Cross-over arrangement, component or structure
Description: Subject matter wherein means are provided for electrically insulating electrical contact elements or leads which cross each other to do so without a short circuit therebetween.


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14

Patent Number Title Of Patent Date Issued
5410179 Microwave component having tailored operating characteristics and method of tailoring Apr. 25, 1995
5410185 Internal bridging contact Apr. 25, 1995
5410182 High density semiconductor device having inclined chip mounting Apr. 25, 1995
5401687 Process for high density interconnection of substrates and integrated circuit chips containing sensitive structures Mar. 28, 1995
5391918 Semiconductor device Feb. 21, 1995
5391914 Diamond multilayer multichip module substrate Feb. 21, 1995
5391921 Semiconductor device having multi-level wiring Feb. 21, 1995
5387817 Dielectric isolation substrate having single-crystal silicon islands surrounded by groove and lower conductive layer filling the groove therewith Feb. 7, 1995
5378927 Thin-film wiring layout for a non-planar thin-film structure Jan. 3, 1995
5376819 Integrated circuit having an on chip thermal circuit requiring only one dedicated integrated circuit pin and method of operation Dec. 27, 1994
5373188 Packaged semiconductor device including multiple semiconductor chips and cross-over lead Dec. 13, 1994
5369302 Method to improve step coverage by contact reflow Nov. 29, 1994
5362984 Semiconductor device with jumping wire Nov. 8, 1994
5359226 Static memory with self aligned contacts and split word lines Oct. 25, 1994
5355008 Diamond shaped gate mesh for cellular MOS transistor array Oct. 11, 1994
5355004 Semiconductor integrated circuit device having wiring for clock signal supply Oct. 11, 1994
5343066 Semiconductor device and method of manufacturing same Aug. 30, 1994
5331203 High density interconnect structure including a chamber Jul. 19, 1994
5328520 Solar cell with low resistance linear electrode Jul. 12, 1994
5329162 Semiconductor device having a conductor layer provided over a semiconductor substrate Jul. 12, 1994
5321292 Voltage limiting device having improved gate-aided breakdown Jun. 14, 1994
5319237 Power semiconductor component Jun. 7, 1994
5317197 Semiconductor device May. 31, 1994
5315157 Semiconductor integrated circuit device having voltage level converting circuits May. 24, 1994
5311043 Bidirectional semiconductor switch with hybrid construction May. 10, 1994
5309015 Clock wiring and semiconductor integrated circuit device having the same May. 3, 1994
5309019 Low inductance lead frame for a semiconductor package May. 3, 1994
5300816 Semiconductor wafer with improved step coverage along scribe lines Apr. 5, 1994
5300798 Semiconductor integrated circuit device Apr. 5, 1994
5296742 Multilayered integrated circuit chip wiring arrangement Mar. 22, 1994
5294837 Semiconductor integrated circuit capable of correcting wiring skew Mar. 15, 1994
5289037 Conductor track configuration for very large-scale integrated circuits Feb. 22, 1994
5280188 Method of manufacturing a semiconductor integrated circuit device having at least one bipolar transistor and a plurality of MOS transistors Jan. 18, 1994
5245211 Device for the protection against breakdown of an N+ type diffused region inserted in vertical-type semiconductor integrated power structure Sep. 14, 1993
5241212 Semiconductor device having a redundant circuit portion and a manufacturing method of the same Aug. 31, 1993
5235200 Semiconductor integrated circuit device Aug. 10, 1993
5231302 Semiconductor device including an oblique surface and an electrode crossing the oblique surface Jul. 27, 1993
5229645 Semiconductor device and manufacturing method thereof Jul. 20, 1993
5210596 Thermally optimized interdigitated transistor May. 11, 1993
5208480 Dynamic latch circuit May. 4, 1993
5206536 Comb insert for semiconductor packaged devices Apr. 27, 1993
5202751 Semiconductor integrated circuit Apr. 13, 1993
5191397 SOI semiconductor device with a wiring electrode contacts a buried conductor and an impurity region Mar. 2, 1993
5189505 Flexible attachment flip-chip assembly Feb. 23, 1993
5179435 Resin sealed semiconductor integrated circuit device Jan. 12, 1993
5173574 Soldering connector and method for manufacturing an electric circuit with this soldering connector Dec. 22, 1992
5148260 Semiconductor device having an improved air-bridge lead structure Sep. 15, 1992
5119165 Semiconductor integrated circuit device using a planar structure with reduced bit line and word line resistance Jun. 2, 1992
5119164 Avoiding spin-on-glass cracking in high aspect ratio cavities Jun. 2, 1992
5119168 Semiconductor integrated circuit Jun. 2, 1992

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