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Class Information
Number: 257/776
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Combined with electrical contact or lead > Of specified configuration > Cross-over arrangement, component or structure
Description: Subject matter wherein means are provided for electrically insulating electrical contact elements or leads which cross each other to do so without a short circuit therebetween.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5670828 |
Tunneling technology for reducing intra-conductive layer capacitance |
Sep. 23, 1997 |
| 5650666 |
Method and apparatus for preventing cracks in semiconductor die |
Jul. 22, 1997 |
| 5646436 |
Read only memory (ROM) device produced by self-aligned implantation |
Jul. 8, 1997 |
| 5646450 |
Semiconductor structures and method of manufacturing |
Jul. 8, 1997 |
| 5637922 |
Wireless radio frequency power semiconductor devices using high density interconnect |
Jun. 10, 1997 |
| 5629556 |
High speed bipolar transistor using a patterned etch stop and diffusion source |
May. 13, 1997 |
| 5625234 |
Semiconductor memory device with bit line and select line arrangement maintaining parasitic capacitance in equilibrium |
Apr. 29, 1997 |
| 5625235 |
Multichip integrated circuit module with crossed bonding wires |
Apr. 29, 1997 |
| 5616936 |
Active matrix assembly with signal line crossing to equalize stray capacitance |
Apr. 1, 1997 |
| 5616961 |
Structure of contact between wiring layers in semiconductor integrated circuit device |
Apr. 1, 1997 |
| 5614762 |
Field effect transistors having comb-shaped electrode assemblies |
Mar. 25, 1997 |
| 5596230 |
Interconnection with self-aligned via plug |
Jan. 21, 1997 |
| 5596231 |
High power dissipation plastic encapsulated package for integrated circuit die |
Jan. 21, 1997 |
| 5591997 |
Low capacitance floating diffusion structure for a solid state image sensor |
Jan. 7, 1997 |
| 5587610 |
Semiconductor device having a conductive layer with an aperture |
Dec. 24, 1996 |
| 5585667 |
Lead frame for handling crossing bonding wires |
Dec. 17, 1996 |
| 5581098 |
Circuit routing structure using fewer variable masks |
Dec. 3, 1996 |
| 5581109 |
Semiconductor device |
Dec. 3, 1996 |
| 5581126 |
Interlaced layout configuration for differential pairs of interconnect lines |
Dec. 3, 1996 |
| 5567989 |
Highly integrated semiconductor wiring structure |
Oct. 22, 1996 |
| 5561327 |
Multilayer interconnection structure for a semiconductor device |
Oct. 1, 1996 |
| 5552607 |
Imager device with integral address line repair segments |
Sep. 3, 1996 |
| 5550401 |
Lead on chip semiconductor device having bus bars and crossing leads |
Aug. 27, 1996 |
| 5544095 |
Rom cell for a multiport memory and method |
Aug. 6, 1996 |
| 5539227 |
Multi-layer wiring |
Jul. 23, 1996 |
| 5536971 |
Semiconductor device having a hollow around a gate electrode and a method for producing the same |
Jul. 16, 1996 |
| 5534732 |
Single twist layout and method for paired line conductors of integrated circuits |
Jul. 9, 1996 |
| 5532506 |
Integrated circuit adapted for improved thermal impedance |
Jul. 2, 1996 |
| 5530290 |
Large scale IC personalization method employing air dielectric structure for extended conductor |
Jun. 25, 1996 |
| 5523625 |
Semiconductor integrated circuit device having partially constricted lower wiring for preventing upper wirings from short-circuit |
Jun. 4, 1996 |
| 5514832 |
Microcavity structures, fabrication processes, and applications thereof |
May. 7, 1996 |
| 5506450 |
Semiconductor device with improved electromigration resistance and method for making the same |
Apr. 9, 1996 |
| 5500557 |
Structure and method for fabricating integrated circuits |
Mar. 19, 1996 |
| 5489793 |
Semiconductor device having an evaluation device and method of fabricating same |
Feb. 6, 1996 |
| 5483104 |
Self-aligning contact and interconnect structure |
Jan. 9, 1996 |
| 5479038 |
Semiconductor device having a multilevel metallization |
Dec. 26, 1995 |
| 5477076 |
Integrated circuit having an on chip thermal circuit requiring only one dedicated integrated circuit pin and method of operation |
Dec. 19, 1995 |
| 5475268 |
Semiconductor device having an alignment mark |
Dec. 12, 1995 |
| 5473196 |
Semiconductor memory component comprising stacked memory modules |
Dec. 5, 1995 |
| 5471093 |
Pseudo-low dielectric constant technology |
Nov. 28, 1995 |
| 5461259 |
High-current integrated circuit |
Oct. 24, 1995 |
| 5459356 |
Power semiconductor module having a plurality of semiconductor arrangements |
Oct. 17, 1995 |
| 5455440 |
Method to reduce emitter-base leakage current in bipolar transistors |
Oct. 3, 1995 |
| 5455452 |
Semiconductor package having an LOC structure |
Oct. 3, 1995 |
| 5446300 |
Semiconductor device configuration with multiple HV-LDMOS transistors and a floating well circuit |
Aug. 29, 1995 |
| 5446311 |
High-Q inductors in silicon technology without expensive metalization |
Aug. 29, 1995 |
| 5426325 |
Metal crossover in high voltage IC with graduated doping control |
Jun. 20, 1995 |
| 5412239 |
Contact geometry for improved lateral MOSFET |
May. 2, 1995 |
| 5410179 |
Microwave component having tailored operating characteristics and method of tailoring |
Apr. 25, 1995 |
| 5410185 |
Internal bridging contact |
Apr. 25, 1995 |
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